Direct Metallization: A Guide to Complex PCB Fabrication


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Design for Test: A Practical Guide to Test and Inspection


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UV Curable Conformal Coatings


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X-ray Inspection


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More Secrets of High-speed PCBs


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DFM Essentials


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Bonus: Companion Guide

Low-temperature Soldering, Vol. 2


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Factory Analytics


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Encapsulating Sustainability for Electronics


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Executing Complex PCBs


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Bonus: Audio Book

IPC Checklist for Printed Board Assemblies

Manufacturing Driven Design


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SMT Inspection: Today, Tomorrow, and Beyond


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Bonus: Companion Guide

Bonus: Companion Guide 2

Process Control


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Flex and Rigid-Flex Fundamentals


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Bonus: Companion Guide

Designing for Reality


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Related Podcast

The Evolving PCB NPI Process


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Thermal Management with Insulated Metal Substrates, Volume 2


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Bonus: Companion Guide

Stackups: The Design within the Design

Related - High Performance Materials
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High Performance Materials

Related - Stackups: The Design within the Design
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Solder Defects


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24 Essential Skills for Engineers

System Analysis


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Bonus: Companion Guide

Smart Data: Using Data to Improve Manufacturing


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Thermal Management: A Fabricator's Perspective


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Process Validation


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Advanced Manufacturing in the Digital Age


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Assessing Your PCB Documentation Process


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Automation and Advanced Procedures in PCB Fabrication


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Producing the Perfect Data Package


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Low-Temperature Soldering


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Thermal Management with Insulated Metal Substrates


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Fundamentals of RF/Microwave PCBs


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Power Integrity by Example


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Signal Integrity by Example


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Secrets of High-Speed PCBs, Part 2


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Solderless Assembly for Electronics: The SAFE Approach


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Secrets of High-Speed PCBs, Part 1


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AS9100 Certification


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PIHR Technology

Survival Is Not Mandatory

The HDI Handbook

Flexible Circuit Technology, 4th Edition

Review from Venkat Raja, President & Founder, Advint, Inc.

Venkat Raja, President & Founder, Advint, Inc.

"Gugliotti provides the critical technical validation required to transition from conventional electroless copper to the proven reliability of direct copper-to-copper bonding."

Review from Tamara Jovanovic, Electronics Engineer, Masimo

Tamara Jovanovic, Electronics Engineer, Masimo

"This book clearly explains why Design for Test is essential to product and business success."

Review from Jason Keeping, Celestica

Jason Keeping, Celestica

"A great read on materials and processes that help electronics succeed in harsher conditions."

Review from Gary Korkala

Gary Korkala

"The Printed Circuit Assembler's Guide to... X-ray Inspection is a must read for those engaged in the radiographic inspection of electronic components. It provides a clear, concise description of the X-ray process and includes a comprehensive number of comparative images."

Review from Eric Bogatin

Eric Bogatin

"If you are new to designing circuit boards for 10 Gbps and above systems, or touch any part of the PCB supply chain, get a jump up the learning curve from the experience offered in this book from a respected industry expert."

Review from Dana Korf, Principal Consultant, Korf Consultancy LLC

Dana Korf, Principal Consultant, Korf Consultancy LLC

"This book covers essential design considerations to ensure PCB manufacturability. These features impact the overall PCB quality, reliability, and cost-effectiveness. Good practical size and tolerance guidelines are also provided for the designer to meet specifications while yielding the lowest cost. I recommend this for new designers, especially before formal training. Additionally, it’s suitable for school students as part of their science curriculum."

Review from Richard Coyle, Consulting Member of Technical Staff, Nokia Bell Labs

Richard Coyle, Consulting Member of Technical Staff, Nokia Bell Labs

"Readers will find this book provides technical insights into the ever-evolving challenges of the assembly and reliability of low-temperature solder alloys. This second volume includes updates on fourth-generation low-temperature solders and a preview of the capabilities of ultra-low temperature (ULT) solders."

Review from Jason Sciberras, President, Saline Lectronics Division of Emerald Technologies

Jason Sciberras, President, Saline Lectronics Division of Emerald Technologies

"I would recommend that any data-driven engineers focused on taking their manufacturing operations to the next level read this book."

