Via Structures: Reflow Process Survivability, Reliability, and Robustness


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Direct Metallization: A Guide to Complex PCB Fabrication


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Design for Test: A Practical Guide to Test and Inspection


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UV Curable Conformal Coatings


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X-ray Inspection


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More Secrets of High-speed PCBs


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DFM Essentials


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Bonus: Companion Guide

Low-temperature Soldering, Vol. 2


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Factory Analytics


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Encapsulating Sustainability for Electronics


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Executing Complex PCBs


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Bonus: Audio Book

IPC Checklist for Printed Board Assemblies

Manufacturing Driven Design


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SMT Inspection: Today, Tomorrow, and Beyond


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Bonus: Companion Guide

Bonus: Companion Guide 2

Process Control


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Flex and Rigid-Flex Fundamentals


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Bonus: Companion Guide

Designing for Reality


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Bonus: Companion Guide

Related Podcast

The Evolving PCB NPI Process


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Thermal Management with Insulated Metal Substrates, Volume 2


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Bonus: Companion Guide

Stackups: The Design within the Design

Related - High Performance Materials
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High Performance Materials

Related - Stackups: The Design within the Design
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Solder Defects


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24 Essential Skills for Engineers

System Analysis


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Bonus: Companion Guide

Smart Data: Using Data to Improve Manufacturing


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Thermal Management: A Fabricator's Perspective


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Process Validation


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Advanced Manufacturing in the Digital Age


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Assessing Your PCB Documentation Process


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Automation and Advanced Procedures in PCB Fabrication


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Producing the Perfect Data Package


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Low-Temperature Soldering


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Thermal Management with Insulated Metal Substrates


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Fundamentals of RF/Microwave PCBs


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Power Integrity by Example


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Signal Integrity by Example


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Secrets of High-Speed PCBs, Part 2


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Solderless Assembly for Electronics: The SAFE Approach


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Secrets of High-Speed PCBs, Part 1


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AS9100 Certification


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PIHR Technology

Survival Is Not Mandatory

The HDI Handbook

Flexible Circuit Technology, 4th Edition

Review from Dennis Fritz, Fritz Consulting

Dennis Fritz, Fritz Consulting

"If you are looking to better understand the factors that influence long-term microvia performance and PCB quality, read this book."

Review from Mike Carano, Consultant, Global Electronics Association

Mike Carano, Consultant, Global Electronics Association

"Sustainability and reliability go hand in hand in printed circuit board fabrication."

Review from William E. Webb, Technical Director, Aster Technologies

William E. Webb, Technical Director, Aster Technologies

"Even experienced test professionals will gain valuable insights and fresh perspectives from his expertise.."

Review from Jason Keeping, Celestica

Jason Keeping, Celestica

"A great read on materials and processes that help electronics succeed in harsher conditions."

Review from Gary Korkala

Gary Korkala

"The Printed Circuit Assembler's Guide to... X-ray Inspection is a must read for those engaged in the radiographic inspection of electronic components. It provides a clear, concise description of the X-ray process and includes a comprehensive number of comparative images."

Review from Eric Bogatin

Eric Bogatin

"If you are new to designing circuit boards for 10 Gbps and above systems, or touch any part of the PCB supply chain, get a jump up the learning curve from the experience offered in this book from a respected industry expert."

Review from Kris Moyer, Instructor, IPC

Kris Moyer, Instructor, IPC

"Whether you are new to PCB design or a seasoned designer with years of experience, this DFM book is an excellent resource. It covers many important concepts and informational topics to help ensure you achieve a successful, high-quality, high-yield PCB design the first time and every time."

Review from Richard Coyle, Consulting Member of Technical Staff, Nokia Bell Labs

Richard Coyle, Consulting Member of Technical Staff, Nokia Bell Labs

"Readers will find this book provides technical insights into the ever-evolving challenges of the assembly and reliability of low-temperature solder alloys. This second volume includes updates on fourth-generation low-temperature solders and a preview of the capabilities of ultra-low temperature (ULT) solders."

Review from Jason Sciberras, President, Saline Lectronics Division of Emerald Technologies

Jason Sciberras, President, Saline Lectronics Division of Emerald Technologies

"I would recommend that any data-driven engineers focused on taking their manufacturing operations to the next level read this book."

