Target Condition: Flex and Rigid-flex Solutions in A&D Display Electronics
Global PCB Connections: Rigid-flex and Flexible PCBs—The Backbone of Modern Electronics
Qnity Receives Zhen Ding 2026 Distinguished Contribution Award
Qnity Electronics, Inc., a premier technology solutions leader across the semiconductor value chain, announced it has received the 2026 Distinguished...
PCB People Reports Record-breaking First Half as PCB Supply Chain Pressure Intensifies
Record first-half performance driven by surge in demand from Electronic Manufacturers supports rapid customer growth, with new customers up 30% and...
Flexible PCB Market to Reach $41.7 Billion by 2030, Growing at 12.3% CAGR
The Flexible PCB Market, valued at USD 23.3 Billion in 2025, is projected to reach USD 41.7 Billion by 2030, growing at a CAGR of...
Arlon Electronic Materials is Hiring a Technical Sales Manager
Arlon EMD is hiring a Technical Sales Manager to drive growth across the U.S. defense, aerospace, and high-reliability electronics...
Amphenol Trackwise Announces Record-Breaking 100-Metre Multi-Layer Flexible Circuit for Industrial Customer
Amphenol Trackwise Designs, a global leader in the design and manufacture of advanced flexible printed circuit boards (PCBs), has announced the...
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Flexible Thinking: ‘Let There Be Light’–Emitting Diodes!
July 27, 2026 | Joe Fjelstad, Flexible Thinking
Display technology has become ubiquitous in today’s electronic products, driven largely by smartphones. This touchscreen technology increasingly dominates our means of communication, both for voice and text. Our connection to the world outside our homes, cars, and offices is now enjoyed 24/7 via the internet, to which they are invariably connected. In terms of time and rate of social change, such devices have gone from “nice to have” to “indispensable” in the seeming blink of the proverbial eye.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
July 23, 2026 | Marcy LaRont, I-Connect007
In this week’s top five must-reads, I chose articles that go from big business questions (to diversify or not), to important technical issues such as DFM errors made in creating HDI designs using ELIC and design for test, to a discussion around some of the power and thermal considerations in advanced packaging, and the fact that they are now, firmly, performance enablers, not after-the-fact elements to be managed in fabrication.
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