FEATURED NEWS AND INFORMATION:
We search high and low to find the best news for you, our valuable readers…
Tandem Panel Shipments to Jump Again to 36% in 2026

According to recent display industry research from Omdia, tandem RGB penetration into the OLED tablet and notebook panel markets surged from almost...
QuantumScape, Murata Announce Framework for Ceramics Collaboration

QuantumScape Corporation, a global leader in next-generation solid-state lithium-metal battery technology, and Murata Manufacturing Co. have entered...
Asia/Pacific AI Spending to Reach $175 Billion by 2028, Driven by GenAI Boom

According to the IDC Worldwide AI and Generative AI Spending Guide, the Asia/Pacific region, including China and Japan, is experiencing unprecedented...
Mitsubishi Electric, Nanofiber Quantum Technologies Launch Trial to Develop Quantum Computer Interconnection Technology

Mitsubishi Electric Corporation and Nanofiber Quantum Technologies Inc. (NanoQT) announced today the immediate launch of a joint demonstration aimed...
IQM to Deploy Poland’s First Superconducting Quantum Computer

The first quantum computer in Poland developed by IQM Quantum Computers, a global leader in superconducting quantum computers, will be operational at...
Siemens, TSMC Extend Collaboration to Drive Semiconductor Design Innovation

Siemens Digital Industries Software announced that the company has deepened longstanding collaboration with TSMC to drive innovation in semiconductor...
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Tandem Panel Shipments to Jump Again to 36% in 2026
April 25, 2025 | BUSINESS WIRE
QuantumScape, Murata Announce Framework for Ceramics Collaboration
April 25, 2025 | BUSINESS WIRE
Asia/Pacific AI Spending to Reach $175 Billion by 2028, Driven by GenAI Boom
April 25, 2025 | IDC
Mitsubishi Electric, Nanofiber Quantum Technologies Launch Trial to Develop Quantum Computer Interconnection Technology
April 25, 2025 | BUSINESS WIRE
IQM to Deploy Poland’s First Superconducting Quantum Computer
April 25, 2025 | BUSINESS WIRE
Siemens, TSMC Extend Collaboration to Drive Semiconductor Design Innovation
April 25, 2025 | Siemens
Ansys Strengthens Collaboration with TSMC on Advanced Node Processes Certification and 3D-IC Multiphysics Design Solutions
April 24, 2025 | PRNewswire
New IDTechEx Report Examines How QLC SSDs Are Disrupting the HDD Storage Market
April 24, 2025 | PRNewswire
Murata, QuantumScape Start to Explore a Collaboration for Manufacturing of Ceramics
April 24, 2025 | Murata
Explore Thermal Management Solutions in Latest Podcast Series—New Episode Now Available
April 23, 2025 | I-Connect007
Do You Have X-ray Vision? Featuring:
- Book Excerpt: The Printed Circuit Assembler's Guide to... X-ray Inspection by Bill Cardoso
- Real Time with... IPC APEX EXPO 2025: Reporting on the Future of X-ray Technology with Bill Cardoso
- Unlocking the Invisible: The Critical Role of X-ray Technology by Mike Konrad
- The Future of Advanced Packaging is X-ray by David Kruiphof and Kevin Jan
- DRAM Damage Due to X-ray Inspections Post-PCB Assembly by Saurabh Gupta, et al
Voices of the Industry Featuring:
- ACE: Be Nimble, Quick, and Open to Change with James Hofer
- ALPHA CIRCUIT: Business Always Finds a Way with Prashant Patel
- CEE PCB: Choosing the Right Strategic Path with Tom Yang
- NCAB: Ensuring a Strong and Reliable Supply Chain with Kelly Davidson
- PLURITEC: Growth Depends on Developing Next-gen Products with Maurizio Bonati
- TTM: Navigating Change, Mitigating Risk: We’ve Been Here Before with Tom Edman
Designing Through the Noise Featuring:
- Material Selection and RF Design with Alun Morgan
- EDA Tools and RF Design Techniques with David Vye
- New RF Materials Offer RF Designers Options with Brent Mayfield
- The Right Blend: Mixed Wireless Technologies, by Kirsten Zima
- RF PCB Design Tips and Tricks, by Cherie Litson
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