Flexible Thinking: Designing Flex Circuits for Dynamic Reliability
Global PCB Connections: Rigid-flex and Flexible PCBs—The Backbone of Modern Electronics
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Breaking News: What’s Next for PCB Materials? I-Connect007 Podcast Series Turns to Supply Chain Resilience
I-Connect007 continues its six-part podcast series with Isola experts titled, PCB Materials: The Backbone and Future of Electronics, with the...
April Issue of I-Connect007 Magazine: Beyond the Rulebook
In this month’s I-Connect007 Magazine, we asked PCB designers, fabricators, and suppliers what it really means to operate without a rulebook. Their...
I-Connect007 Releases Episode 4 of ‘PCB Materials: The Backbone and Future of Electronics’ Podcast Series
I-Connect007 is excited to announce the release of Episode 4 in its six-part podcast series with Isola experts, PCB Materials: The Backbone and...
ASC Sunstone Circuits Implements Smart Parts Technology at Mulino Facility to Enhance PCB Manufacturing Efficiency
ASC Sunstone Circuits, a division of American Standard Circuits, has implemented Smart PartsTM Classics technology at its Mulino, Oregon,...
Global Electronics Association Announces New Board Members at APEX EXPO 2026
At the 69th Global Electronics Association Annual Meeting on March 17, held in conjunction with APEX EXPO 2026, the Association’s Board of...
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Applications, Challenges, and the Future of Flex–Packaging Integration, Part 2
April 16, 2026 | Anaya Vardya, American Standard Circuits
In the second of this two-part series, Anaya Vardya of American Standard Circuits examines applications, challenges, manufacturing considerations, and future trends emerging from the convergence of flexible printed circuit boards and advanced semiconductor packaging. Applications driving the convergence include consumer electronics, automotive systems, medical, wearables, aerospace and more.
AI, Connectivity, and Systems-Level Thinking: New Frontiers in Advanced Packaging
April 16, 2026 | I-Connect007 Editorial Team
The upcoming issue of Advanced Electronics Packaging Digest examines key developments shaping the next phase of electronics innovation, from the reliability challenges of AI-driven packaging to emerging connectivity standards and the broader systems-level implications of artificial intelligence.
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