Flexible Thinking: Beyond DFM—PCB Design and Manufacturing as a Cooperative Effort
Synopsys Posts Financial Results for Q3 Fiscal Year 2026
Synopsys, Inc. reported results for its third quarter of fiscal year 2026. Revenue for the third quarter of fiscal year 2026 was $2.477 billion,...
Two Teams Tie for Top Honors in Bright Electronics Manufacturing Challenge 2026 Round 1
The Electronics Manufacturing & Assembly Collaborative (EMAC) announced the Round 1 results of the Bright Electronics Manufacturing Challenge 2026,...
PCB West Panel to Take On What’s Next for PCB Design
The Printed Circuit Engineering Association (PCEA) has announced a panel discussion on the technologies reshaping printed circuit board design over...
Ventec’s Glass-Free Revolution: Smarter Material Data for Next-Gen PCB Designs
At Ventec, we’re excited to see our Glass-Free Bondply materials now included in the latest release of Polar Instruments’...
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I-Connect007 Observes Labor Day Holiday With Office Closure
September 4, 2026 | I-Connect007
In the U.S, the Labor Day holiday arrives as the unofficial end to summer, but its roots run much deeper (and a little darker, if you’re a student of U.S. history) The first observance was held in New York City on Sept. 5, 1882, when thousands of workers marched in a parade organized by the Central Labor Union. Numerous states recognized Labor Day prior to Congress establishing it as a federal holiday in 1894. At its heart, the contemporary Labor Day holiday recognizes the workers whose skill, persistence, and ingenuity have built the nation’s prosperity.
Designers Notebook: Implementing Strategic Planning Principles for PCB Design
September 3, 2026 | Vern Solberg, Designer's Notebook
Developing multiple-processor system-level products involves a broad range of engineering disciplines (commonly referred to as co-design), often led by a designated program manager who divides the development program into technical disciplines. The primary member of this team is the electrical engineer (EE), who prepares the overall schematic diagram of the product. This effort includes simulation and modeling, developing a BOM, and defining all active components and any specialized passive elements (often stipulating preferred or prequalified sources).
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Elementary, Mr. Watson: Inside the Display Power Loop
August 6, 2026 | John Watson, Elementary, Mr. Watson
In my previous column, I traced the evolution from fixed physical interfaces to dynamic, software-defined displays, and saw how a familiar model of input and output slowly gave way to something far more fluid. That foundation begs the...
Powering the Future: Performance Is Won in Assembly
August 5, 2026 | Brian Buyea, Powering the Future
There’s a moment in every design cycle when the conversation shifts from the elements of a substrate—material selection, thermal conductivity, circuit density, layout, and performance on paper—to how it performs in assembly. No...
Connect the Dots: Total Value Manufacturing Solutions
July 30, 2026 | Matt Stevenson, Connect the Dots
In my last column, I discussed total value management, an approach to the quality-versus-cost balancing act that integrates components of total quality management (TQM) and Lean manufacturing. Like those other methodologies, total...
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