Direct Metallization: A Guide to Complex PCB Fabrication


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Design for Test: A Practical Guide to Test and Inspection


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UV Curable Conformal Coatings


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X-ray Inspection


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More Secrets of High-speed PCBs


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DFM Essentials


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Bonus: Companion Guide

Low-temperature Soldering, Vol. 2


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Factory Analytics


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Encapsulating Sustainability for Electronics


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Executing Complex PCBs


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Bonus: Audio Book

IPC Checklist for Printed Board Assemblies

Manufacturing Driven Design


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SMT Inspection: Today, Tomorrow, and Beyond


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Bonus: Companion Guide

Bonus: Companion Guide 2

Process Control


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Flex and Rigid-Flex Fundamentals


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Bonus: Companion Guide

Designing for Reality


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Related Podcast

The Evolving PCB NPI Process


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Thermal Management with Insulated Metal Substrates, Volume 2


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Bonus: Companion Guide

Stackups: The Design within the Design

Related - High Performance Materials
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High Performance Materials

Related - Stackups: The Design within the Design
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Solder Defects


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24 Essential Skills for Engineers

System Analysis


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Bonus: Companion Guide

Smart Data: Using Data to Improve Manufacturing


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Thermal Management: A Fabricator's Perspective


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Process Validation


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Advanced Manufacturing in the Digital Age


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Assessing Your PCB Documentation Process


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Automation and Advanced Procedures in PCB Fabrication


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Producing the Perfect Data Package


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Low-Temperature Soldering


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Thermal Management with Insulated Metal Substrates


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Fundamentals of RF/Microwave PCBs


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Power Integrity by Example


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Signal Integrity by Example


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Secrets of High-Speed PCBs, Part 2


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Solderless Assembly for Electronics: The SAFE Approach


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Secrets of High-Speed PCBs, Part 1


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AS9100 Certification


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PIHR Technology

Survival Is Not Mandatory

The HDI Handbook

Flexible Circuit Technology, 4th Edition

Review from Venkat Raja, President & Founder, Advint, Inc.

Venkat Raja, President & Founder, Advint, Inc.

"Gugliotti provides the critical technical validation required to transition from conventional electroless copper to the proven reliability of direct copper-to-copper bonding."

Review from Tamara Jovanovic, Electronics Engineer, Masimo

Tamara Jovanovic, Electronics Engineer, Masimo

"This book clearly explains why Design for Test is essential to product and business success."

Review from Jason Keeping, Celestica

Jason Keeping, Celestica

"A great read on materials and processes that help electronics succeed in harsher conditions."

Review from Phil Zarrow

Phil Zarrow

"Dr. Cardoso has given the industry a concise, comprehensive, and very readable quintessential primer on X-ray and its use in electronics assembly to a grateful industry."

Review from Eric Bogatin

Eric Bogatin

"If you are new to designing circuit boards for 10 Gbps and above systems, or touch any part of the PCB supply chain, get a jump up the learning curve from the experience offered in this book from a respected industry expert."

Review from Kris Moyer, Instructor, IPC

Kris Moyer, Instructor, IPC

"Whether you are new to PCB design or a seasoned designer with years of experience, this DFM book is an excellent resource. It covers many important concepts and informational topics to help ensure you achieve a successful, high-quality, high-yield PCB design the first time and every time."

Review from Kevin Byrd, Principal Engineer, Intel Corporation

Kevin Byrd, Principal Engineer, Intel Corporation

"This book provides an excellent overview of both the history of low-temperature solders as well as the recent progress in this exciting surface mount technology. This information will prove valuable for those actively pursuing low-temperature solder conversion of their manufacturing processes as well as those working to understand the progress and future for the low-temperature solder materials."

Review from Jason Sciberras, President, Saline Lectronics Division of Emerald Technologies

Jason Sciberras, President, Saline Lectronics Division of Emerald Technologies

"I would recommend that any data-driven engineers focused on taking their manufacturing operations to the next level read this book."

Review from Dr. Helmut Schweigart, Head of Reliablility & Surfaces, Zestron Europe.

Dr. Helmut Schweigart, Head of Reliablility & Surfaces, Zestron Europe.

"Readers will learn the advantages and disadvantages of different encapsulation materials and the importance of the application process. In order to find the right balance between benefit and effort, the author suggests using analytical approaches to configure the process and its settings. Additionally, she is always conscious of the need for sustainability when it comes to electronic assemblies."

