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NEC Improves the Energy Efficiency and Floor Space Density of 5G Mobile Core Systems

NEC Corporation has improved the performance-to-power ratio of 5G mobile core systems (5GC) by more than 6 times, as well as floor space density by...
EV Group Advances 300-mm MEMS Manufacturing with Next-Generation GEMINI Automated Production Wafer Bonding System

EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip...
DigiKey Partners with SparkFun to Equip Next Generation of Engineers with XRP Robotics Kits

DigiKey, a leading global commerce distributor offering the largest selection of technical components and automation products in stock for immediate...
Automotive Sector Poised for Major Shifts Amid EV Expansion and Fiercer Competition

The global automotive industry is undergoing a significant transformation, with 2025 poised to bring new developments influenced by key events in...
NVIDIA GB300 To Feature Enhanced Specifications, Full Rack Shipments Expected to Gradually Scale in 3Q25

TrendForce’s latest findings on the AI server supply chain have revealed that NVIDIA is expected to launch the GB300 chip ahead of schedule in...
IDC Forecasts PC Shipments in Asia/Pacific to Grow at 4.1% YoY in 2025

The traditional PC market (desktops, notebooks, and workstations) in Asia/Pacific (including Japan and China) dropped by 1.9% in 2024 to 95.5 million...
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NEC Improves the Energy Efficiency and Floor Space Density of 5G Mobile Core Systems
March 18, 2025 | ACN Newswire
EV Group Advances 300-mm MEMS Manufacturing with Next-Generation GEMINI Automated Production Wafer Bonding System
March 18, 2025 | PRNewswire
DigiKey Partners with SparkFun to Equip Next Generation of Engineers with XRP Robotics Kits
March 18, 2025 | PRNewswire
Automotive Sector Poised for Major Shifts Amid EV Expansion and Fiercer Competition
March 18, 2025 | PRNewswire
NVIDIA GB300 To Feature Enhanced Specifications, Full Rack Shipments Expected to Gradually Scale in 3Q25
March 18, 2025 | TrendForce
IDC Forecasts PC Shipments in Asia/Pacific to Grow at 4.1% YoY in 2025
March 17, 2025 | IDC
Cadence Joins Intel Foundry Accelerator Design Services Alliance
March 17, 2025 | Cadence Design Systems
Global Top 10 IC Design Houses See 49% YoY Growth in 2024, NVIDIA Commands Half the Market
March 17, 2025 | TrendForce
TSI Introduces the Nano LPM System for Semiconductor Ultrapure Water Nanoparticle Detection
March 14, 2025 | TSI Incorporated
Ainos, ASE Partner to Power AI Scent Digitization in Semiconductor Manufacturing
March 14, 2025 | ASE Group
IPC APEX EXPO 2025: A Preview Featuring:
- IPC APEX EXPO 2025 Marks a Special Anniversary Year for the Show by Dr. John W, Mitchell
- Imagine the Possibilities: Tech Conference 2025 with Stan Rak and Udo Welzel
- IPC Global Standards Driving Factory of the Future by Chris Jorgensen
- Standards Driving Factory of the Future interview with Thomas Marktscheffel
- Empowering Women in Electronics: An Evening of Connection and Inspiration by Alicia Balonek
The Essential Guide to Surface Finishes Featuring:
- Gold as a Key Component in PCBs and IC Substrates by Britta Schafsteller, Sandra Nelle, and Kuldip Johal
- Electroninks' MOD and iSAP, Game Changers with Mike Vinson
- Observations on Palladium as a Final Finish by Happy Holden
- Surface Finishes for PCBs by Don Ball
- Organic Addition Agents in Electrolytic Copper Plating by Mike Carano
Learning to Speak ‘Fab’ Featuring:
- Breaking Down the Language Barrier, by Andy Shaughnessy
- Speaking the Same Language as Your Fabricator, with Jen Kolar and Kelly Dack
- Learning to Speak ‘Fab,’ by Ray Fugitt
- Bridging the Gap Between PCB Designers and Fabricators, by Stephen Chavez
- Coordinating With Your Fabricator, with Paul Cooke
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