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Real Time with... productronica 2025: Rehm's Innovations in Green Technology

December 8, 2025 | Real Time with...productronica

Marcy LaRont introduces Michael Hanke at the Rehm booth, where they highlight the busy atmosphere and innovative machines. They discuss the new reflow soldering, formic acid integration, and the machine's efficiency. The focus is on green technology, data reporting, and software integration, including AI components.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

December 5, 2025 | Marcy LaRont, I-Connect007

It’s been another big week in global business news with positive projections on global economic growth, primarily driven by AI. U.S. labor markets are showing some strain after copious layoff activity, and there’s possibly a slight “correction” in the stock market, with investors apparently concerned about corporate overvaluation. My must-reads are interesting, informative, and important for industry members, particularly in the U.S. These selections range from onshoring high-tech thermal control to the value of training, recognizing interconnect defects, and an important statement from the Global Electronics Association regarding the USMCA.





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Learning With Leo: What Is the Cost of Quality Brought About by Training?

December 3, 2025 | Leo Lambert, Learning With Leo

In electronics manufacturing, conversations about training often revolve around one narrow question: What does it cost? Training requires time, materials, instructor fees, and occasionally travel. Under tight budget constraints, it is...

Nolan’s Notes: A Tribute to Iola—and Automation

December 2, 2025 | Nolan Johnson, Nolan's Notes

In the 1960s and ’70s, when the west side of the Portland, Oregon, metro area was dominated by Tektronix, my grandmother worked as one of the “assembly ladies.” Known as “Tek,” the company was an economic juggernaut, driving...

Standard of Excellence: Handling Difficult Customers With Grace and Professionalism

November 19, 2025 | Anaya Vardya, Standard of Excellence

Delivering a quality product on time is only half the battle. The other half, often as critical, is how we handle the human side of business, especially when things don’t go as planned. In a world of tight deadlines, complex builds,...

Learning With Leo: UHDI—The Next Leap in PCB Manufacturing

November 5, 2025 | Leo Lambert, Learning With Leo

High density interconnect (HDI) technology has been a cornerstone of miniaturized electronics since Hewlett-Packard introduced the first chip-scale implementation in 1982. Over time, HDI processes became central to organic flip-chip...

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