There are many factors to consider when aiming to establish and maintain power integrity, from cavity thickness to the presence or absence of a voltage regulator.
Written by signal/power integrity specialist Fadi Deek of Mentor, A Siemens Business, this micro eBook provides a thorough investigation of power distribution network performance. Deek addresses problematic issues within electronic transmissions, and presents a variety of simulations and analyses in every chapter.
After you've read this eBook, you will better understand cause-effect relationships between varying factors and how to consider these when making design decisions.
ISBN: 978-0-9982885-7-4
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Mentor, A Siemens Business, is a world leader in electronic hardware and software design solutions providing products, consulting services, and award-winning support for the world’s most successful electronic, semiconductor, and systems companies. We enable companies to develop better electronic products faster and more cost-effectively. Our innovative products and solutions help engineers conquer design challenges in the increasingly complex worlds of board and chip design. Corporate headquarters are located at 8005 S.W. Boeckman Road, Wilsonville, Oregon 97070-7777. Website: www.mentor.com.
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One of the most common outputs from a DC Drop simulation is a current density plot. But how much is too much current density? The answer depends on temperature rise, and requires a PI-Thermal co-simulation to properly characterize. With HyperLynx PI you can quickly pinpoint problems in your PCB's power distribution network.
Eric Bogatin Dean, Signal Integrity Academy
Professor Bogatin has a BS in physics from MIT and an MS and PhD in physics from the University of Arizona. He has worked in various industry roles, including senior engineering and management positions at Bell Labs, Raychem, Sun Microsystems, Ansoft, and Interconnect Devices.
Consulting Technical Editor, Happy Holden
I-Connect007
Happy Holden is the retired director of electronics and innovations for GENTEX Corporation. Formerly, he was the chief technical officer for the world’s largest PCB fabricator—Hon Hai Precision Industries (Foxconn). Prior to Foxconn, Holden was the senior PCB technologist for Mentor Graphics and [...]
Chapter Summaries
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Chapter 1
Chapter 1: Bare Cavity
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Chapter 2
Chapter 2: Decoupling Capacitor and VRM Effects
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Chapter 3
Chapter 3: Transparent Cavity
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Chapter 4
Chapter 4: Cavity Noise and Via-to-Via Coupling
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Chapter 5
Chapter 5: Reducing Via-to-Via Coupling Using Capacitors