FEATURED NEWS AND INFORMATION:
FEATURED ARTICLES AND COLUMNS:

UHDI Fundamentals: UHDI Bleeding-edge Manufacturing Applications, Part 2

December 23, 2024 | Anaya Vardya, American Standard Circuits

​​​​​​​Ultra high-density interconnect (UHDI) technology is transforming manufacturing by enabling compact, high-performance, and energy-efficient electronics in cutting-edge industrial systems. Its precision and scalability meet the demands of advanced manufacturing technologies. Here's another overview of bleeding-edge UHDI applications in manufacturing.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

December 20, 2024 | Nolan Johnson, I-Connect007

Hey, wait a minute, this is the lead-up to the penultimate holiday week, so why is the news cycle so busy? Normally, this period of time—what with all the holiday distraction—is when companies either go quiet or publish press releases covering those throwaway news items. Instead, this week brought in so much important news that I had to be quite discerning in my choices. Newsletter subscribers definitely got a lot of news this week. 




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Elementary Mr. Watson: How to Reinvent Your Professional Journey

December 18, 2024 | John Watson, Elementary, Mr. Watson

The end of the year is the perfect time to reflect and embrace the significance of this moment. This season is not simply a milestone marking the end of one chapter and the beginning of another; it’s an opportunity to acknowledge...

Fresh PCB Concepts: PCB Plating Process Overview

December 12, 2024 | Team NCAB, Fresh PCB Concepts

In this installment of Fresh PCB Concepts, Mike Marshall takes the helm stating: PCBs have been the platform for the interconnection of electronic components for decades. Because of process costs and other constraints, such as...

The Shaughnessy Report: A Stack of Advanced Packaging Info

December 10, 2024 | Andy Shaughnessy, The Shaughnessy Report

It’s only fitting that this issue on advanced packaging and stackup features a “stackup” of “packages” on the cover. There’s certainly a lot to “unpack” in this issue. As advanced packaging moves further into the...

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