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Trane Technologies Completes Acquisition of BrainBox AI
Trane Technologies, a global climate innovator, announced that it has completed the acquisition of BrainBox AI, a pioneer in autonomous HVAC controls...
GlobalFoundries, IBM Announce Settlement and Resolution of All Litigation Matters
GlobalFoundries (GF) and IBM announced that the two companies have reached a settlement in their ongoing lawsuits, resolving all litigation matters,...
Analysts: 54 Trends That Will Shape the Technology Market
As 2025 kicks off, predictions abound on the technology innovations expected in the year ahead. In its new whitepaper, 101 Technology Trends That...
Tata Elxsi to Accelerate SDV Adoption With Qualcomm's Snapdragon Automotive Platforms
Tata Elxsi, Inc. has announced its plans to work with Qualcomm Technologies, Inc. to develop and leverage virtual models of Snapdragon® Digital...
Vortex Companies Acquires Trenchless and UV Equipment Innovator ETECAS UG
The Vortex Companies, LLC (Vortex) announced the acquisition of ETECAS UG (ETECAS), a Germany-based leader in trenchless rehabilitation and UV curing...
Laser Photonics, Fonon Technologies Deliver Training at Pearl Harbor Naval Shipyard & IMF for Effective Use of Laser Technology
Laser Photonics Corporation (LPC), a leading global developer of industrial laser systems for cleaning and other material processing applications, in...
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Trane Technologies Completes Acquisition of BrainBox AI
January 3, 2025 | BUSINESS WIRE
GlobalFoundries, IBM Announce Settlement and Resolution of All Litigation Matters
January 3, 2025 | GlobalFoundries
Analysts: 54 Trends That Will Shape the Technology Market
January 3, 2025 | ABI Research
Tata Elxsi to Accelerate SDV Adoption With Qualcomm's Snapdragon Automotive Platforms
January 3, 2025 | PRNewswire
Vortex Companies Acquires Trenchless and UV Equipment Innovator ETECAS UG
January 3, 2025 | PRNewswire
Laser Photonics, Fonon Technologies Deliver Training at Pearl Harbor Naval Shipyard & IMF for Effective Use of Laser Technology
January 3, 2025 | BUSINESS WIRE
Universal Electronics Inc. Expands UEI TIDE Family Portfolio with New Features and Capabilities
January 2, 2025 | BUSINESS WIRE
AEM Appoints Kwek You-Cheer as Chief Financial Officer
January 2, 2025 | AEM Holdings Ltd.
ONDA Sets up Joint Venture in UAE to Speed up Expansion into the Middle East
January 1, 2025 | BUSINESS WIRE
Knowles Completes the Sale of Its Consumer MEMS Microphone Business to Syntiant
January 1, 2025 | BUSINESS WIRE
The Path Ahead Featuring:
- EMS Providers Should ‘Plan Prudently’ in 2025 with Dennis Reed
- The Promising Future for CEE PCB in Thailand with Tom Yang
- Tariffs and Trade Wars: What to Expect in 2025 with James Kim
- Ensuring Compliance With the U.S. CHIPS Act: Identifying the Source of Electronic Components by Dr. Eyal Weiss
- Emerging Trends in 2025 by Nolan Johnson
- My 2025 Industry Wish List by Mike Konrad
Inner Layer Precision & Yields Featuring:
- Boosting Your Inner Layer Precision and Production Outcomes by Marcy LaRont
- Revolutionizing Inner Layer Registration with Tony Faraci
- Can Changing Spray Nozzles Improve My Etch Quality? by Don Ball
- Revolutionizing PCB Testing with RoBAT with Bruce Nockton
- Statistically Testing Inner Layer Yield Improvements by Dr. Pat Valentine
Advanced Packaging and Stackup Design Featuring:
- Effects of Advanced Packaging on Stackup Design, with Kris Moyer
- Are Our Rules No Longer Valid? by Cherie Litson
- AI-driven Inverse Stackup Optimization, by Barry Olney
- Advanced Packaging Technologies: Look Before You Leap, by Kelly Dack
- Advanced Semiconductor Packaging Impact on PCB Stackup, by Vern Solberg
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