Flex Connections: Material Selection in Nickel vs. Copper Tabs
Flex Connections: Four Lessons in Engineering Judgment for PCB Designers
Flexible Thinking: ‘Let There Be Light’–Emitting Diodes!
American Standard Circuits to Showcase Complete PCB Manufacturing Solutions at SMTA International 2026
From Quick-Turn Prototypes to Advanced High-Reliability PCBs, ASC Sunstone Delivers the Technology, Expertise, and Customer Support Today's...
Merlin Circuit Technology Re-Certified to ISO 14001
Merlin Circuit Technology has successfully achieved re‑certification to ISO 14001, reaffirming our commitment to responsible environmental...
Matrix Electronics Expands European Operations with Reiskirchen, Germany Office and Warehouse
Matrix Electronics is pleased to announce the continued expansion of its European operations with the establishment of Matrix Electronics GmbH in...
Merlin Circuit Technology Announces Promotion of Jonathan Jones to Technical Manager
Merlin Circuit Technology Ltd. is delighted to announce the promotion of Jonathan Jones to Technical...
I-Connect007 Releases Episode 3 of Qnity Podcast Series, Engineering What’s Next
I-Connect007 is pleased to announce the release of the third episode of Engineering What’s Next, a six-part podcast series. In this episode,...
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
October 16, 2026 | Michelle Te, I-Connect007
Working from home really has its perks, especially when it comes to driving. I don’t miss the commute time, driving in the rain, or having to maneuver around everyone else going to work or coming home. Simply popping up to my desk in the morning is such a benefit. But what I do miss is being physically with my coworkers and the interactions that can happen when you’re all together. You just don’t get the synergy over a Teams call that you can get in person. Even more, being together fosters a sense of camaraderie you can’t get any other way.
From Substrates to Systems: A Preview of the October Advanced Electronics Packaging Digest
October 14, 2026 | I-Connect007
The October issue of Advanced Electronics Packaging Digest examines the technologies, investments, and strategic decisions shaping the future of advanced electronics manufacturing. From the evolution of semiconductor scaling and the integration challenges of high-frequency systems to the expansion of semiconductor capabilities in the United States and India, this issue explores how materials, packaging architectures, and manufacturing infrastructure are becoming interconnected.
MORE ARTICLES
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
