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Power Integrity
Current power demands are increasing, especially with AI, 5G, and EV chips. This month, our experts share “watt’s up” with power integrity, from planning and layout through measurement and manufacturing.
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If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
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Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
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Breaking News: On the Line with… Ultra HDI, Episode 8: “Materials, Up and Coming Capabilities,” Now Available
I-Connect007 is excited to announce the release of the eighth episode of its 12-part podcast series, On the Line with… American Standard Circuits:...
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Everyone’s Talking About Power
November 6, 2025 | Heidi Barnes, Keysight Technologies
Delivering power to a digital load is an AC function, not DC. That simple statement may be obvious, but the implications of how electricity travels to an electronic load are complicated. Dynamic loads with rapidly changing currents create electric and magnetic fields that adhere to Maxwell’s equations. Ground can be misleading and is probably better used for describing where one grows potatoes and carrots. Electrical currents have “return paths,” and the energy is traveling in the fields between the power rail and the return path.
Target Condition: Distribution of Power—Denounce the Ounce
November 5, 2025 | Kelly Dack, Target Condition
Have you ever wondered why the PCB design segment uses ounces to describe copper thickness? There’s a story behind all of this—a story that’s old, dusty, and more than a little absurd. (Note that I didn’t add “Like many of us.”) Legend has it that back in the days of copper tinkers and roofing tradesmen, the standard was set when a craftsman hammered out a sheet of copper until it weighed one ounce, when its area conveniently matched the square of the king’s foot.
MORE ARTICLES
Beyond Design: The Fundamental Structure of Spectral Integrity
October 21, 2025 | Barry Olney, Beyond Design
Impedance can be characterized in both the time and frequency domains. In the time domain, it influences how electromagnetic energy propagates through interconnects, affecting signal integrity and waveform fidelity. In the frequency...
Elementary, Mr. Watson: High Power: When Physics Becomes Real
October 15, 2025 | John Watson, Elementary, Mr. Watson
Have you ever noticed how high-speed design and signal integrity classes are always packed to standing room only, but just down the hall, the session on power electronics has plenty of empty chairs? It's not just a coincidence; it's a...
The Shaughnessy Report: Watt About Power Integrity?
October 8, 2025 | Andy Shaughnessy, The Shaughnessy Report
Yes, that headline is the equivalent of a dad joke, but editors can’t pass up a chance to inject a little humor into a headline, and I had to take my shot. Power integrity (PI) problems are no joke. Current power demands are...
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- Everyone’s Talking about Power, by Heidi Barnes
- The Fundamental Structure of Spectral Integrity, by Barry Olney
- AI Triggers Next Paradigm Shift in PDN, by Istvan Novak
- High Power: When Physics Becomes Real, by John Watson
- PDN Optimization: Balancing Performance and Cost in Modern SoC Designs, by Zach Caprai
- Distribution of Power: Denounce the Ounce, by Kelly Dack
- Power and Ground Distribution Basics, by Vern Solberg