FEATURED NEWS AND INFORMATION:
Send your news item to: news@iconnect007.com
GlobalFoundries, Commerce Finalize $375M Quantum R&D Award
GlobalFoundries (GF) announced it has finalized a definitive agreement with the U.S. Department of Commerce’s CHIPS Research and Development Office...
Qualcomm, Amazon Announce Multi-Generational AI Data Center Collaboration
Qualcomm Technologies, Inc. announced a multi-generation collaboration with Amazon to enable customized silicon at scale for large-scale AI data...
SEMI Calls for Chips Act 2.0 to Boost Semiconductor Competitiveness
SEMI renews its call on European policymakers to use the proposed Chips Act 2.0 to strengthen Europe’s semiconductor competitiveness, reinforce...
Intel Foundation, PLTW Expand Pathways to Semiconductor Careers
The future of semiconductor innovation depends on a strong pipeline of skilled...
USI Launches AI Smart Camera Solution to Accelerate Smart Manufacturing
USI announced its next-generation AI Smart Camera solution, a comprehensive edge AI and vision platform that empowers manufacturers to accelerate...
NOR Flash Price Trends Diverge in 2H26, with High-Capacity Products Poised for 90–110% Increases
TrendForce’s latest memory industry research indicates that the NOR Flash market is undergoing its most significant structural shift in supply and...
Click Here for More News
Send your news item to: news@iconnect007.com
Click here for press release tips
GlobalFoundries, Commerce Finalize $375M Quantum R&D Award
September 14, 2026 | GlobalFoundries
Qualcomm, Amazon Announce Multi-Generational AI Data Center Collaboration
September 14, 2026 | Qualcomm Technologies, Inc.
SEMI Calls for Chips Act 2.0 to Boost Semiconductor Competitiveness
September 14, 2026 | SEMI
Intel Foundation, PLTW Expand Pathways to Semiconductor Careers
September 14, 2026 | Intel Corporation
USI Launches AI Smart Camera Solution to Accelerate Smart Manufacturing
September 14, 2026 | USI
NOR Flash Price Trends Diverge in 2H26, with High-Capacity Products Poised for 90–110% Increases
September 14, 2026 | TrendForce
Mobix Labs Secures Initial F-16 Component Order
September 11, 2026 | BUSINESS WIRE
Rigetti Signs $100M U.S. Government Agreement for Quantum R&D
September 11, 2026 | Globe Newswire
Top 10 Fabless IC Design Houses Post 73% YoY Growth in 2Q26; AMD Enters Top Three
September 11, 2026 | TrendForce
Samsung Electronics, ASML Expand Semiconductor Collaboration
September 10, 2026 | BUSINESS WIRE
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Mexico’s Time Has Come Featuring:
- Mexico Solders On With Indium Corporation with Chris Bastecki
- Infographic: Mexico Trade Trends
- The Human Side of Latin American Electronics with Joel Sainz
- Heller and SEHO Investing in Mexico with Paul Lancaster
- Mexico’s Answer to Bypassing the Panama Canal by Nolan Johnson
From Ecosystems to Innovation Featuring:
- The Relevance of VeCS as an HDI Process Option by Marcy LaRont
- VeCS HDI Process Technology: Has the Time Come for Broader Adoption? by Joan Tourné
- Life in the Engineering Ecosystem by Kelly Dack
- Designing for a More ‘Intelligent’ and Connected Future with Kristin Moyer
- Who Really Designs the PCB? by Stephen V. Chavez
Educational Resource Center
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in