"Dr. Cardoso has given the industry a concise, comprehensive, and very readable quintessential primer on X-ray and its use in electronics assembly to a grateful industry."
Review from Eric Bogatin
"If you are new to designing circuit boards for 10 Gbps and above systems, or touch any part of the PCB supply chain, get a jump up the learning curve from the experience offered in this book from a respected industry expert."
Review from Kris Moyer, Instructor, IPC
"Whether you are new to PCB design or a seasoned designer with years of experience, this DFM book is an excellent resource. It covers many important concepts and informational topics to help ensure you achieve a successful, high-quality, high-yield PCB design the first time and every time."
Review from Kevin Byrd, Principal Engineer, Intel Corporation
"This book provides an excellent overview of both the history of low-temperature solders as well as the recent progress in this exciting surface mount technology. This information will prove valuable for those actively pursuing low-temperature solder conversion of their manufacturing processes as well as those working to understand the progress and future for the low-temperature solder materials."
Review from Alejandro Carrillo, Founder/General Manager, InterLatin
"Factory Analytics is great reading! Data analytics provides evidence of sustained performance and continuous improvement. This book also covers new tools like machine learning and how AI will bring new levels of factory analytics and efficiency."
Review from Jason Keeping, Global Process Subject Matter Expert, Celestica
"We live in a harsh world where protection is needed. Ruggedization is one of the fundamental processes that can help. This book provides a great summary of one of these key capabilities."
Review from John R. Watson, Legrand North America
"At a time when electronics are not just taking small steps but rather large leaps forward, this is an appropriate book for anyone working with PCB design. With countless and ever-changing steps involved in every design, it presents a clear understanding of the process. This book will be the go-to reference for all of our designers at Legrand North America."
Review from Gus Becerra, Principal Manufacturing Engineer, Marvell
"As fabrication and manufacturing technologies advance, it is necessary to evolve our methods to analyze and review designs. This book utilizes data-driven concepts in all aspects of the fabrication and assembly processes to improve design capabilities.
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Review from Christopher St. Mars, Process Engineer, Intervala
"This book offers an accurate look at the aspects and challenges the electronics manufacturing industry faces with regards to SMT Inspection and its surrounding technology. In-depth insight on new and exciting true 3D inspection technology is provided, with a look into the future of leveraging big data management and autonomous manufacturing for a smarter factory."
Review from Mike Cummings, Technical Director, TSI
"What I like about this book is it's not based on fear marketing; rather, it is an honest appraisal of a difficult decision companies have to make toward their product service life, based on the product field data and established and proven test processes."
Review from Steve Williams
"There is something here for everyone. I highly recommend downloading this book right away!"
Review from Duane Benson, Director of Marketing, Screaming Circuits
"I find that having a better understanding of the underlying process helps me create higher quality electronic designs. In this book, Matt Stevenson does a fantastic job of opening up the hood and giving the reader that knowledge of the PC board fab process."
Review from Nick Niculita, Engineering Manager, SRXGlobal
"This book is a must-read for everybody who wants to improve the overall design-through-manufacturing NPI phase and ultimately do more with less, the Holy Grail of any manufacturer."
Review from Kyle Burk, PhD, President and Director of Engineering for KBJ Engineering, LLC
"This textbook is a great addition and supplement to the first edition. It delves deeper into the science of insulated metal substrates and their useful, often overlooked, properties for proper thermal management."
Review from Joe Smetana, Principal Engineer, Advanced Technology, Nokia
"This is an excellent primer on stackup design for people who are doing high-speed PCB design. It connects the dots between signal integrity and manufacturing."
Review from Mark Thompson, Engineering Manager, Out of the Box
"I love this book. Particularly the sections on the effects of the glass weave, the history of laminate, and the difference between Dk and Effective Dk. I highly recommend this book for any designer or engineer looking to better understand laminate!"
Review from Joe O'Neil, Principal, OAA Ventures
"The Printed Circuit Assembler’s Guide to Solder Defects is an outstanding summary of the how’s and why’s of paste theory, defect causation and recommended best practices. This short read contains real world advice from the experts. I highly recommend it for anyone involved in the PCB Assembly process."
