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Dana on Data: The Insane PCB DFM Process

May 22, 2024 | Dana Korf, Dana on Data

This industry just doesn’t like to change. Line width/space is consistently narrowed; layer counts are now over 120 layers; via diameters constantly shrink. But a fabricator still can’t build per the supplied data package because of design, document, and capability mismatch errors. I have been writing for I-Connect007, and of the 41 articles and interviews I have done, 39 have focused on highlighting designer-to-fabricator data transfer issues with proposed solutions. Little has changed to improve the transfer. This industry seems to accept receiving erroneous PCB data.

Real Time with… IPC APEX EXPO 2024: Insight into STARTEAM Global

May 22, 2024 | Real Time with...IPC APEX EXPO

In this interview, Martin Schneider, CTO of STARTEAM Global, talks about his long career journey that has given him valuable industry experience. He discusses his role as CTO, the company's initiatives in North America, the company's journey and its expansion into Thailand, as well as the advantages of attending IPC APEX EXPO. He expresses his gratitude and admiration for the industry.




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The Shaughnessy Report: Unlock Your High-speed Material Constraints

May 15, 2024 | Andy Shaughnessy, The Shaughnessy Report

The world of PCB materials used to be a fairly simple one. It was divided into two groups: the “traditional” laminates, often called FR-4, and the high-speed laminates developed especially for high-speed PCBs. These were two...

Connect the Dots: Designing for Reality—The Pre-Manufacturing Process

May 8, 2024 | Matt Stevenson, Connect the Dots

I have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers...

Designer’s Notebook: What Designers Need to Know About Manufacturing, Part 2

April 24, 2024 | Vern Solberg, Designer's Notebook

The printed circuit board (PCB) is the primary base element for providing the interconnect platform for mounting and electrically joining electronic components. When assessing PCB design complexity, first consider the component area...

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