Review from Dr. Helmut Schweigart, Head of Reliablility & Surfaces, Zestron Europe.

Dr. Helmut Schweigart, Head of Reliablility & Surfaces, Zestron Europe.

"Readers will learn the advantages and disadvantages of different encapsulation materials and the importance of the application process. In order to find the right balance between benefit and effort, the author suggests using analytical approaches to configure the process and its settings. Additionally, she is always conscious of the need for sustainability when it comes to electronic assemblies."

Review from Stephen V. Chavez, IPC Designers Council

Stephen V. Chavez, IPC Designers Council

"This is a great resource for those who wish to gain a better understanding of all that it takes to design a complex PCB/CCA in today’s ever-evolving industry. For a designer, challenges always include layout solvability, electrical integrity, and manufacturability. The goal is making revision one work. I refer to this as ‘The Designer’s Triangle’."

Review from Ammar Abusham, DFM Integration Engineer (AR EE Team), Meta Reality Labs

Ammar Abusham, DFM Integration Engineer (AR EE Team), Meta Reality Labs

"This book effectively addresses the need for early integration of manufacturing elements into the design process. In an industry racing against time, MDD is the key to staying ahead. "

Review from Christopher St. Mars, Process Engineer, Intervala

Christopher St. Mars, Process Engineer, Intervala

"This book offers an accurate look at the aspects and challenges the electronics manufacturing industry faces with regards to SMT Inspection and its surrounding technology. In-depth insight on new and exciting true 3D inspection technology is provided, with a look into the future of leveraging big data management and autonomous manufacturing for a smarter factory."

Review from Mike Cummings, Technical Director, TSI

Mike Cummings, Technical Director, TSI

"What I like about this book is it's not based on fear marketing; rather, it is an honest appraisal of a difficult decision companies have to make toward their product service life, based on the product field data and established and proven test processes."

Review from Steve Williams

Steve Williams

"There is something here for everyone. I highly recommend downloading this book right away!"

Review from Duane Benson, Director of Marketing, Screaming Circuits

Duane Benson, Director of Marketing, Screaming Circuits

"I find that having a better understanding of the underlying process helps me create higher quality electronic designs. In this book, Matt Stevenson does a fantastic job of opening up the hood and giving the reader that knowledge of the PC board fab process."

Review from Lambert Schutters, General Manager, ESCATEC Penang

Lambert Schutters, General Manager, 
ESCATEC Penang

"We need the right tools to create the best design for the intended purpose. This book is a great introduction and guide on how to approach the process holistically."

Review from Jan Pedersen, Director of Technology, NCAB Group

Jan Pedersen, Director of Technology, NCAB Group

"The importance of total thermal resistance has been an eye opener for me from being focused on one material’s thermal conductivity to understanding the total thermal behavior of a material stackup."

Review from Eric Bogatin

Eric Bogatin

"I’ve been involved in aspects of PCB manufacturing and design for almost 40 years, and even I picked up a few useful nuggets of knowledge from this book."

Review from Mark Thompson, Engineering Manager, Out of the Box

Mark Thompson, Engineering Manager, Out of the Box

"I love this book. Particularly the sections on the effects of the glass weave, the history of laminate, and the difference between Dk and Effective Dk. I highly recommend this book for any designer or engineer looking to better understand laminate!"

Review from Joe O'Neil, Principal, OAA Ventures

Joe O'Neil, Principal, OAA Ventures

"The Printed Circuit Assembler’s Guide to Solder Defects is an outstanding summary of the how’s and why’s of paste theory, defect causation and recommended best practices. This short read contains real world advice from the experts. I highly recommend it for anyone involved in the PCB Assembly process."

Review from Lee Ritchey, Founder and President, Speeding Edge

Lee Ritchey, Founder and President, Speeding Edge

"Author Brad Griffin offers readers a very good explanation of system-level analysis of complex and high-speed electronic designs. I highly recommend this book for those who are getting started with the design of PCBs and systems that are used in data centers."

