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Argonne to Lead Two Microelectronics Research Projects Under U.S. Department of Energy Initiative
The U.S. Department of Energy’s (DOE) Argonne National Laboratory is managing two microelectronics studies that will support multidisciplinary...
Imec Achieves Breakthrough in Silicon Photonics
Imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, has announced a significant milestone in silicon photonics with the successful demonstration of electrically-driven GaAs-based...
Lenovo Integrates AI, Robotics to Deliver Smarter Retail Solutions
Lenovo introduced three new retail solutions that combine the best of robotics and artificial intelligence technologies. Premiering at NRF 2025 in...
Biden-Harris Administration Announces CHIPS Incentives Award with HP to Support Domestic Manufacturing of Next-Gen Technologies and ‘Lab-to-Fab’ Ecosystem
The Biden-Harris Administration announced that the U.S. Department of Commerce awarded HPI Federal LLC up to $53 million in direct funding under the...
Global Robot LLM Market to Exceed $100B by 2028, NVIDIA’s WFM Platform to Drive Growth
TrendForce’s latest investigations report that as humanoid robots move toward highly integrated systems and transition from industrial applications...
Micron Breaks Ground on New HBM Advanced Packaging Facility in Singapore
Micron Technology, Inc. broke ground today on a new High-Bandwidth Memory (HBM) advanced packaging facility adjacent to the company’s current...
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Argonne to Lead Two Microelectronics Research Projects Under U.S. Department of Energy Initiative
January 13, 2025 | BUSINESS WIRE
Imec Achieves Breakthrough in Silicon Photonics
January 13, 2025 | Imec
Lenovo Integrates AI, Robotics to Deliver Smarter Retail Solutions
January 13, 2025 | BUSINESS WIRE
Biden-Harris Administration Announces CHIPS Incentives Award with HP to Support Domestic Manufacturing of Next-Gen Technologies and ‘Lab-to-Fab’ Ecosystem
January 13, 2025 | U.S. Department of Commerce
Global Robot LLM Market to Exceed $100B by 2028, NVIDIA’s WFM Platform to Drive Growth
January 13, 2025 | TrendForce
Micron Breaks Ground on New HBM Advanced Packaging Facility in Singapore
January 10, 2025 | Micron
Honda, Renesas Sign Agreement to Develop High-Performance SoC for Software-Defined Vehicles
January 10, 2025 | JCN Newswire
Sony Honda Mobility, Qualcomm Extend Technology Collaboration to Bring GenAI Capabilities to Future Vehicles
January 10, 2025 | Qualcomm Technologies, Inc.
TI Launches New Edge AI-enabled Radar Sensor and Automotive Audio Processors
January 10, 2025 | Texas Instruments
Imec, Partners Show Outdoor Stability of Highly Anticipated Perovskite Solar Modules
January 10, 2025 | Imec
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