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SEMI North America Advisory Board Welcomes New Member From SACHEM

SEMI announced the election of a new member to the SEMI North America Advisory Board (NAAB), Rosemary Steen Hoffman, Chief Executive Officer, SACHEM,...
Interlink Electronics Reports Q1 2025 Result

Interlink Electronics, Inc., a global leader in sensor technology and printed electronic solutions, reported results for the first quarter ended March 31,...
Geopolitical Tensions Fuel a Wave of AI Chip Independence as US and Chinese CSPs Race to Develop In-House ASICs

TrendForce’s latest research reveals that the surge in demand for AI servers is accelerating the pace at which major US CSPs are developing...
ITEN, A*STAR IME Announce Breakthrough in Solid-State Battery Integration for Advanced Packaging

ITEN, a global leader in micro solid-state batteries, and A*STAR Institute of Microelectronics (A*STAR IME), a leader in advanced packaging research,...
Japan’s Sharp to Sell LCD Plant to Taiwanese Parent Company Foxconn

Japanese electronics firm Sharp Corp. announced on May 12 that it plans to sell its Kameyama No. 2 liquid crystal display plant to its Taiwanese...
Microsoft to Lay Off 6,000 Workers Across All Departments

Microsoft announced on May 13 that it is cutting 3% of its workforce, which will affect 6,000 people across all levels, teams, and...
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Join the Conversation: MESI 4.0 Summit 2025
May 15, 2025 | Critical Manufacturing
SEMI North America Advisory Board Welcomes New Member From SACHEM
May 15, 2025 | SEMI
Geopolitical Tensions Fuel a Wave of AI Chip Independence as US and Chinese CSPs Race to Develop In-House ASICs
May 15, 2025 | TrendForce
ITEN, A*STAR IME Announce Breakthrough in Solid-State Battery Integration for Advanced Packaging
May 15, 2025 | BUSINESS WIRE
Interlink Electronics Reports Q1 2025 Result
May 15, 2025 | BUSINESS WIRE
DuPont to Introduce Advanced Kalrez Sealing Innovations for Semiconductor Manufacturing at SEMICON Southeast Asia
May 15, 2025 | DuPont
Japan’s Sharp to Sell LCD Plant to Taiwanese Parent Company Foxconn
May 14, 2025 | I-Connect007
Microsoft to Lay Off 6,000 Workers Across All Departments
May 14, 2025 | I-Connect007
Indian Government Establishes Panel for New National Manufacturing Mission
May 14, 2025 | I-Connect007
Saildrone Closes $60M Financing to Bring Maritime Autonomy to Europe
May 14, 2025 | BUSINESS WIRE
Intelligent Test and Inspection Featuring:
- Breaking Down Barriers: The Connectivity of Machines in SMT Production Line, by Bill Cardoso
- Breaking Silos with Intelligence: Connectivity of Component-Level Data Across the SMT Line, by Eyal Weiss
- Innovative Technology Advancements in Test: HATS² Technology and Its Impact on Reliability Testing with GEN3 Systems
- IPC-CFX, 2.0: Expanding the Digital Backbone of Electronics Manufacturing by Chris Jorgensen
- Revolutionizing Inspection With Delvitech with Roberto Gatti
In Pursuit of Perfection: Defect Reduction Featuring:
- Preventing Surface Prep Defects and Ensuring Reliability, by Marcy LaRont
- Key Insights on Photoresist for Defect Reduction with Josh Krick and Tim Blair
- Reducing Defects in Circuit Board Production, by Don Ball
- Traceability in PCB Production, by Kurt Palmer
- Yield Improvement and Reliability, by Mike Carano
Creating the Ideal Data Package Featuring:
- Zero Touch Data Package: The Future of Seamless PCB Manufacturing by Dana Korf
- Standards: The Roadmap for a Flawless Data Handoff with Kris Moyer
- Defining the Ideal PCB Design Data Output by Stephen V. Chavez
- Design Data Packages: Circle of Concern or Circle of Influence? by John Watson
- From Dream House to Drill Files by Kelly Dack
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