Via Structures: Reflow Process Survivability, Reliability, and Robustness


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Direct Metallization: A Guide to Complex PCB Fabrication


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Design for Test: A Practical Guide to Test and Inspection


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UV Curable Conformal Coatings


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X-ray Inspection


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More Secrets of High-speed PCBs


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DFM Essentials


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Bonus: Companion Guide

Low-temperature Soldering, Vol. 2


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Factory Analytics


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Encapsulating Sustainability for Electronics


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Executing Complex PCBs


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Bonus: Audio Book

IPC Checklist for Printed Board Assemblies

Manufacturing Driven Design


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SMT Inspection: Today, Tomorrow, and Beyond


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Bonus: Companion Guide

Bonus: Companion Guide 2

Process Control


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Flex and Rigid-Flex Fundamentals


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Bonus: Companion Guide

Designing for Reality


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Related Podcast

The Evolving PCB NPI Process


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Thermal Management with Insulated Metal Substrates, Volume 2


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Bonus: Companion Guide

Stackups: The Design within the Design

Related - High Performance Materials
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High Performance Materials

Related - Stackups: The Design within the Design
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Solder Defects


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24 Essential Skills for Engineers

System Analysis


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Bonus: Companion Guide

Smart Data: Using Data to Improve Manufacturing


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Thermal Management: A Fabricator's Perspective


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Process Validation


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Advanced Manufacturing in the Digital Age


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Assessing Your PCB Documentation Process


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Automation and Advanced Procedures in PCB Fabrication


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Producing the Perfect Data Package


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Low-Temperature Soldering


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Thermal Management with Insulated Metal Substrates


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Fundamentals of RF/Microwave PCBs


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Power Integrity by Example


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Signal Integrity by Example


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Secrets of High-Speed PCBs, Part 2


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Solderless Assembly for Electronics: The SAFE Approach


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Secrets of High-Speed PCBs, Part 1


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AS9100 Certification


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PIHR Technology

Survival Is Not Mandatory

The HDI Handbook

Flexible Circuit Technology, 4th Edition

Review from Dennis Fritz, Fritz Consulting

Dennis Fritz, Fritz Consulting

"If you are looking to better understand the factors that influence long-term microvia performance and PCB quality, read this book."

Review from Mike Carano, Consultant, Global Electronics Association

Mike Carano, Consultant, Global Electronics Association

"Sustainability and reliability go hand in hand in printed circuit board fabrication."

Review from William E. Webb, Technical Director, Aster Technologies

William E. Webb, Technical Director, Aster Technologies

"Even experienced test professionals will gain valuable insights and fresh perspectives from his expertise.."

Review from Jason Keeping, Celestica

Jason Keeping, Celestica

"A great read on materials and processes that help electronics succeed in harsher conditions."

Review from Gary Korkala

Gary Korkala

"The Printed Circuit Assembler's Guide to... X-ray Inspection is a must read for those engaged in the radiographic inspection of electronic components. It provides a clear, concise description of the X-ray process and includes a comprehensive number of comparative images."

Review from Eric Bogatin

Eric Bogatin

"If you are new to designing circuit boards for 10 Gbps and above systems, or touch any part of the PCB supply chain, get a jump up the learning curve from the experience offered in this book from a respected industry expert."

Review from Dana Korf, Principal Consultant, Korf Consultancy LLC

Dana Korf, Principal Consultant, Korf Consultancy LLC

"This book covers essential design considerations to ensure PCB manufacturability. These features impact the overall PCB quality, reliability, and cost-effectiveness. Good practical size and tolerance guidelines are also provided for the designer to meet specifications while yielding the lowest cost. I recommend this for new designers, especially before formal training. Additionally, it’s suitable for school students as part of their science curriculum."

Review from Kevin Byrd, Principal Engineer, Intel Corporation

Kevin Byrd, Principal Engineer, Intel Corporation

"This book provides an excellent overview of both the history of low-temperature solders as well as the recent progress in this exciting surface mount technology. This information will prove valuable for those actively pursuing low-temperature solder conversion of their manufacturing processes as well as those working to understand the progress and future for the low-temperature solder materials."

