The Chemical Connection: Don’t Just Blame the EtcherAT&S Conducts Research on Green Electronics for Europe
AT&S is working on the EECONE (European ECOsystem for greeN Electronics) project to develop new technologies to make electronics production in Europe...
IPC Great Lakes EMS Leadership Roundtable: Leveling Up Your Business
Join fellow EMS leaders in the region on Oct 5, 2023 at 4:30 - 8:00 p.m. EDT to share industry pain points and...
CIMS to Exhibit at TPCA 2023 in Taipei
TPCA is the main annual PCB event in Taiwan. This year, it takes place in Taipei on 25-27...
Zhen Ding Posts Nearly 34% Jump in August Revenue
Zhen Ding Technology Holding Ltd, a Taiwan-based company engaged in the design, development, and manufacturing of printed circuit board (PCBs) including rigid PCBs, flex PCBs, HDIs, substrate-like PCBs (SLP), and rigid-flex...
Nordson Corporation Announces Transition in Corporate Development Organization
Nordson Corporation (NASDAQ: NDSN) shared today that Anne Pombier has announced her intention to retire as Vice President, Corporate Development,...
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Pivoting on Substrates
September 27, 2023 | I-Connect007 Editorial Team
Oved Shapira is CEO of PCB Technologies, the Israeli-based printed circuit provider. PCB Technologies has recently invested in facilities and expertise to design, fabricate, and assemble substrates, a key component for advanced packaging technologies. Oved spoke with Barry Matties and Nolan Johnson about how advanced packaging will influence the industry. He said it will shift everything, including design, fabrication, assembly techniques, and capital equipment development. Some of these shifts might be subtle, and others more seismic. Whatever the changes, Oved says it’s coming.
Cutting-edge Inspection Challenges
September 26, 2023 | Brent Fischthal, Koh Young America
Koh Young’s Brent Fischthal explains how UHDI and advanced packaging are challenging inspection systems. He says the shift toward larger components and advanced packaging brings a host of challenges that impact the industry. These challenges include complexity, density, package diversity, and inspection methodologies, all of which necessitate a more innovative approach.
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Nolan's Notes: Convergence
September 19, 2023 | Nolan Johnson, Nolan's Notes
When I stop to consider the dynamics in our industry at this moment, I keep coming back to the idea of “convergence.” Aspects of our industry historically thought of as distinct and separate are blurring the lines and overlapping....
It’s Only Common Sense: Stop Your Love Affair with Certainty
September 18, 2023 | Dan Beaulieu, It's Only Common Sense
Often, standing still and doing nothing is the most dangerous tactic you can take. Most companies who get themselves in a jam did it because they didn’t do anything. They saw their impending doom but were too frozen in their fear of...
Punching Out: The Power of Projections
September 7, 2023 | Tom Kastner, Punching Out!
We are headed toward that time of year many of us dread—budgeting for the next year. This budgeting process becomes a huge tug-of-war because there is a lot at stake in terms of resources, bonuses, and pride. Unfortunately, many...
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