"With this book, Bob Neves provides an important update to our understanding of via testing by articulating the distinction between their reliability and robustness."

"Even experienced test professionals will gain valuable insights and fresh perspectives from his expertise.."

"The Printed Circuit Assembler's Guide to... X-ray Inspection is a must read for those engaged in the radiographic inspection of electronic components. It provides a clear, concise description of the X-ray process and includes a comprehensive number of comparative images."

"Readers will find this book provides technical insights into the ever-evolving challenges of the assembly and reliability of low-temperature solder alloys. This second volume includes updates on fourth-generation low-temperature solders and a preview of the capabilities of ultra-low temperature (ULT) solders."

"I would recommend that any data-driven engineers focused on taking their manufacturing operations to the next level read this book."

"We live in a harsh world where protection is needed. Ruggedization is one of the fundamental processes that can help. This book provides a great summary of one of these key capabilities."

"This book offers an accurate look at the aspects and challenges the electronics manufacturing industry faces with regards to SMT Inspection and its surrounding technology. In-depth insight on new and exciting true 3D inspection technology is provided, with a look into the future of leveraging big data management and autonomous manufacturing for a smarter factory."

"A must-read for everyone who wants to deal responsibly with the subject of humidity robustness and electrochemical reliability of electronics with the now new, valid state of the art for material and process qualification. "

"The Printed Circuit Assembler’s Guide to Solder Defects is an outstanding summary of the how’s and why’s of paste theory, defect causation and recommended best practices. This short read contains real world advice from the experts. I highly recommend it for anyone involved in the PCB Assembly process."

"This book provides good education, with examples and explanations to help the reader understand how the smart factory can improve performance and competitiveness."

"A must-read for everyone who wants to deal responsibly with the subject of humidity robustness and electrochemical reliability of electronics with the now new, valid state of the art for material and process qualification. "

"This book is a must-read for those embarking on their IIoT journey; it provides a very accurate description of preparation requirements and risks to consider and avoid, not just technologically, but also organizationally." "

"I found this book to be very educational and informative. I agree with the authors that there are many advantages to using an LMP solder paste when it comes to improving the assembly and field reliability of complex HDI structures. I was particularly interested in their look at advanced density packaging for PoP and SiP, as these are rising packaging trends."