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P&R Measurement Showcases AI-Empowered Solutions at CES 2025
P&R Measurement, a leader in precision measurement and control solutions, is set to make a groundbreaking announcement at CES 2025, taking place from...
North American PCB Industry Sales Up 4.7 Percent in November
IPC announced today the November 2024 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands...
Flexible Printed Circuit Boards Market Expected to Reach $51.05 Billion by 2031 at a CAGR of 11.2%
A new report by Coherent Market Insights forecasts the global flexible printed circuit boards (FPCB) market to reach $51.05 billion by 2031,...
The Companion Guide to 'Designing for Reality' by Matt Stevenson Now Available
I-Connect007 is excited to announce the release of "The Companion Guide to...Designing for Reality," written by Matt Stevenson of ASC Sunstone...
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BOOK EXCERPT: The Printed Circuit Designer's Guide to... DFM Essentials, Chapter 3
January 2, 2025 | I-Connect007
In chapter 3, Anaya Vardya discusses controlled impedance PCB design, covering trace structures, impedance factors, modeling software, multiple impedance considerations, guidelines to minimize costs, and testing requirements.
Happy New Year From I-Connect007
January 1, 2025 | Nolan Johnson, I-Connect007
As I-Connect007 observes the New Year’s Day holiday, we also wish you and yours a prosperous new year. We will be back covering the news of the industry tomorrow, January 2, 2025, according to the Gregorian calendar.
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Advanced Packaging and Stackup Design Featuring:
- Effects of Advanced Packaging on Stackup Design, with Kris Moyer
- Are Our Rules No Longer Valid? by Cherie Litson
- AI-driven Inverse Stackup Optimization, by Barry Olney
- Advanced Packaging Technologies: Look Before You Leap, by Kelly Dack
- Advanced Semiconductor Packaging Impact on PCB Stackup, by Vern Solberg
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