Eltek Receives Purchase Orders Totaling $3.5 Million
Eltek Ltd., a global manufacturer and supplier of technologically advanced solutions in the field of printed circuit boards, announced that it...
nano3Dprint Unveils Cutting-Edge Conductive Silver Ink Products in Collaboration with Creative Materials
nano3Dprint, a leading additive manufacturing and printed electronics solutions provider, is thrilled to announce the launch of its groundbreaking...
CEE PCB Appoints Jerome Larez to Field Application Engineer North America
Tom Yang, CEO of CEE PCB, has appinted industry veteran Jerome Larez to the position of Field Application Engineer (FAE) North...
Smartkem to Present at The International Conference on Flexible and Printed Electronics (ICFPE) 2024
The presentation, given by Smartkem Head of Technology Transfer, Steven Tsai, will take place during a session titled "Flexible and Printed...
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I-Connect007 Editor's Choice: Five Must-Reads for the Week
August 30, 2024 | Andy Shaughnessy, Design007 Magazine
There’s a lot going on in our industry right now. As you’ll see in today’s must-reads, there’s even innovation taking place in drill bit development. We also have articles on cutting costs during the design process, as well as a handy guide to each country’s tech sweet spots, and what it takes to thrive in this segment. Don’t miss our ode to the CAM department, which is where the rubber meets the road for every PCB.
Asymmetric Hybrid Printed Circuit Board Design: Warpage Considerations
August 27, 2024 | Kaspar Tsang, Gause Hu, Jimmy Hsu, Aje Chang, Alan Sun, Brian Ho, Ryan Chang, and Thonas Su
The printed circuit board (PCB) accounts for a significant portion of the PCBA’s (printed circuit board assembly) BOM (bill of material) cost. Designs with hybrid PCB stackup are adopted to reduce the cost of the PCB by using less expensive laminate materials in layers that do not have routings for high-speed signals (e.g., power and ground layers). The conventional hybrid PCB stackup design is symmetrical in the middle. This engineering technique has been employed in the data center industry for quite some time. To extend the idea and optimize the purpose of hybrid PCB stackup design, the feasibility of an asymmetric hybrid stackup is currently being studied.
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- From Silicon to Systems, with M. Kelly, D. Iyer, and K. Moyer
- PCB Designers: ‘Level Up’ IC, Packaging Knowledge, with Soo Lan Cheah
- Integrated Circuit to PCB Integration, by Barry Olney
- Silicon to Systems: Collaboration Between IC and PCB Design Continues, with Stephen Chavez
- Cross-domain Design: The Key to Managing Complex Methodologies, with John Park
- Silicon to Systems: A Wake-up Call for the Industry, with D.Benson