Review from Lee Ritchey, Founder and President, Speeding Edge
"Author Brad Griffin offers readers a very good explanation of system-level analysis of complex and high-speed electronic designs. I highly recommend this book for those who are getting started with the design of PCBs and systems that are used in data centers."
Review from Happy Holden, Consulting Technical Editor, I-Connect007
"This book provides good education, with examples and explanations to help the reader understand how the smart factory can improve performance and competitiveness."
Review from Dan Beaulieu, President, DB Management Group
"For those who are, shall we say, 'less technical' than others, it’s refreshing—not to mention face-saving, at times—to be able to understand terms like insulated metal-clad PCBs (IMPCBs), metal-clad PCBs (MCPCBs) and mixed-technology PCBs."
Review from Dr. Lothar Henneken, Sr. Expert and Six Sigma Blackbelt, Robert Bosch GmbH
"A must-read for everyone who wants to deal responsibly with the subject of humidity robustness and electrochemical reliability of electronics with the now new, valid state of the art for material and process qualification.
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Review from Farid Anani, VP of Operations, Computrol Inc.
"This book is a must-read for those embarking on their IIoT journey; it provides a very accurate description of preparation requirements and risks to consider and avoid, not just technologically, but also organizationally."
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Review from Kelly Dack, CIT, CID+ PCB Designer, Instructor & Manufacturing Liaison
"This book explains how information embedded in a PCB design layout database can be leveraged to efficiently and dynamically output more accurate PCB design documentation."
Review from Alex Stepinski, vice president, GreenSource Fabrication
"Happy takes a textbook-style approach using easy-to-follow language. He provides step-by-step points for the DIYer, especially for making your own chemistry controllers, while providing examples from his past experiences.
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Review from Kelly Dack, CID+, CIT, EPTAC Corporation
"Mark Thompson is not afraid to ask for what he needs from a customer to start a job with the end in sight. In fact, he does the industry one better in this book by telling you what a PCB fabricator needs to get the complex job done right. Much appreciated!
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Review from Happy Holden, Consulting Technical Editor, I-Connect007
"I found this book to be very educational and informative. I agree with the authors that there are many advantages to using an LMP solder paste when it comes to improving the assembly and field reliability of complex HDI structures. I was particularly interested in their look at advanced density packaging for PoP and SiP, as these are rising packaging trends."
Review from Alun Morgan, Chairman, EIPC
" A comprehensive tour through the world of thermal management. Required reading for designers and end users wishing to understand the science and practice of using insulated metal substrate materials."
Review from Darren Smith, founding principal at AthenaTech
"A very thorough how-to that informs and enhances your project's ROI. Critical for designers new to RF layout or combining multiple impedance environments."
Review from Gene Garat, President, Moss Bay EDA
"Engineers new to the field as well as career veterans can all benefit from this quick read, well-illustrated with plenty of examples."
Review from Dr. Helmut Schweigart, Technology Development Head, Zestron Europe.
"This micro eBook offers a comfortable approach to the selection, implementation, and testing of protective coating processes. It would be especially helpful for starters to use as a checklist for operational implementation."
Review from Eric Bogatin
"If you care about signal integrity, you are sure to pick up a few nuggets of insight from this new eBook."
Review from Happy Holden
"Martyn Gaudion of Polar has taken the extremely complex topic of signal integrity and provided an easy to understand explanation of this phenomena. I encourage everyone to download and read this engaging e-book."
Review from Tom Borkes, Founder, The Jefferson Project
"Mr. Fjelstad has dared to think outside the box. The result is a very readable exposition in logic, posing and answering a basic question: Why do interconnect electronics with solder? Socrates would be proud!"
Review from Rick Hartley
"This book offers the greatest benefit to design and procurement people by helping them understand what can realistically be achieved in the final product."
Review from Andy Shaughnessy
"This may be the single best source of info about the AS9100 certification. Easy to digest yet full of details, it’s all here: from start to finish..."