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PCB 3.0: A New Design Methodology.

The PCB design field is experiencing a dynamic shift characterized by an evolution of tools and materials, a revolution driven by AI and 3D printing, and an exodus as experienced designers retire. Amidst these changes, the demand for more efficient, cost-effective, and reliable PCB design processes is higher than ever. The Cadence® Allegro® X Design Platform empowers PCB designers to tackle complex challenges with a unified, collaborative approach. By leveraging intelligent system design, the platform enhances productivity, improves design quality, and accelerates time to market.


Brad Griffin is a product marketing group director in the System Analysis Group at Cadence Design Systems, Inc. He has over 25 years of experience in electronics design technologies that enable the design and analysis of integrated circuit packaging and printed circuit board systems for high performance applications such as datacenters, 5G, WiFi6, and 3D-IC. Griffin is a graduate of Arizona State University.

Cadence is a pivotal leader in electronic systems design, building upon more than 30 years of computational software expertise. The company applies its underlying Intelligent System Design strategy to deliver software, hardware and IP that turn design concepts into reality. Cadence customers are the world’s most innovative companies, delivering extraordinary electronic products from chips to boards to complete systems for the most dynamic market applications, including hyperscale computing, 5G communications, automotive, mobile, aerospace, consumer, industrial and healthcare. For seven years in a row, Fortune Magazine has named Cadence one of the 100 Best Companies to Work For. Learn more at cadence.com.
Learn more about the current problems in PCB design, how AI/ML will change how we design systems in the future, and how the Allegro X Design Platform can help in the I-Connect007 podcast, “On the Line With…Cadence—PCB 3.0: A New Design Methodology.” Listen Now

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