The Companion Guide to... Optimize the Interconnect^SM

This guide from MKS introduces the Optimize the Interconnect^SM (OTI) approach, a unified methodology for forming reliable microvias in HDI PCBs and package substrates. By synchronizing surface treatment, laser drilling, and plating chemistry, OTI enhances via reliability, performance, and manufacturing efficiency. Key microvia quality metrics include dimensional precision, wall cleanliness, adhesion strength, and stress tolerance.

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EP 3:

MKS' Atotech's Frank Bruening and Roger Massey join us to discuss the emerging complexities in achieving optimal interconnect, and the key role chemistry plays. Their examples of the interplay between laser drilling, the chemical makeup of the substrate layers, and the plating process are worth a listen.

EP 2:

We continue our conversation with Chris Ryder on the Optimize the Interconnect^SM concept. Chris shares some specific examples, and details how and why industry leaders are adopting the OTI approach.

EP 1:

OTI, or "Optimize the Interconnect^SM," is a concept approach to producing higher quality, higher complexity PCB products. Chris Ryder, MKS Director of Business Development, introduces the concept and sets the stage for a more detailed discussion.