Global PCB Connections: Mission Critical—Communication Between PCB Designers and Fabricators
EMA Presents Webinar on Designing the Perfect Stackup for Flex
Join the experts at Newgrange Design and EMA to make sure you set your next flex project up for success from the beginning in latest...
Altium to Unveil Groundbreaking Industry Solution at Electronica 2024
Altium, a global leader in electronics design and lifecycle management, is set to introduce three transformative product offerings at the upcoming...
Keysight Collaborates with Siemens EDA to Enable the Next Generation of Wireless Design
Keysight Technologies, Inc. and Siemens EDA have teamed up to accelerate the efficiency of wireless and defense system...
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Book Excerpt: The Printed Circuit Designer’s Guide to... DFM Essentials, Ch. 1
October 25, 2024 | I-Connect007
The guidelines offered in this book are based on both ASC recommendations and IPC standards with the understanding that some may require adjustment based on the material set, fabricator processes, and other design constraints. This chapter details high-frequency materials, copper foil types, metal core PCBs, and the benefits of embedded capacitance and resistor materials in multilayer PCBs.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
October 25, 2024 | Marcy LaRont, I-Connect007
Just this month, the Fall issue of IPC Community was released, spotlighting the global activities of IPC and its members. SMT007 Magazine covers the scary situation around counterfeit components. Design007 Magazine is not playing tricks with its hard-hitting discussions about “partial HDI.” (If you are asking yourself what that is, you really need to take a look.) Finally, PCB007 Magazine’s alternate metallization issue offers some real treats, including an interview featured this past week with Carmichael Gugliotti of MacDermid Alpha. In you’re in the U.S., here’s to an early Happy Halloween.
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Designers Notebook: Implementing HDI and UHDI Circuit Board Technology
October 23, 2024 | Vern Solberg, Designer's Notebook
To accommodate new generations of high I/O semiconductor packaging, circuit board technology has undergone significant changes in both the fabrication process method and the criteria for base material selection. The reason behind...
Connect the Dots: Designing for Reality—Pattern Plating
October 16, 2024 | Matt Stevenson, Connect the Dots
In the previous episode of I-Connect007’s On the Line with… podcast, we painted the picture of the outer layer imaging process. Now we are ready for pattern plating, where fabrication can get tricky. The board is now ready to...
Elementary, Mr. Watson: The Gooey Centers of Hybrid PCB Designs
October 9, 2024 | John Watson, Elementary, Mr. Watson
Anyone who knows me knows that I have a special relationship with food. Taking a twist on the words of Will Rogers, "I never met a buffet I didn't like." A balanced diet, to me, means having cupcakes in both hands. One of my favorite...
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