Review from Marius Stepanescu, Technical Director, ICCO EMT

Marius Stepanescu, Technical Director, ICCO EMT

"The Printed Circuit Assembler's Guide to... Smart Data explains the role of data acquisition and analytics in Industry 4.0. This book provides a very good description of the main challenges of collecting and handling smart data and analyzing it in the proper way."

Review from Dr. Johannes Adam, Consultant, ADAM Research

Dr. Johannes Adam, Consultant, ADAM Research

"If you want to know what measures you can take to keep your PCB cool, you need to read this book. The technologies and manufacturing processes for thermal management are summarized and presented in a unique way. "

Review from Dr. Lothar Henneken, Sr. Expert and Six Sigma Blackbelt, Robert Bosch GmbH

Dr. Lothar Henneken, Sr. Expert and Six Sigma Blackbelt, Robert Bosch GmbH

"A must-read for everyone who wants to deal responsibly with the subject of humidity robustness and electrochemical reliability of electronics with the now new, valid state of the art for material and process qualification. "

Review from Farid Anani, VP of Operations, Computrol Inc.

Farid Anani, VP of Operations, Computrol Inc.

"This book is a must-read for those embarking on their IIoT journey; it provides a very accurate description of preparation requirements and risks to consider and avoid, not just technologically, but also organizationally." "

Review from Kelly Dack, CIT, CID+ PCB Designer, Instructor & Manufacturing Liaison

Kelly Dack, CIT, CID+ PCB Designer, Instructor & Manufacturing Liaison

"This book explains how information embedded in a PCB design layout database can be leveraged to efficiently and dynamically output more accurate PCB design documentation."

Review from Alex Stepinski, vice president, GreenSource Fabrication

Alex Stepinski, vice president, GreenSource Fabrication

"Happy takes a textbook-style approach using easy-to-follow language. He provides step-by-step points for the DIYer, especially for making your own chemistry controllers, while providing examples from his past experiences. "

Review from Douglas Brooks, retired engineer, Ph.D.

Douglas Brooks, retired engineer, Ph.D.

"Mark does an outstanding job detailing what needs to be included in the handoff between the board designer and fabricator. Understanding and following his advice will lead to a smooth transition between these two functions. His new book should be required reading for every designer. "

Review from Happy Holden, Consulting Technical Editor, I-Connect007

Happy Holden, Consulting Technical Editor, I-Connect007

"I found this book to be very educational and informative. I agree with the authors that there are many advantages to using an LMP solder paste when it comes to improving the assembly and field reliability of complex HDI structures. I was particularly interested in their look at advanced density packaging for PoP and SiP, as these are rising packaging trends."

Review from Alun Morgan, Chairman, EIPC

Alun Morgan, Chairman, EIPC

" A comprehensive tour through the world of thermal management. Required reading for designers and end users wishing to understand the science and practice of using insulated metal substrate materials."

Review from Mike Carano, VP of technology and business development at RBP Chemical Technology

Mike Carano, VP of technology and business development at RBP Chemical Technology

"The definitive guide to navigating the unique challenges one faces when fabricating RF printed circuit boards."

Review from Gene Garat, President, Moss Bay EDA

Gene Garat, President, Moss Bay EDA

"Engineers new to the field as well as career veterans can all benefit from this quick read, well-illustrated with plenty of examples."

Review from Eric Bogatin

Eric Bogatin

"If you care about signal integrity, you are sure to pick up a few nuggets of insight from this new eBook."

Review from Andy Kowaleski

Andy Kowaleski

"Martyn's book regarding the 'black art' of signal integrity in printed circuit boards hits the nail right on the head. I found his explanations to be accurate, easy to read and in enough depth to satisfy both beginners and seasoned veterans. All in all, highly recommended. And FREE is a BIG bonus."

Review from Andy Shaughnessy

Andy Shaughnessy

"This book has everything you need to know about solderless assembly process, which could be the most innovative—and disruptive—technological development in our industry’s history."

Review from Alex Ippich

Alex Ippich

"A nice summary of many of the issues that engineers have to work through, without overly complicated formulas and details."

Review from Dan Beaulieu

Dan Beaulieu

"This book is long overdue. Finally, a book on AS9100 certification written in clear and concise language.""