Powering the Future: Performance Is Won in Assembly
Polar's Speedstack Eases Material Identification and Adds Ventec Glass-Free Materials
Polar’s Speedstack mid-year release adds Ventec Glass-Free materials to online resources, and incorporates improved capability of identifying multi...
CELUS, Variscite and NXP Enable AI-Driven Embedded Design
CELUS, the AI-driven electronics design automation provider, announced a strategic partnership with Variscite, a leading provider in the System on...
Global Electronics Association Brings IPC Builds Standards Development Event to Paris
The global electronics industry will gather in Paris this September to help shape the standards that define how electronics are designed, built,...
Will Your Vias Survive the Heat? New Book From I-Connect007 Has the Answers
I-Connect007 is excited to announce the release of The Printed Circuit Assembler's Guide to... Via Structures: Reflow Process Survivability,...
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A Practical Approach to Material Selection for High Power PCBs
August 13, 2026 | Drew Delaney, Isola Group
With AI server architectures demanding high-power converter solutions to improve power efficiency and affordability, PCB design can challenge engineers who treat material selection as a single-variable problem. Pick a laminate for thermal conductivity, and you may experience a CTE mismatch that cracks vias after 50 thermal cycles. Optimize for dielectric loss, and you might sacrifice the isolation margin your certification depends on. High-power boards require consideration of multiple variables, including electrical, thermal, mechanical, reliability, and manufacturability, which cannot be optimized alone.
Understanding Design for Display Electronics
August 12, 2026 | Marcy LaRont, I-Connect007 Magazine
For Kristin Moyer, designing display electronics is all about scale. As displays shrink in size and grow in resolution, every engineering decision becomes more demanding. In this interview, the Global Electronics Association design instructor explains the strengths and limitations of today’s dominant display technologies—LCD and LED—as well as the emerging role of AR/VR displays. Kristin also explores the PCB design, manufacturability, and reliability challenges that accompany each.
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Connect the Dots: Total Value Manufacturing Solutions
July 30, 2026 | Matt Stevenson, Connect the Dots
In my last column, I discussed total value management, an approach to the quality-versus-cost balancing act that integrates components of total quality management (TQM) and Lean manufacturing. Like those other methodologies, total...
Fresh PCB Concepts: IPC-6012 Class 3 and High-reliability PCB Manufacturing
July 23, 2026 | Team NCAB, Fresh PCB Concepts
IPC-6012 Class 3 is widely recognized as the benchmark for high-reliability manufacturing. Compared to Class 2, it establishes tighter requirements for plated holes, annular rings, copper wrap, conductor integrity, and inspection...
Elementary, Mr. Watson: The Display Revolution, Now With Fewer Tiny Keys
July 23, 2026 | John Watson, Elementary, Mr. Watson
From the earliest days of electronics, engineers have worked within some shared assumptions about how systems should be built and how people should interact with them. These assumptions often feel so natural that they are rarely...
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