Podcasts

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The Companion Guide to Optimize the InterconnectSM

This guide from MKS introduces the Optimize the InterconnectSM (OTI) approach, a unified methodology for forming reliable microvias in HDI PCBs and package substrates. By synchronizing surface treatment, laser drilling, and plating chemistry, OTI enhances via reliability, performance, and manufacturing efficiency. Key microvia quality metrics include dimensional precision, wall cleanliness, adhesion strength, and stress tolerance.

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EP 1:

OTI, or "Optimize the InterconnectSM," is a concept approach to producing higher quality, higher complexity PCB products. Chris Ryder, MKS Director of Business Development, introduces the concept and sets the stage for a more detailed discussion.