Review from Alejandro Carrillo, Founder/General Manager, InterLatin

Alejandro Carrillo, Founder/General Manager, InterLatin

"Factory Analytics is great reading! Data analytics provides evidence of sustained performance and continuous improvement. This book also covers new tools like machine learning and how AI will bring new levels of factory analytics and efficiency."

Review from Dr. Helmut Schweigart, Head of Reliablility & Surfaces, Zestron Europe.

Dr. Helmut Schweigart, Head of Reliablility & Surfaces, Zestron Europe.

"Readers will learn the advantages and disadvantages of different encapsulation materials and the importance of the application process. In order to find the right balance between benefit and effort, the author suggests using analytical approaches to configure the process and its settings. Additionally, she is always conscious of the need for sustainability when it comes to electronic assemblies."

Review from Stephen V. Chavez, IPC Designers Council

Stephen V. Chavez, IPC Designers Council

"This is a great resource for those who wish to gain a better understanding of all that it takes to design a complex PCB/CCA in today’s ever-evolving industry. For a designer, challenges always include layout solvability, electrical integrity, and manufacturability. The goal is making revision one work. I refer to this as ‘The Designer’s Triangle’."

Review from Ammar Abusham, DFM Integration Engineer (AR EE Team), Meta Reality Labs

Ammar Abusham, DFM Integration Engineer (AR EE Team), Meta Reality Labs

"This book effectively addresses the need for early integration of manufacturing elements into the design process. In an industry racing against time, MDD is the key to staying ahead. "

Review from Christopher St. Mars, Process Engineer, Intervala

Christopher St. Mars, Process Engineer, Intervala

"This book offers an accurate look at the aspects and challenges the electronics manufacturing industry faces with regards to SMT Inspection and its surrounding technology. In-depth insight on new and exciting true 3D inspection technology is provided, with a look into the future of leveraging big data management and autonomous manufacturing for a smarter factory."

Review from Mike Cummings, Technical Director, TSI

Mike Cummings, Technical Director, TSI

"What I like about this book is it's not based on fear marketing; rather, it is an honest appraisal of a difficult decision companies have to make toward their product service life, based on the product field data and established and proven test processes."

Review from Dan Beaulieu

Dan Beaulieu

"A "must-have" guidebook for everyone involved in Flex technology."

Review from Duane Benson, Director of Marketing, Screaming Circuits

Duane Benson, Director of Marketing, Screaming Circuits

"I find that having a better understanding of the underlying process helps me create higher quality electronic designs. In this book, Matt Stevenson does a fantastic job of opening up the hood and giving the reader that knowledge of the PC board fab process."

Review from Nick Niculita, Engineering Manager, SRXGlobal

Nick Niculita, Engineering Manager, SRXGlobal

"This book is a must-read for everybody who wants to improve the overall design-through-manufacturing NPI phase and ultimately do more with less, the Holy Grail of any manufacturer."

Review from Kyle Burk, PhD, President and Director of Engineering for KBJ Engineering, LLC

Kyle Burk, PhD, President and Director of Engineering for KBJ Engineering, LLC

"This textbook is a great addition and supplement to the first edition. It delves deeper into the science of insulated metal substrates and their useful, often overlooked, properties for proper thermal management."

Review from Skyler Sopp, SI/PI Engineer, Mercury Systems

Skyler Sopp, SI/PI Engineer, Mercury Systems

"Regardless of where you are in your stackup knowledge, I recommend downloading the book and reading it! It will be well worth your time and may just save you future headaches."

Review from Mark Thompson, Engineering Manager, Out of the Box

Mark Thompson, Engineering Manager, Out of the Box

"I love this book. Particularly the sections on the effects of the glass weave, the history of laminate, and the difference between Dk and Effective Dk. I highly recommend this book for any designer or engineer looking to better understand laminate!"

Review from Joe O'Neil, Principal, OAA Ventures

Joe O'Neil, Principal, OAA Ventures

"The Printed Circuit Assembler’s Guide to Solder Defects is an outstanding summary of the how’s and why’s of paste theory, defect causation and recommended best practices. This short read contains real world advice from the experts. I highly recommend it for anyone involved in the PCB Assembly process."

Review from Lee Ritchey, Founder and President, Speeding Edge

Lee Ritchey, Founder and President, Speeding Edge

"Author Brad Griffin offers readers a very good explanation of system-level analysis of complex and high-speed electronic designs. I highly recommend this book for those who are getting started with the design of PCBs and systems that are used in data centers."

