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THE COMPANION GUIDE TO PCB 3.0: A New Design Methodology

The PCB design field is experiencing a dynamic shift characterized by an evolution of tools and materials, a revolution driven by AI and 3D printing, and an exodus as experienced designers retire. Amidst these changes, the demand for more efficient, cost-effective, and reliable PCB design processes is higher than ever. The Cadence® Allegro® X Design Platform empowers PCB designers to tackle complex challenges with a unified, collaborative approach. By leveraging intelligent system design, the platform enhances productivity, improves design quality, and accelerates time to market.

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EP 1:

To launch this series on integrated system design, we ask Cadence's Patrick Davis why we need to change how we design printed circuit boards in the first place. Davis explains how the interrelated shifts in design requirements are changing the methods we use.

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EP 2:

In this episode, our guests are Taylor Hogan and Patrick Davis. We discuss the role Artificial Intelligence (and Machine Learning) play in intelligent system design.



EP 3:

Patrick Davis returns to the podcast to talk about design rules. As design considerations become more and more complex, so too do the rulesets designers must abide by. But rather than seeing them as impossible sets of constraints, Davis shares a vision in which designers can maximize their creative efficiencies while relying on ever more complex design rules to keep everything straight.

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EP 4:

Cadence's Brad Griffin joins us in this episode where we discuss how an intelligent system design methodology can move some signal and power integrity decision making into the physical design space, offering real-time feedback.


EP 5:

In this episode, we continue the theme of bringing more decision-making power to the design process. This time, we're talking with Supreeth Mannava about bringing more "power" (and "signal") to the electrical engineer.


EP 6:

Product engineering expert Mark Hepburn joins the podcast to discuss the value of collaboration in the printed circuit board design and manufacturing cycle. Hepburn shares his views on how the latest data infrastructures are changing and enabling greater—and safer—data sharing.


EP 7:

Our series on Intelligent System Design continues with a discussion on integrating board data with mechanical data. Cadence's Vince DiLello joins us to remove the mystery of connecting PCB and mechanical design flows. DiLello explains the current state and describes what he sees in the future.