The Companion Guide to... Optimize the Interconnect^SM

This guide from MKS introduces the Optimize the Interconnect^SM (OTI) approach, a unified methodology for forming reliable microvias in HDI PCBs and package substrates. By synchronizing surface treatment, laser drilling, and plating chemistry, OTI enhances via reliability, performance, and manufacturing efficiency. Key microvia quality metrics include dimensional precision, wall cleanliness, adhesion strength, and stress tolerance.

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EP 6:

In a thoughtful conclusion to the series, Kuldip Johal connects the key themes, examining market drivers, the technological implications of semiconductor advances, and strategies for aligning PCB production with evolving market demands.

EP 5:

Patrick Brooks discusses the role of wet processes—in conjunction with laser systems—in delivering on the “Optimize the Interconnect” idea. One example is Bondfilm, a unique coating that allows CO2 lasers to more effectively ablate copper than ever before.

EP 4:

Laser via drilling is a critical process window for MKS's Optimize the Interconnect^SM concepts. Casey Kruger joins the podcast to explain exactly how the CO2 laser technology has been harnessed to create more accurate vias, faster, and in a smaller, more energy-efficient footprint.

EP 3:

MKS' Atotech's Frank Bruening and Roger Massey join us to discuss the emerging complexities in achieving optimal interconnect, and the key role chemistry plays. Their examples of the interplay between laser drilling, the chemical makeup of the substrate layers, and the plating process are worth a listen.

EP 2:

We continue our conversation with Chris Ryder on the Optimize the Interconnect^SM concept. Chris shares some specific examples, and details how and why industry leaders are adopting the OTI approach.

EP 1:

OTI, or "Optimize the Interconnect^SM," is a concept approach to producing higher quality, higher complexity PCB products. Chris Ryder, MKS Director of Business Development, introduces the concept and sets the stage for a more detailed discussion.