Review from Marius Stepanescu, Technical Director, ICCO EMT

Marius Stepanescu, Technical Director, ICCO EMT

"The Printed Circuit Assembler's Guide to... Smart Data explains the role of data acquisition and analytics in Industry 4.0. This book provides a very good description of the main challenges of collecting and handling smart data and analyzing it in the proper way."

Review from Dr. Johannes Adam, Consultant, ADAM Research

Dr. Johannes Adam, Consultant, ADAM Research

"If you want to know what measures you can take to keep your PCB cool, you need to read this book. The technologies and manufacturing processes for thermal management are summarized and presented in a unique way. "

Review from Dr. Lothar Henneken, Sr. Expert and Six Sigma Blackbelt, Robert Bosch GmbH

Dr. Lothar Henneken, Sr. Expert and Six Sigma Blackbelt, Robert Bosch GmbH

"A must-read for everyone who wants to deal responsibly with the subject of humidity robustness and electrochemical reliability of electronics with the now new, valid state of the art for material and process qualification. "

Review from Farid Anani, VP of Operations, Computrol Inc.

Farid Anani, VP of Operations, Computrol Inc.

"This book is a must-read for those embarking on their IIoT journey; it provides a very accurate description of preparation requirements and risks to consider and avoid, not just technologically, but also organizationally." "

Review from Kelly Dack, CIT, CID+ PCB Designer, Instructor & Manufacturing Liaison

Kelly Dack, CIT, CID+ PCB Designer, Instructor & Manufacturing Liaison

"This book explains how information embedded in a PCB design layout database can be leveraged to efficiently and dynamically output more accurate PCB design documentation."

Review from Alex Stepinski, vice president, GreenSource Fabrication

Alex Stepinski, vice president, GreenSource Fabrication

"Happy takes a textbook-style approach using easy-to-follow language. He provides step-by-step points for the DIYer, especially for making your own chemistry controllers, while providing examples from his past experiences. "

Review from Dan Beaulieu, president, D.B. Management

Dan Beaulieu, president, D.B. Management

"If you are serious about creating the best, most perfect data packages available today, do yourself a favor. Download and read this book. It’s simple—the better the package, the better the board. "

Review from Raiyo Aspandiar, Ph.D., Senior Engineer, Intel Corporation

Raiyo Aspandiar, Ph.D., Senior Engineer, Intel Corporation

"This book does a good job of distilling out the chaff and focusing on the most relevant, valuable information available, including main drivers for the current worldwide interest in low-temperature soldering, the history of solder paste alloys and flux developments, as well as various applications for these materials."

Review from Alun Morgan, Chairman, EIPC

Alun Morgan, Chairman, EIPC

" A comprehensive tour through the world of thermal management. Required reading for designers and end users wishing to understand the science and practice of using insulated metal substrate materials."

Review from Mike Carano, VP of technology and business development at RBP Chemical Technology

Mike Carano, VP of technology and business development at RBP Chemical Technology

"The definitive guide to navigating the unique challenges one faces when fabricating RF printed circuit boards."

Review from Gene Garat, President, Moss Bay EDA

Gene Garat, President, Moss Bay EDA

"Engineers new to the field as well as career veterans can all benefit from this quick read, well-illustrated with plenty of examples."

Review from Eric Bogatin

Eric Bogatin

"If you care about signal integrity, you are sure to pick up a few nuggets of insight from this new eBook."

Review from Bert Simonovich, Consultant & Founder, LAMSIM Enterprises Inc.

Bert Simonovich, Consultant & Founder, LAMSIM Enterprises Inc.

"I wish I had these books when I was starting out in my career."

Review from Dan Beaulieu

Dan Beaulieu

"Joe Fjelstad does a great job of explaining the ins and outs of this process, as well as the numerous prospective advantages and some possible caveats. "

Review from Rick Hartley

Rick Hartley

"This book offers the greatest benefit to design and procurement people by helping them understand what can realistically be achieved in the final product."

Review from Andy Shaughnessy

Andy Shaughnessy

"This may be the single best source of info about the AS9100 certification. Easy to digest yet full of details, it’s all here: from start to finish..."