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Chipsea Charts a Path for Strategic Expansion Through Enhanced Computing Peripherals
Chipsea Technologies (Shenzhen) Corp., Ltd. (Chipsea), in collaboration with Intel, introduced a new line of edge BMC products. Specializing in...
TeraHive Launches Intelligent Energy Management Solutions
TeraHive, an intelligent energy management solution provider, backed by global leader LITEON Technology, announced today the launch of three smart...
Gartner Predicts 40% of Generative AI Solutions Will Be Multimodal By 2027
Forty percent of generative AI (GenAI) solutions will be multimodal (text, image, audio and video) by 2027, up from 1% in 2023, according to Gartner,...
NAND Flash Shipments Growth Slows in 2Q24, Revenue Up 14% Driven by AI SSD Demand
TrendForce reports that NAND Flash prices continued to rise in 2Q24 as server inventory adjustments neared completion and AI spurred demand for...
AMOLED Panels Become Mainstream Display for Smartphones, with Shipments Set to Grow by Nearly 25% in 2024
TrendForce’s latest projections show global shipments of AMOLED smartphone panels are anticipated to surpass 840 million units in 2024, reflecting...
SEMICON India 2024 to Highlight Local Semiconductor Ecosystem Growth and Industry Trends
SEMICON India 2024 will bring together global leaders, semiconductor industry experts, academia, and government officials from September 11-13, 2024,...
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Chipsea Charts a Path for Strategic Expansion Through Enhanced Computing Peripherals
September 9, 2024 | PRNewswire
TeraHive Launches Intelligent Energy Management Solutions
September 9, 2024 | BUSINESS WIRE
Gartner Predicts 40% of Generative AI Solutions Will Be Multimodal By 2027
September 9, 2024 | Gartner, Inc.
NAND Flash Shipments Growth Slows in 2Q24, Revenue Up 14% Driven by AI SSD Demand
September 9, 2024 | TrendForce
AMOLED Panels Become Mainstream Display for Smartphones, with Shipments Set to Grow by Nearly 25% in 2024
September 6, 2024 | TrendForce
SEMICON India 2024 to Highlight Local Semiconductor Ecosystem Growth and Industry Trends
September 6, 2024 | SEMI
Greg LaRocca Joins SIA as Director of Industry Research and Economic Policy
September 6, 2024 | SIA
Global Smartphone Production Sees Slight Rebound in 3Q24 but Faces a 5% YoY Decline
September 5, 2024 | TrendForce
Global Wrist-Worn Device Market Ships Almost 44 Million Units in 2Q 2024, Led by China’s 10.9% YoY Growth
September 5, 2024 | IDC
Q2 2024 Global Semiconductor Equipment Billings Increased 4% Year-Over-Year
September 5, 2024 | SEMI
Solder Printing Featuring:
- Scrutinizing Solder Printing With Adam Murling and Ron Lasky
- The Pivotal Role of Solder Paste by Mike Konrad
- Mycronic’s Jet Set Technology With Wolfgang Heinecke
- Making Waves With Solder Jet Printing by Josh Casper
- Auguring in on Dispensing With Sunny Agarwal
- Solder Printing: A 1:1 Ratio of Technical and Creative by Nolan Johnson
Wet Process Control Featuring:
- Maximizing ROI Through Better Wet Process Control with Mike Carano
- Chemical and Equipment Control for High-density Circuits, Part 2 by Don Ball
- Automated Chemical Dosing for Enhanced Control and Safety with Mike Brask
- Three Simple Ways to Manage and Control Wet Processes by Happy Holden
- Audits: A Critical Element of Process Control by Randy Cherry
Silicon to Systems: From Soup to Nuts Featuring:
- From Silicon to Systems, with M. Kelly, D. Iyer, and K. Moyer
- PCB Designers: ‘Level Up’ IC, Packaging Knowledge, with Soo Lan Cheah
- Integrated Circuit to PCB Integration, by Barry Olney
- Silicon to Systems: Collaboration Between IC and PCB Design Continues, with Stephen Chavez
- Cross-domain Design: The Key to Managing Complex Methodologies, with John Park
- Silicon to Systems: A Wake-up Call for the Industry, with D.Benson
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