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CTEK Shares Tips to Avoid a Dead Battery in Summer Heat
The United States has seen record heat and it doesn't look like it will end anytime soon. As the heat intensifies, it's not just our bodies that need...
Intel Names Naga Chandrasekaran to Lead Foundry Manufacturing and Supply Chain
Intel Corporation today announced the appointment of Dr. Naga Chandrasekaran as chief global operations officer, executive vice president and general...
TriMech is North America's Newest and Largest Provider of SolidCAM Software for CNC Manufacturing Technologies
TriMech has a new partnership with SolidCAM, known worldwide for its CAM (Computer-Aided Manufacturing) solution for efficient, user-friendly...
iNEMI Packaging Tech Topic Webinar: Equipment Capabilities and Challenges to Support Advanced Packaging Trends
Modern day computing needs, notably AI/machine learning and high-performance computing, along with their subsequent memory and I/O requirements, are...
Pragmatic Semiconductor Appoints Murthy Renduchintala to Board of Directors
Pragmatic Semiconductor Ltd. announced the appointment of Dr. Venkata "Murthy" Renduchintala, as a non-executive director to Pragmatic's Board of...
Altair Signs MoU With University of Nottingham to Develop Aerospace Digital Twin Project
Altair, a global leader in computational intelligence, has signed a memorandum of understanding (MoU) with the U.K.-based University of Nottingham...
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CTEK Shares Tips to Avoid a Dead Battery in Summer Heat
July 26, 2024 | PRNewswire
Intel Names Naga Chandrasekaran to Lead Foundry Manufacturing and Supply Chain
July 26, 2024 | Intel
TriMech is North America's Newest and Largest Provider of SolidCAM Software for CNC Manufacturing Technologies
July 26, 2024 | PRNewswire
iNEMI Packaging Tech Topic Webinar: Equipment Capabilities and Challenges to Support Advanced Packaging Trends
July 26, 2024 | iNEMI
Pragmatic Semiconductor Appoints Murthy Renduchintala to Board of Directors
July 25, 2024 | PRNewswire
Altair Signs MoU With University of Nottingham to Develop Aerospace Digital Twin Project
July 25, 2024 | PRNewswire
Imagination Technologies Announces New Capital Investment
July 25, 2024 | Imagination Technologies
iNEMI Packaging Tech Topic Series: Damage-Free Rapid Electron Beam Testing for Advanced Packaging
July 24, 2024 | iNEMI
Personal Computing Sales Through Distribution Return to Growth, Driven by AI PCs
July 24, 2024 | IDC
ASMPT, IBM Deepen Collaboration to Advance Bonding Methods for Chiplet Packages for AI
July 24, 2024 | ASMPT
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