If you’re a PCB designer or design engineer, chances are you’re probably dealing with high-speed PCBs and their attendant issues. This book is a must-read not just for designers, but for anyone involved with, or confused by, high-speed PCBs: purchasing agents, salespeople, marketing professionals, recent graduates, etc.
This micro eBook is a compilation of columns written by Martyn Gaudion, CEO of Polar Instruments, for The PCB Design Magazine over several years. Martyn examines complex signal integrity challenges, modelling and measurement issues, transmission line theory, the effects of glass weave on signal integrity, and much more.
ISBN: 978-0-9796189-6-3
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Polar Instruments specializes in designing EDA and measurement tools which simplify the design, fabrication, testing and specification of high-speed printed circuit boards (PCBs). Polar’s innovative product line includes the industry standard Controlled Impedance Test System (CITS), which provides the global PCB industry with an easy-to- use test system for high-speed digital and RF boards, as well as class-leading tools for fast and accurate design and testing of impedance and insertion loss controlled PCBs. Polar Speedstack is the layer stack-up design and documentation tool of choice for many designers, fabricators and PCB technologists. Established in 1976, Polar Instruments now has operations and long term channel partners in the US, UK, Europe and Asia Pacific.
Related Video:
Rick Hartley Principal, RHartley Enterprises
Rick Hartley is the principal of RHartley Enterprises, through which he consults and teaches internationally. Hartley’s focus is on the correct design of circuits and PC boards to prevent and/or resolve EMI, noise, and signal integrity problems. His career has focused on telecommunications, [...]
Eric Bogatin Dean, Signal Integrity Academy
Professor Bogatin has a BS in physics from MIT and an MS and PhD in physics from the University of Arizona. He has worked in various industry roles, including senior engineering and management positions at Bell Labs, Raychem, Sun Microsystems, Ansoft, and Interconnect Devices.
Chapter Summaries
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Chapter 1
Chapter 1
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Chapter 2
Chapter 2
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Chapter 3
Chapter 3
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Chapter 4
Chapter 4
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Chapter 5
Chapter 5
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Chapter 6
Chapter 6
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Chapter 7
Chapter 7
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Chapter 8
Chapter 8
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Chapter 9
Chapter 9