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I-Connect007 Editor’s Choice: Five Must-Reads for the Week

October 18, 2024 | Nolan Johnson, SMT007 Magazine

Occasionally, I’ll intentionally select items for this list that follow a theme. Sometimes, as they did this week, themes assert themselves. The component supply chain and sourcing seem to dominate our coverage this week. We’ve got an update from IPC Government Relations, an interview with counterfeiting watchdog ERAI, the 10 global sourcing rules, a course on AI and machine learning in the EMS sector, and warehouse management.

Optimizing mSAP to Produce Flex for Biofluid Sensor Probes

October 17, 2024 | Dean Neuburger,  Sheldahl Flexible Technologies

Improvements in flexible printed circuitry technology offer solutions that enable advancement in other technologies, enabling new circuit design and capability possibilities for customers’ applications. This article will overview advancements developed and implemented to produce a flexible circuit that meets new and challenging requirements for a customer’s medical application. This discussion will highlight development ideas more than details about the final processing scheme.




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Elementary, Mr. Watson: The Gooey Centers of Hybrid PCB Designs

October 9, 2024 | John Watson, Elementary, Mr. Watson

Anyone who knows me knows that I have a special relationship with food. Taking a twist on the words of Will Rogers, "I never met a buffet I didn't like." A balanced diet, to me, means having cupcakes in both hands. One of my favorite...

The Shaughnessy Report: Are You Partial to Partial HDI?

October 8, 2024 | Andy Shaughnessy, The Shaughnessy Report

Sometimes, a little technology is all you need. Star Trek’s Borg character only needs a funky eyepiece contraption to access all The Collective’s data, like an outer space Wi-Fi. Like the Borg’s eyepiece, we may only need a...

Designer's Notebook: Heterogeneous Integration and High-density SiP Technologies

October 3, 2024 | Vern Solberg, Designer's Notebook

Often, our primary goal is to maximize product functionality without increasing product size. Developing a multifunction silicon-based semiconductor (system-on-chip) for a specific product application, however, requires a significant...

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