As PCB structures become denser, aspect ratios climb, and the margin for error gets smaller, fabricators are being pushed to rethink how they build the next generation of boards. Looking for ways to reduce process steps, their use of chemicals, water, and energy while generating less waste, manufacturers are finding new relevance in direct metallization, a technology that has been around for decades. In this episode of Meet the Author, Marcy LaRont talks with Carmichael Gugliotti, Line of Business Director for Primary Metallization at MacDermid Alpha Electronics Solutions and author of The Printed Circuit Designer’s Guide to Direct Metallization: A Guide to Complex PCB Fabrication. Gugliotti takes us inside graphite-based direct metallization, explaining how it works, where it can reduce process complexity and resource consumption compared with conventional electroless copper, and why the technology is attracting renewed attention.

TTCI's president, Bert Horner, discusses the "Butterfly Effect" of Design for Test in his new book, "The Printed Circuit Assembler's Guide to Design for Test." In his conversation with Nolan Johnson, Horner explains how planning for testability can pay huge dividends in reliability and profitability throughout the product's life cycle.

Authors Brian Chislea and Cody Schoener, PhD, share a conversation with Nolan Johnson on their latest book, "The Printed Circuit Designer's Guide to... UV Curable Conformal Coatings." Chislea and Schoener talk about why this book is so important now, and the advantages and applications for UV curable conformal coatings. Central to the discussion is how such coatings can simplify manufacturing, improve product reliability, and return valuable floor real estate.

Because solder formulations have been enjoying rapid development in the low-temperature solder arena, co-author Pritha Choudhury, senior R&D scientist with MacDermid Alpha Electronics Solutions, joins Nolan Johnson to discuss the update to The Printed Circuit Assembler's Guide to... Low-temperature Soldering, Volume 2. Topics covered include details on key performance traits in low-temperature solder, and Choudhury shares her recommended low-temperature soldering solution.

Beth Turner of MacDermid Alpha Electronic Solutions joins the podcast to discuss her book, The Printed Circuit Assembler's Guide to... Encapsulating Sustainability for Electronics. The conversation ranges from the most common encapsulation materials used, to when and why to use them. Turner points out that encapsulation materials are also experiencing a creative time with respect to both performance and sustainability. A must-read for anyone with a role in specifying or applying encapsulation materials.

Polar Instruments' Martyn Gaudion spills the tea on his third book, sharing more secrets for successful high-speed design.

Scott Miller and Brian White join host Nolan Johnson to discuss Miller's book, The Printed Circuit Designer's Guide to Executing Complex PCBs. Miller and White add insight to the seven key disciplines required by designers to successfully design complex PCBs. Of course, in this fast-moving industry, they also provide updated perspectives.

In this episode, my guests are Julie Cliche-Dubois, product manager at Cogiscan, and Andres Luna, general manager at Univertools. Univertools represents Cogiscan in Mexico. Julie is the author of the recently published book, "The Printed Circuit Assembler's Guide to... Factory Analytics.” In this episode, we're discussing the evolving role of data analytics, with an eye toward how analytics is driving meaningful action throughout the electronics manufacturing industry in Mexico and the rest of the Americas.