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Signal Integrity & Metallization
Signal integrity and additive manufacturing, particularly metallization, are hot topics in PCB design and fabrication. PCB layouts are carefully engineered to achieve specific electrical and power performance targets.
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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ICAPE Welcomes New Institutional Investor After 1.85% Stake Sale by Thierry Ballenghien
ICAPE Group announces that the Farringdon European Opportunities fund has acquired a stake in its...
Flexible Circuit Technologies Expands Global Manufacturing Footprint with Thailand Operations
Flexible Circuit Technologies (FCT), a leading global provider of flexible circuit design, advanced interconnect solutions, and electronics...
Ventec Giga Named Worldwide Exclusive Distributor for Elinta Robotics
We are proud to announce that Ventec Giga has been appointed as the worldwide exclusive distribution partner for Elinta Robotics — a leading...
SCHMID Group Announces Agreement for New China Manufacturing Campus to Support Future Growth
SCHMID Group N.V., a global leader in advanced manufacturing solutions for the electronics and semiconductor industries, announced that it has signed...
Insulectro Signs Covestro as Supplier of Advanced Substrates
Insulectro, the largest distributor of materials used in the manufacturing of printed circuit boards and printed electronics, welcomes Covestro as...
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Three Reasons Manufacturers Are Turning to UV Curable Conformal Coatings
June 11, 2026 | I-Connect007
Manufacturers are under increasing pressure to improve reliability while reducing production costs, energy use, and environmental impact. For companies that rely on conformal coatings to protect electronic assemblies from moisture, dust, chemicals, and other environmental hazards, UV-curable technologies are a compelling alternative to traditional coating processes.
From Dilution to ZLD: Optimizing Used Process Water Management
June 10, 2026 | Richard Nichols, GreenSource Engineering
Last month, we began discussing the journey from dilution to zero liquid discharge. I highlighted that approximately 70% of the used process water (UPW) is generated from the dilute stream. This significant volume underscores the necessity for effective treatment processes that ensure the safe return of water into the production cycle while minimising environmental impact.
MORE ARTICLES
Happy’s Tech Talk #48: Digital Twins—Integrating Design and Manufacturing
June 2, 2026 | Happy Holden, Happy’s Tech Talk
New product realization and design for manufacturing and assembly (DFM/A) are becoming increasingly visible as programs that can improve time-to-market and reduce product costs. These simulations of real-time manufacturing are now...
It’s Only Common Sense: Are You Really So Busy?
June 1, 2026 | Dan Beaulieu, It's Only Common Sense
I got a message the other day that simply said: “K.” That was it. One letter. No punctuation. No warmth or humanity. Just a lonely consonant hanging in digital space like it was abandoned by the rest of the alphabet. Maybe I’m...
Marcy’s Musings: Additive Processes, Signal Consequences
May 19, 2026 | Marcy LaRont, Marcy's Musings
Signal integrity and additive manufacturing, particularly in metallization, are defining themes in modern PCB design and fabrication. PCB layouts are meticulously engineered systems designed to meet strict electrical and power...
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- The Consequences of Additive Metallizing on Etching Steps by Don Ball
- Rewriting Metallization, One Ink at a Time with Melbs LeMieux, Electroninks
- Direct Metallization: A Strategic Enabler for Advanced PCB Manufacturing by Carmichael Gugliotti, MacDermid Alpha
- Common Mode vs. Differential Mode and Signal Integrity by Kristin Moyer
- Controlled Impedance—When Connecting the Dots Stops Working by John Watson
- Mastering Return Path Discontinuities for Robust Signal Integrity by Stephen Chavez