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SIA Applauds CHIPS Incentives for Hemlock Manufacturing Expansion in Michigan
The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer applauding semiconductor...
Feeble ROI in 5G Network Security Market Feeling Sting of Global Economic Slowdown
According to ABI Research, a global technology intelligence firm, the slowing of the 5G network rollout in 2023 has had a knock-on effect on the...
Unlock Unmatched Performance for Matched Impedance Devices with StratEdge at IEEE BCICTS 2024
StratEdge Corporation, an industry leader in high-frequency and high-power semiconductor packaging, is excited to announce its participation in the...
Würth Elektronik Expands Ferrite Range for Electromobility Applications
With the WE-OEFA-LFS ferrite, Würth Elektronik is releasing an oval-shaped ferrite ring for interference suppression at low...
Global Silicon Wafer Shipments to Remain Soft in 2024 Before Strong Expected Rebound in 2025
Global shipments of silicon wafers are projected to decline 2% in 2024 to 12,174 million square inches (MSI) with a strong rebound of 10% delayed...
IBM Introduces Granite 3.0: High Performing AI Models Built for Business
At IBM's annual TechXchange event the company announced the release of its most advanced family of AI models to date, Granite 3.0. IBM's...
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SIA Applauds CHIPS Incentives for Hemlock Manufacturing Expansion in Michigan
October 22, 2024 | SIA
Feeble ROI in 5G Network Security Market Feeling Sting of Global Economic Slowdown
October 22, 2024 | ABI Research
Unlock Unmatched Performance for Matched Impedance Devices with StratEdge at IEEE BCICTS 2024
October 22, 2024 | StratEdge
Würth Elektronik Expands Ferrite Range for Electromobility Applications
October 22, 2024 | Wurth Elektronik
Global Silicon Wafer Shipments to Remain Soft in 2024 Before Strong Expected Rebound in 2025
October 21, 2024 | SEMI
IBM Introduces Granite 3.0: High Performing AI Models Built for Business
October 21, 2024 | IBM
KDDI Selects Samsung To Deploy Open RAN Powered by Virtualized RAN in Japan
October 21, 2024 | Samsung
IDC FutureScape: The AI Pivot Towards Becoming an AI-Fueled Business
October 21, 2024 | IDC
FIT Hon Teng Showcases AI Data Center Connectivity and Immersion-Cooled Signal Integrity Solutions at OCP Global Summit 2024
October 21, 2024 | Foxconn
Shipments of Vehicles with Satellite Connectivity to Reach 30 Million by 2034
October 18, 2024 | ABI Research
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