"This book clearly explains why Design for Test is essential to product and business success."

"The Printed Circuit Assembler's Guide to... X-ray Inspection is a must read for those engaged in the radiographic inspection of electronic components. It provides a clear, concise description of the X-ray process and includes a comprehensive number of comparative images."

"Readers will find this book provides technical insights into the ever-evolving challenges of the assembly and reliability of low-temperature solder alloys. This second volume includes updates on fourth-generation low-temperature solders and a preview of the capabilities of ultra-low temperature (ULT) solders."

"I would recommend that any data-driven engineers focused on taking their manufacturing operations to the next level read this book."

"Readers will learn the advantages and disadvantages of different encapsulation materials and the importance of the application process. In order to find the right balance between benefit and effort, the author suggests using analytical approaches to configure the process and its settings. Additionally, she is always conscious of the need for sustainability when it comes to electronic assemblies."

"This book offers an accurate look at the aspects and challenges the electronics manufacturing industry faces with regards to SMT Inspection and its surrounding technology. In-depth insight on new and exciting true 3D inspection technology is provided, with a look into the future of leveraging big data management and autonomous manufacturing for a smarter factory."

"What I like about this book is it's not based on fear marketing; rather, it is an honest appraisal of a difficult decision companies have to make toward their product service life, based on the product field data and established and proven test processes."

"The Printed Circuit Assembler’s Guide to Solder Defects is an outstanding summary of the how’s and why’s of paste theory, defect causation and recommended best practices. This short read contains real world advice from the experts. I highly recommend it for anyone involved in the PCB Assembly process."

"The Printed Circuit Assembler's Guide to... Smart Data explains the role of data acquisition and analytics in Industry 4.0. This book provides a very good description of the main challenges of collecting and handling smart data and analyzing it in the proper way."

"A must-read for everyone who wants to deal responsibly with the subject of humidity robustness and electrochemical reliability of electronics with the now new, valid state of the art for material and process qualification. "

"This book is a must-read for those embarking on their IIoT journey; it provides a very accurate description of preparation requirements and risks to consider and avoid, not just technologically, but also organizationally." "

"I found this book to be very educational and informative. I agree with the authors that there are many advantages to using an LMP solder paste when it comes to improving the assembly and field reliability of complex HDI structures. I was particularly interested in their look at advanced density packaging for PoP and SiP, as these are rising packaging trends."