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Argonne to Lead Two Microelectronics Research Projects Under U.S. Department of Energy Initiative
The U.S. Department of Energy’s (DOE) Argonne National Laboratory is managing two microelectronics studies that will support multidisciplinary...
Imec Achieves Breakthrough in Silicon Photonics
Imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, has announced a significant milestone in silicon photonics with the successful demonstration of electrically-driven GaAs-based...
Lenovo Integrates AI, Robotics to Deliver Smarter Retail Solutions
Lenovo introduced three new retail solutions that combine the best of robotics and artificial intelligence technologies. Premiering at NRF 2025 in...
Biden-Harris Administration Announces CHIPS Incentives Award with HP to Support Domestic Manufacturing of Next-Gen Technologies and ‘Lab-to-Fab’ Ecosystem
The Biden-Harris Administration announced that the U.S. Department of Commerce awarded HPI Federal LLC up to $53 million in direct funding under the...
Global Robot LLM Market to Exceed $100B by 2028, NVIDIA’s WFM Platform to Drive Growth
TrendForce’s latest investigations report that as humanoid robots move toward highly integrated systems and transition from industrial applications...
Micron Breaks Ground on New HBM Advanced Packaging Facility in Singapore
Micron Technology, Inc. broke ground today on a new High-Bandwidth Memory (HBM) advanced packaging facility adjacent to the company’s current...
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Argonne to Lead Two Microelectronics Research Projects Under U.S. Department of Energy Initiative
January 13, 2025 | BUSINESS WIRE
Imec Achieves Breakthrough in Silicon Photonics
January 13, 2025 | Imec
Lenovo Integrates AI, Robotics to Deliver Smarter Retail Solutions
January 13, 2025 | BUSINESS WIRE
Biden-Harris Administration Announces CHIPS Incentives Award with HP to Support Domestic Manufacturing of Next-Gen Technologies and ‘Lab-to-Fab’ Ecosystem
January 13, 2025 | U.S. Department of Commerce
Global Robot LLM Market to Exceed $100B by 2028, NVIDIA’s WFM Platform to Drive Growth
January 13, 2025 | TrendForce
Micron Breaks Ground on New HBM Advanced Packaging Facility in Singapore
January 10, 2025 | Micron
Honda, Renesas Sign Agreement to Develop High-Performance SoC for Software-Defined Vehicles
January 10, 2025 | JCN Newswire
Sony Honda Mobility, Qualcomm Extend Technology Collaboration to Bring GenAI Capabilities to Future Vehicles
January 10, 2025 | Qualcomm Technologies, Inc.
TI Launches New Edge AI-enabled Radar Sensor and Automotive Audio Processors
January 10, 2025 | Texas Instruments
Imec, Partners Show Outdoor Stability of Highly Anticipated Perovskite Solar Modules
January 10, 2025 | Imec
The Path Ahead Featuring:
- EMS Providers Should ‘Plan Prudently’ in 2025 with Dennis Reed
- The Promising Future for CEE PCB in Thailand with Tom Yang
- Tariffs and Trade Wars: What to Expect in 2025 with James Kim
- Ensuring Compliance With the U.S. CHIPS Act: Identifying the Source of Electronic Components by Dr. Eyal Weiss
- Emerging Trends in 2025 by Nolan Johnson
- My 2025 Industry Wish List by Mike Konrad
Inner Layer Precision & Yields Featuring:
- Boosting Your Inner Layer Precision and Production Outcomes by Marcy LaRont
- Revolutionizing Inner Layer Registration with Tony Faraci
- Can Changing Spray Nozzles Improve My Etch Quality? by Don Ball
- Revolutionizing PCB Testing with RoBAT with Bruce Nockton
- Statistically Testing Inner Layer Yield Improvements by Dr. Pat Valentine
The Designer of the Future Featuring:
- PCB Designers of the Future—and Their Software Tools, with David Wiens
- Dan Beeker on the Design Engineer of the Future
- The PCB Designer of the Future: Blending Innovation, Technology, and Sustainability, by Stephen Chavez
- An Inspiring Journey From Animation to PCB Design, with Melissa Martinez
- EDA Tools and the Designer of the Future, with Bob Potock
- Addressing Future Challenges for Designers, by Vern Solberg
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