Review from Stephen V. Chavez, IPC Designers Council

Stephen V. Chavez, IPC Designers Council

"The author shows great insight into the many details and collaboration required for creating complex PCBs as well as the most important aspect of a successful design team, in my opinion—communication."

Review from Gus Becerra, Principal Manufacturing Engineer, Marvell

Gus Becerra, Principal Manufacturing Engineer, Marvell

"As fabrication and manufacturing technologies advance, it is necessary to evolve our methods to analyze and review designs. This book utilizes data-driven concepts in all aspects of the fabrication and assembly processes to improve design capabilities. "

Review from Christopher St. Mars, Process Engineer, Intervala

Christopher St. Mars, Process Engineer, Intervala

"This book offers an accurate look at the aspects and challenges the electronics manufacturing industry faces with regards to SMT Inspection and its surrounding technology. In-depth insight on new and exciting true 3D inspection technology is provided, with a look into the future of leveraging big data management and autonomous manufacturing for a smarter factory."

Review from Dr. Lothar Henneken, Sr. Expert and Six Sigma Blackbelt, Robert Bosch GmbH

Dr. Lothar Henneken, Sr. Expert and Six Sigma Blackbelt, Robert Bosch GmbH

"A must-read for everyone who wants to deal responsibly with the subject of humidity robustness and electrochemical reliability of electronics with the now new, valid state of the art for material and process qualification. "

Review from Steve Williams

Steve Williams

"There is something here for everyone. I highly recommend downloading this book right away!"

Review from Duane Benson, Director of Marketing, Screaming Circuits

Duane Benson, Director of Marketing, Screaming Circuits

"I find that having a better understanding of the underlying process helps me create higher quality electronic designs. In this book, Matt Stevenson does a fantastic job of opening up the hood and giving the reader that knowledge of the PC board fab process."

Review from Nick Niculita, Engineering Manager, SRXGlobal

Nick Niculita, Engineering Manager, SRXGlobal

"This book is a must-read for everybody who wants to improve the overall design-through-manufacturing NPI phase and ultimately do more with less, the Holy Grail of any manufacturer."

Review from Kyle Burk, PhD, President and Director of Engineering for KBJ Engineering, LLC

Kyle Burk, PhD, President and Director of Engineering for KBJ Engineering, LLC

"This textbook is a great addition and supplement to the first edition. It delves deeper into the science of insulated metal substrates and their useful, often overlooked, properties for proper thermal management."

Review from Michael Ingraham

Michael Ingraham

"Finally, a book on stackup design for designers that focuses on high-speed applications. This is a much-needed resource for the design community, and there is no one better or more qualified to write it than Bill Hargin."

Review from Gerry Partida, VP of Technology, Summit Interconnect

Gerry Partida, VP of Technology, Summit Interconnect

"Michael Gay’s book is a concise and detailed explanation of the critical materials that makes up a PCB. His thorough explanation will help any engineer, designer and fabricator understand the impact of the material selection in a PCB stackup. This book is truly a gift to the electronics industry and I thank him for sharing his knowledge with us."

Review from Joe O'Neil, Principal, OAA Ventures

Joe O'Neil, Principal, OAA Ventures

"The Printed Circuit Assembler’s Guide to Solder Defects is an outstanding summary of the how’s and why’s of paste theory, defect causation and recommended best practices. This short read contains real world advice from the experts. I highly recommend it for anyone involved in the PCB Assembly process."

Review from Lee Ritchey, Founder and President, Speeding Edge

Lee Ritchey, Founder and President, Speeding Edge

"Author Brad Griffin offers readers a very good explanation of system-level analysis of complex and high-speed electronic designs. I highly recommend this book for those who are getting started with the design of PCBs and systems that are used in data centers."

Review from Marius Stepanescu, Technical Director, ICCO EMT

Marius Stepanescu, Technical Director, ICCO EMT

"The Printed Circuit Assembler's Guide to... Smart Data explains the role of data acquisition and analytics in Industry 4.0. This book provides a very good description of the main challenges of collecting and handling smart data and analyzing it in the proper way."

Review from Dan Beaulieu, President, DB Management Group

Dan Beaulieu, President, DB Management Group

"For those who are, shall we say, 'less technical' than others, it’s refreshing—not to mention face-saving, at times—to be able to understand terms like insulated metal-clad PCBs (IMPCBs), metal-clad PCBs (MCPCBs) and mixed-technology PCBs."

