-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueAdvanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
IPC Announces New Training Course: PCB Design for Military & Aerospace Applications
IPC announced the launch of a new training course: PCB Design for Military & Aerospace...
The Companion Guide to 'Designing for Reality' by Matt Stevenson Now Available
I-Connect007 is excited to announce the release of "The Companion Guide to...Designing for Reality," written by Matt Stevenson of ASC Sunstone...
Cadence Appoints Moshe Gavrielov to Board of Directors
Cadence Design Systems, Inc. announced the appointment of Moshe Gavrielov to its board of directors, effective January 1, 2025. Mr. Gavrielov...
Click Here for More News
We search high and low to find the best news for you, our valuable readers…
If you have news you would like to publish here please send your news item to: news@iconnect007.com
Click here for press release tips
UHDI Fundamentals: UHDI Bleeding-edge Manufacturing Applications, Part 2
December 23, 2024 | Anaya Vardya, American Standard Circuits
Ultra high-density interconnect (UHDI) technology is transforming manufacturing by enabling compact, high-performance, and energy-efficient electronics in cutting-edge industrial systems. Its precision and scalability meet the demands of advanced manufacturing technologies. Here's another overview of bleeding-edge UHDI applications in manufacturing.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
December 20, 2024 | Nolan Johnson, I-Connect007
Hey, wait a minute, this is the lead-up to the penultimate holiday week, so why is the news cycle so busy? Normally, this period of time—what with all the holiday distraction—is when companies either go quiet or publish press releases covering those throwaway news items. Instead, this week brought in so much important news that I had to be quite discerning in my choices. Newsletter subscribers definitely got a lot of news this week.
MORE ARTICLES
Elementary Mr. Watson: How to Reinvent Your Professional Journey
December 18, 2024 | John Watson, Elementary, Mr. Watson
The end of the year is the perfect time to reflect and embrace the significance of this moment. This season is not simply a milestone marking the end of one chapter and the beginning of another; it’s an opportunity to acknowledge...
Fresh PCB Concepts: PCB Plating Process Overview
December 12, 2024 | Team NCAB, Fresh PCB Concepts
In this installment of Fresh PCB Concepts, Mike Marshall takes the helm stating: PCBs have been the platform for the interconnection of electronic components for decades. Because of process costs and other constraints, such as...
The Shaughnessy Report: A Stack of Advanced Packaging Info
December 10, 2024 | Andy Shaughnessy, The Shaughnessy Report
It’s only fitting that this issue on advanced packaging and stackup features a “stackup” of “packages” on the cover. There’s certainly a lot to “unpack” in this issue. As advanced packaging moves further into the...
Are you missing out?
Customize your section here.
Edit List Settings
- Effects of Advanced Packaging on Stackup Design, with Kris Moyer
- Are Our Rules No Longer Valid? by Cherie Litson
- AI-driven Inverse Stackup Optimization, by Barry Olney
- Advanced Packaging Technologies: Look Before You Leap, by Kelly Dack
- Advanced Semiconductor Packaging Impact on PCB Stackup, by Vern Solberg