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Current IssueAdvanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
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Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
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Advanced Packaging and Stackup Design: December 2024—Design007 Magazine
In this month's issue,, we asked our expert contributors to discuss the impact of advanced packaging on stackup design—from SI and DFM challenges...
PCB Design Software Market Expected to Hit $9.2B by 2031
This report provides an overview of the PCB design software market, detailing key market drivers, challenges, technological advancements, regional...
Siemens Unveils Next Generation AI-enhanced Electronic Systems Design Software
Siemens Digital Industries Software announced today the latest advancement in its electronic systems design portfolio. The next generation release...
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Real Time with... electronica 2024: STARTEAM GLOBAL Meeting Challenges Head-on
December 11, 2024 | Real Time with... electronica
STARTEAM GLOBAL CEO Daniel Jacob and CTO Martin Schneider speak with Pete Starkey at electronica 2024 about their global presence in China, Thailand, and Europe, and how additive manufacturing and inkjet printing are keeping this PCB manufacturer at the forefront of technology. They’re excited about sustainability, the future, and competing on the world stage.
The Shaughnessy Report: A Stack of Advanced Packaging Info
December 10, 2024 | Andy Shaughnessy, The Shaughnessy Report
It’s only fitting that this issue on advanced packaging and stackup features a “stackup” of “packages” on the cover. There’s certainly a lot to “unpack” in this issue. As advanced packaging moves further into the mainstream of PCB design, more PCB designers and design engineers are realizing this isn’t a plug-and-play technology. As we see in this issue, advanced packaging can have an impact on the entire design—the stackup in particular.
MORE ARTICLES
Fresh PCB Concepts: PCB Design Essentials for Electric Vehicle Charging
November 27, 2024 | Team NCAB, Fresh PCB Concepts
Electric vehicles (EVs), powered by electricity rather than fossil fuels, are transforming transportation and reducing environmental impacts. But what good is an EV if it can't be easily charged? In this month's column, Ramon Roche...
Elementary, Mr. Watson: Rules of Thumb—Guidelines vs. Principles for PCB Design
November 26, 2024 | John Watson, Elementary, Mr. Watson
The infamous "rules of thumb" are simple guidelines that help you make decisions based on experience, not exact facts. They’re like shortcuts we use because they work most of the time. For example, if you want to know if spaghetti...
Beyond Design: High-speed Rules of Thumb
November 21, 2024 | Barry Olney, Beyond Design
The idiom “rule of thumb” is often used in electronics design and has its origins in the practice of measuring roughly with one’s thumb. Rules of thumb are easy-to-remember, broadly accurate guides or principles based on...
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- Effects of Advanced Packaging on Stackup Design, with Kris Moyer
- Are Our Rules No Longer Valid? by Cherie Litson
- AI-driven Inverse Stackup Optimization, by Barry Olney
- Advanced Packaging Technologies: Look Before You Leap, by Kelly Dack
- Advanced Semiconductor Packaging Impact on PCB Stackup, by Vern Solberg