Review from Dr. Lothar Henneken, Sr. Expert and Six Sigma Blackbelt, Robert Bosch GmbH

Dr. Lothar Henneken, Sr. Expert and Six Sigma Blackbelt, Robert Bosch GmbH

"A must-read for everyone who wants to deal responsibly with the subject of humidity robustness and electrochemical reliability of electronics with the now new, valid state of the art for material and process qualification. "

Review from Happy Holden, Consulting Technical Editor, I-Connect007

Happy Holden, Consulting Technical Editor, I-Connect007

"This is essential reading for those who are wondering, "What can smart factories do for me?" The Mentor/Siemens description of how Industry 4.0 can benefit an electronics manufacturer, and how to go about using such a concept, is both detailed and easy to understand. It is one of the best books on the subject!"

Review from Kelly Dack, CIT, CID+ PCB Designer, Instructor & Manufacturing Liaison

Kelly Dack, CIT, CID+ PCB Designer, Instructor & Manufacturing Liaison

"This book explains how information embedded in a PCB design layout database can be leveraged to efficiently and dynamically output more accurate PCB design documentation."

Review from Alex Stepinski, vice president, GreenSource Fabrication

Alex Stepinski, vice president, GreenSource Fabrication

"Happy takes a textbook-style approach using easy-to-follow language. He provides step-by-step points for the DIYer, especially for making your own chemistry controllers, while providing examples from his past experiences. "

Review from Dan Beaulieu, president, D.B. Management

Dan Beaulieu, president, D.B. Management

"If you are serious about creating the best, most perfect data packages available today, do yourself a favor. Download and read this book. It’s simple—the better the package, the better the board. "

Review from Raiyo Aspandiar, Ph.D., Senior Engineer, Intel Corporation

Raiyo Aspandiar, Ph.D., Senior Engineer, Intel Corporation

"This book does a good job of distilling out the chaff and focusing on the most relevant, valuable information available, including main drivers for the current worldwide interest in low-temperature soldering, the history of solder paste alloys and flux developments, as well as various applications for these materials."

Review from Andy Shaughnessy, Managing Editor, Design007 Magazine

Andy Shaughnessy, Managing Editor, Design007 Magazine

"This book will help the reader gain a comprehensive understanding of the physical realities of insulated metal substrates and their applications in the thermal management of electronic assemblies."

Review from Judy Warner, director of community engagement at Altium

Judy Warner, director of community engagement at Altium

"This concise, yet very thorough eBook is destined to become every RF and microwave engineer's PCB fabrication bible. ASC shares every key aspect to successfully fabricate these incredibly challenging boards."

Review from Andy Shaughnessy

Andy Shaughnessy

"This micro eBook should be required reading for every PCB designer or design engineer, whether novice or veteran. This book makes a great follow-up to Mentor’s previous eBook, The Printed Circuit Designer’s Guide to…Signal Integrity."

Review from Terry Fox

Terry Fox

"I found this to be an excellent tutorial on controlled impedance transmission lines, terminations, crosstalk, differential pair design and PDN noise, and
Mentor’s virtual labs take learning to a whole new level!"

Review from Andy Kowaleski

Andy Kowaleski

"Martyn's book regarding the 'black art' of signal integrity in printed circuit boards hits the nail right on the head. I found his explanations to be accurate, easy to read and in enough depth to satisfy both beginners and seasoned veterans. All in all, highly recommended. And FREE is a BIG bonus."

Review from David M. Griffith, BSc Geophysicist

David M. Griffith, BSc  Geophysicist

"Must admit the philosophical arguments–e.g. simplification and welfare of all–caught my attention more than the technical stuff. I was able to keep up with the technical stuff (there's simplification for you) for the most part and the figures spoke volumes (a picture is indeed worth a thousand words) for the advantages of SAFE."

Review from Eric Bogatin

Eric Bogatin

"The Printed Circuit Designer's Guide to... Secrets of High-Speed PCBs, Part 1 pulls back the covers to illustrate the practical principles behind many of the confusing topics that arise in the overlap between manufacturing, materials, and signal integrity performance."

Review from Andy Shaughnessy

Andy Shaughnessy

"This may be the single best source of info about the AS9100 certification. Easy to digest yet full of details, it’s all here: from start to finish..."