Review from Jason Keeping, Global Process Subject Matter Expert, Celestica

Jason Keeping, Global Process Subject Matter Expert, Celestica

"We live in a harsh world where protection is needed. Ruggedization is one of the fundamental processes that can help. This book provides a great summary of one of these key capabilities."

Review from Stephen V. Chavez, IPC Designers Council

Stephen V. Chavez, IPC Designers Council

"This is a great resource for those who wish to gain a better understanding of all that it takes to design a complex PCB/CCA in today’s ever-evolving industry. For a designer, challenges always include layout solvability, electrical integrity, and manufacturability. The goal is making revision one work. I refer to this as ‘The Designer’s Triangle’."

Review from Gus Becerra, Principal Manufacturing Engineer, Marvell

Gus Becerra, Principal Manufacturing Engineer, Marvell

"As fabrication and manufacturing technologies advance, it is necessary to evolve our methods to analyze and review designs. This book utilizes data-driven concepts in all aspects of the fabrication and assembly processes to improve design capabilities. "

Review from Christopher St. Mars, Process Engineer, Intervala

Christopher St. Mars, Process Engineer, Intervala

"This book offers an accurate look at the aspects and challenges the electronics manufacturing industry faces with regards to SMT Inspection and its surrounding technology. In-depth insight on new and exciting true 3D inspection technology is provided, with a look into the future of leveraging big data management and autonomous manufacturing for a smarter factory."

Review from Mike Cummings, Technical Director, TSI

Mike Cummings, Technical Director, TSI

"What I like about this book is it's not based on fear marketing; rather, it is an honest appraisal of a difficult decision companies have to make toward their product service life, based on the product field data and established and proven test processes."

Review from Tara Dunn

Tara Dunn

"This book is a terrific resource for both those new to flex design and those more experienced looking to streamline the design to fabrication transition."

Review from Duane Benson, Director of Marketing, Screaming Circuits

Duane Benson, Director of Marketing, Screaming Circuits

"I find that having a better understanding of the underlying process helps me create higher quality electronic designs. In this book, Matt Stevenson does a fantastic job of opening up the hood and giving the reader that knowledge of the PC board fab process."

Review from Nick Niculita, Engineering Manager, SRXGlobal

Nick Niculita, Engineering Manager, SRXGlobal

"This book is a must-read for everybody who wants to improve the overall design-through-manufacturing NPI phase and ultimately do more with less, the Holy Grail of any manufacturer."

Review from Kyle Burk, PhD, President and Director of Engineering for KBJ Engineering, LLC

Kyle Burk, PhD, President and Director of Engineering for KBJ Engineering, LLC

"This textbook is a great addition and supplement to the first edition. It delves deeper into the science of insulated metal substrates and their useful, often overlooked, properties for proper thermal management."

Review from Bert Simonovich, Consultant & Founder, LAMSIM Enterprises Inc.

Bert Simonovich, Consultant & Founder, LAMSIM Enterprises Inc.

"From novice board designers to experienced signal integrity engineers, this book has something for everyone involved with PCB stackups. A must-read for anyone having to work with PCB fab shops"

Review from Mark Thompson, Engineering Manager, Out of the Box

Mark Thompson, Engineering Manager, Out of the Box

"I love this book. Particularly the sections on the effects of the glass weave, the history of laminate, and the difference between Dk and Effective Dk. I highly recommend this book for any designer or engineer looking to better understand laminate!"

Review from Joe O'Neil, Principal, OAA Ventures

Joe O'Neil, Principal, OAA Ventures

"The Printed Circuit Assembler’s Guide to Solder Defects is an outstanding summary of the how’s and why’s of paste theory, defect causation and recommended best practices. This short read contains real world advice from the experts. I highly recommend it for anyone involved in the PCB Assembly process."

Review from Lee Ritchey, Founder and President, Speeding Edge

Lee Ritchey, Founder and President, Speeding Edge

"Author Brad Griffin offers readers a very good explanation of system-level analysis of complex and high-speed electronic designs. I highly recommend this book for those who are getting started with the design of PCBs and systems that are used in data centers."

Review from Happy Holden, Consulting Technical Editor, I-Connect007

Happy Holden, Consulting Technical Editor, I-Connect007

"This book provides good education, with examples and explanations to help the reader understand how the smart factory can improve performance and competitiveness."

