Global PCB Connections: Rigid-flex and Flexible PCBs—The Backbone of Modern Electronics
Flexible Thinking: The Key to a Successful Flex Circuit Design Transfer
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
IBIDEN Earns Recognition in FTSE Russell ESG Indexes, Reinforcing Commitment to Sustainable Growth
IBIDEN Co, Ltd. is pleased to announce that it has been selected for FTSE4Good Index Series for the tenth consecutive year, FTSE Blossom Japan Index...
Flexible Electronics Market to Reach $66.9 Billion by 2032, Growing at a CAGR of 9.2% from 2025
The flexible electronics market is projected to reach $66.9 billion by 2032, up from an estimated $38.4 billion in 2025, growing at a robust CAGR of...
Reflections and Priorities: An Update to I-Connect007 Readers
The electronics and manufacturing industry is evolving rapidly—with new technologies, deeper global connections, and a growing drive toward...
ASC Sunstone Circuits and Screaming Circuits Partner to Launch Online Assembly Parts Ordering – A New Step Toward Seamless PCB Production
In a major step toward simplifying the PCB manufacturing and assembly process, ASC Sunstone Circuits and Screaming Circuits are proud to announce the...
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Facing the Future: Time for Real Talk, Early and Often, Between Design and Fabrication
July 8, 2025 | Prashant Patel, Facing the Future
There has always been a subtle but significant divide between those who design and those who build printed circuit boards. It’s not a hostile gap, but it is a real one, and in today’s high-speed, high-complexity, high-stakes environment, that gap is costing us more than time and yield. It’s costing us innovation.
Symposium Review: Qnity, DuPont, and Insulectro Forge Ahead with Advanced Materials
July 2, 2025 | Barb Hockaday, I-Connect007
In a dynamic and informative Innovation Symposium hosted live and on Zoom on June 25, 2025, representatives from Qnity (formerly DuPont Electronics), DuPont, and Insulectro discussed the evolving landscape of flexible circuit materials. From strategic corporate changes to cutting-edge polymer films, the session offered deep insight into design challenges, reliability, and next-gen solutions shaping the electronics industry.
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