Connect the Dots: Designing for the Future of Manufacturing Reality—Solder Mask and Legend
Happy’s Tech Talk #47: Automation for Complex Multilayer Fabrication Stackups
ESD Alliance Reports Electronic System Design Industry Posts $5.5 Billion in Revenue in Q4 2025
Electronic System Design (ESD) industry revenue increased 10.3% to $5,466.3 million in the fourth quarter of 2025 from the $4,955.2 million...
April Issue of I-Connect007 Magazine: Beyond the Rulebook
In this month’s I-Connect007 Magazine, we asked PCB designers, fabricators, and suppliers what it really means to operate without a rulebook. Their...
I-Connect007 Releases Episode 4 of ‘PCB Materials: The Backbone and Future of Electronics’ Podcast Series
I-Connect007 is excited to announce the release of Episode 4 in its six-part podcast series with Isola experts, PCB Materials: The Backbone and...
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From AI to AEP, an Impressive Array of Keynotes at APEX EXPO 2026
April 17, 2026 | Marcy LaRont and Nolan Johnson, I-Connect007
Each year at APEX EXPO, the Global Electronics Association provides an impressive lineup of keynote speakers to kick off the largest electronics manufacturing event in North America. This year included four keynote speeches, on topics ranging from the promise and peril of AI to the power of electronics, quantum computing, and the importance of heterogeneous integration in advanced electronics packaging.
PHOTO GALLERY: Putting in the Work on Standards, Professional Development
April 16, 2026 | I-Connect007
Behind every standard, innovation, and step forward in electronics are the people who show up to do the work. This week's photo gallery highlights the attendees who filled meeting rooms and classrooms throughout APEX, collaborating on standards development committees, sharing expertise, and investing in their own growth through professional development. These are the faces of progress, gathered not just to learn, but to contribute and shape what comes next.
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Target Condition: An Exploration of Flooding PCB Layers
April 2, 2026 | Kelly Dack, Target Condition
The concept of flooding PCB layers with copper has been around for so long, you’d think we’d have it mastered. We haven’t. (Oh, and by “we,” I mean design engineers and the software tools we depend on.) Years ago, PCB...
Elementary, Mr. Watson: Navigating the Dreaded DFX Triangle
March 26, 2026 | John Watson, Elementary, Mr. Watson
After being in both industry and academia for more years than I’d like to say (before tape and Mylar, it felt like rock slabs and chisels), I’ve noticed a belief that PCB design is a linear process. Even experienced PCB designers...
Fresh PCB Concepts: Dynamic Solder Mask Compensation in PCBs
March 19, 2026 | Team NCAB, Fresh PCB Concepts
Solder mask has traditionally been treated as a secondary design layer, generated automatically after routing, reviewed briefly, and rarely revisited. In contemporary PCB fabrication, that assumption no longer holds. As conductor...
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