Review from Denis Boulanger, Principal Manufacturing Engineer, Raytheon Technologies

Denis Boulanger, Principal Manufacturing Engineer, Raytheon Technologies

"This book provides a comprehensive look at thermal management and PCB design issues from the fabricator’s perspective. I am glad that it exists now that I have 'gone over to the dark side,' where I am a consumer rather than a fabricator and/or material supplier. "

Review from Mike Cummings, Technical Director, TSI

Mike Cummings, Technical Director, TSI

"Well-written and easy to follow, this dedicated book focuses on the importance of cleaning and decontamination of electronic circuits before application. This topic is timely and important, considering the increasing importance of high-reliability electronics, security, and safety in an increasingly connected world. "

Review from Farid Anani, VP of Operations, Computrol Inc.

Farid Anani, VP of Operations, Computrol Inc.

"This book is a must-read for those embarking on their IIoT journey; it provides a very accurate description of preparation requirements and risks to consider and avoid, not just technologically, but also organizationally." "

Review from Kelly Dack, CIT, CID+ PCB Designer, Instructor & Manufacturing Liaison

Kelly Dack, CIT, CID+ PCB Designer, Instructor & Manufacturing Liaison

"This book explains how information embedded in a PCB design layout database can be leveraged to efficiently and dynamically output more accurate PCB design documentation."

Review from Alex Stepinski, vice president, GreenSource Fabrication

Alex Stepinski, vice president, GreenSource Fabrication

"Happy takes a textbook-style approach using easy-to-follow language. He provides step-by-step points for the DIYer, especially for making your own chemistry controllers, while providing examples from his past experiences. "

Review from Douglas Brooks, retired engineer, Ph.D.

Douglas Brooks, retired engineer, Ph.D.

"Mark does an outstanding job detailing what needs to be included in the handoff between the board designer and fabricator. Understanding and following his advice will lead to a smooth transition between these two functions. His new book should be required reading for every designer. "

Review from Happy Holden, Consulting Technical Editor, I-Connect007

Happy Holden, Consulting Technical Editor, I-Connect007

"I found this book to be very educational and informative. I agree with the authors that there are many advantages to using an LMP solder paste when it comes to improving the assembly and field reliability of complex HDI structures. I was particularly interested in their look at advanced density packaging for PoP and SiP, as these are rising packaging trends."

Review from Alun Morgan, Chairman, EIPC

Alun Morgan, Chairman, EIPC

" A comprehensive tour through the world of thermal management. Required reading for designers and end users wishing to understand the science and practice of using insulated metal substrate materials."

Review from Judy Warner, director of community engagement at Altium

Judy Warner, director of community engagement at Altium

"This concise, yet very thorough eBook is destined to become every RF and microwave engineer's PCB fabrication bible. ASC shares every key aspect to successfully fabricate these incredibly challenging boards."

Review from Gene Garat, President, Moss Bay EDA

Gene Garat, President, Moss Bay EDA

"Engineers new to the field as well as career veterans can all benefit from this quick read, well-illustrated with plenty of examples."

Review from Eric Bogatin

Eric Bogatin

"If you care about signal integrity, you are sure to pick up a few nuggets of insight from this new eBook."

Review from Bert Simonovich, Consultant & Founder, LAMSIM Enterprises Inc.

Bert Simonovich, Consultant & Founder, LAMSIM Enterprises Inc.

"I wish I had these books when I was starting out in my career."

Review from Tom Borkes, Founder, The Jefferson Project

Tom Borkes, Founder, The Jefferson Project

"Mr. Fjelstad has dared to think outside the box. The result is a very readable exposition in logic, posing and answering a basic question: Why do interconnect electronics with solder? Socrates would be proud!"

Review from Eric Bogatin

Eric Bogatin

"The Printed Circuit Designer's Guide to... Secrets of High-Speed PCBs, Part 1 pulls back the covers to illustrate the practical principles behind many of the confusing topics that arise in the overlap between manufacturing, materials, and signal integrity performance."

Review from Andy Shaughnessy

Andy Shaughnessy

"This may be the single best source of info about the AS9100 certification. Easy to digest yet full of details, it’s all here: from start to finish..."