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Signal Integrity & Metallization
Signal integrity and additive manufacturing, particularly metallization, are hot topics in PCB design and fabrication. PCB layouts are carefully engineered to achieve specific electrical and power performance targets.
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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Global Electronics Association and FED Open Call for Abstracts for 2027 Pan-European Design Conference
The German Electronics Design and Manufacturing Association (FED) and the Global Electronics Association are officially opening the Call for...
Signal Integrity Meets Additive Innovation in the Latest Issue of I-Connect007 Magazine
Signal integrity and metallization are deeply intertwined, and this month’s I-Connect007 Magazine explores that convergence in detail. As Managing...
Siemens Expands EDA Software Access Through EuroCDP Project
Siemens has become the first software provider to sign a strategic framework agreement with the European Chips Joint Undertaking (Chips JU) which...
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
May 22, 2026 | Nolan Johnson, I-Connect007
It’s been a busy week in the news. I could legitimately have published another five items because there were so many meaningful topics. So, I start with attorney James Kim, who returns to update us on metals tariffs. Brian Chislea and Cody Schoener from Dow recently published a book on UV curable conformal coatings. The Taiwan Printed Circuit Association has launched a PCB-specific AI knowledge base. SEMI FlexTech is seeking proposals for advancing flexible hybrid technologies, and the Global Electronics Association has launched the Global Electronics Policy Council, unifying its advocacy voices.
Fresh PCB Concepts: Repair and Risk in Electrical Test Failures in PCB Manufacturing
May 21, 2026 | Team NCAB, Fresh PCB Concepts
Electrical test failures represent one of the most critical decision points in PCB manufacturing because they directly expose defects that affect circuit functionality. Unlike cosmetic anomalies or minor process deviations, these failures indicate that the conductive network defined in the design has not been successfully realized in the finished product. Whether identified through continuity testing, isolation testing, or netlist verification, a failed electrical test confirms that the board cannot perform as intended. At this stage, the question is no longer simply whether a defect exists, but whether it can (or should be) repaired.
MORE ARTICLES
Target Condition: The Modern Masters of Signal Integrity and AI-driven Design
May 21, 2026 | Kelly Dack, Target Condition
Signal integrity (SI) in PCB design has moved from a niche engineering concern to the defining factor in whether modern electronics succeed or fail. As data rates push beyond PAM4 (4-level 112G) gigabit territory and SerDes components...
Connect the Dots: Designing for the Future of Manufacturing Reality—Surface Finish
May 7, 2026 | Matt Stevenson, Connect the Dots
When designing the complex boards that many electronic devices require to operate, designers should consider manufacturability at every step. This is my last article focused on designing for the always-evolving manufacturing reality....
The Pulse: Caught in the Crosshatch—A Cautionary Tale of Detective Work
April 29, 2026 | Martyn Gaudion, The Pulse
A chance meeting at a family wedding the other week led to a conversation about numbers, an introduction to a book entitled Humble Pi, and how numeric misinterpretation can lead to all kinds of unexpected outcomes, some just costly,...
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- The Consequences of Additive Metallizing on Etching Steps by Don Ball
- Rewriting Metallization, One Ink at a Time with Melbs LeMieux, Electroninks
- Direct Metallization: A Strategic Enabler for Advanced PCB Manufacturing by Carmichael Gugliotti, MacDermid Alpha
- Common Mode vs. Differential Mode and Signal Integrity by Kristin Moyer
- Controlled Impedance—When Connecting the Dots Stops Working by John Watson
- Mastering Return Path Discontinuities for Robust Signal Integrity by Stephen Chavez