FEATURED NEWS AND INFORMATION:
FEATURED ARTICLES AND COLUMNS:

The third issue of Advanced Electronics Packaging Digest launches Monday, November 17. This issue continues AEPD’s mission to deliver forward-looking analysis and insider perspectives on the technologies reshaping advanced electronics packaging. Among the highlights is a review of IMPACT 2025, where discussions on component-to-system-level integration took center stage as experts explored the challenges and breakthroughs driving advanced packaging technologies.

The Technical Backbone of an EMS Company: A CEO’s Perspective

November 12, 2025 | Jay Rupani, Precision PCB

As the CEO of an EMS company, I often say that our business runs on precision, innovation, and trust. Behind every finished product—whether it’s a medical device, an automotive control module, or a consumer gadget—lies a sophisticated technical ecosystem that makes it all possible. From design support and process engineering to automation, data analytics, and supply chain integration, the technical side of EMS is where our value truly shines.

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