Data is driving disruptive industries and trends, with 90% having been generated in only the last two years. 80% of this data is unstructured and only 2% of this data has been analyzed.
System-level analysis of complex and high-speed electronic designs is critical to solve electromagnetic, electrothermal, and electromechanical simulation challenges and to ensure that the system works under wide-ranging operating conditions.
The electrothermal analysis of ICs and electronic systems is made more complex by interconnected electrical and thermal effects. Increased electrical content logically generates more heat, which affects the system performance of electronic devices. In this book, the author focuses on EM and thermal analysis in the context of data center electronics systems.
ISBN: 978-1-7370232-2-7
Brad Griffin is a product marketing group director in the System Analysis Group at Cadence Design Systems, Inc. He has over 25 years of experience in electronics design technologies that enable the design and analysis of integrated circuit packaging and printed circuit board systems for high performance applications such as datacenters, 5G, WiFi6, and 3D-IC. Griffin is a graduate of Arizona State University.
Lee Ritchey Founder and President, Speeding Edge
Lee Ritchey is one of the industry’s premier authorities on high-speed PCB and system design. He is the founder and president of Speeding Edge, an engineering consulting and training company. He conducts on-site private training courses for high technology companies, and also teaches courses [...]
Chapter Summaries
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Chapter 1
Data Center Infrastructure and Requirements Related to Electronics Systems
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Chapter 2
Challenges in Design and Development of Electronics Systems
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Chapter 3
Limitations of Today’s Electronics System Design
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Chapter 4
The New Electronics System Design Solution
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