Beyond the Board: Orbital High Ground—Why Space Superiority Is Slipping Away
Defense Speak Interpreted: Is There Still a CHIPS Act?
Neways, Teledyne FLIR Sign Frame Agreement for Ramp-up of Defense Business
Neways, the global innovator in mission-critical technology for leading semicon, defense & mobility, and connectivity companies, has signed a frame...
INVISIO Secures SEK 145 Million Order for Dismounted Soldier Systems
INVISIO has received a significant order from a new European customer for its dismounted soldier systems. Deliveries are to be completed during...
Saab, Sabena Technics Sign Agreement Relating to GlobalEye
Saab has signed a framework agreement with the French aircraft maintenance and modification provider Sabena technics relating to aircraft...
Boeing, Angolan Ministry of Transport Sign Memorandum of Strategic Cooperation
Boeing and the Ministry of Transport of the Republic of Angola signed a Memorandum of Strategic Cooperation to explore initiatives aimed at advancing...
Northrop Grumman Expanding Its Use of NVIDIA AI Technology to Advance Solutions for Space
Northrop Grumman Corporation is expanding its use of NVIDIA technology, including adding space applications to the NVIDIA Omniverse simulation...
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New IPC VP Joe Schneider Building Stronger Focus on U.S., Canada
June 19, 2025 | Marcy LaRont, I-Connect007
IPC has hired Joe Schneider as a vice president to strengthen its regional focus and address the specific needs in the U.S. and Canada. Joe brings a rich background in OEM and contract manufacturing, including with industry giants like Siemens and Abbott Laboratories. In this interview, he shares his vision for the region, which emphasizes workforce development and supply chain challenges.
The Government Circuit: From Tax Policy to Tariffs, Denver to Delhi, Speaking Up for Electronics
June 18, 2025 | Chris Mitchell, The Government Circuit
I had the privilege of attending the June 3 opening ceremony of AT&S’s HTB3 facility in Leoben, Austria—a milestone moment for Europe’s electronics ecosystem. HTB3 is now the first and only facility in Europe capable of both developing and producing high-performance IC substrates—the advanced platforms that allow powerful chips to connect, process, and function. As demand for AI, 5G, and other cutting-edge technologies grows, so too does the need for sophisticated substrates like those HTB3 will produce.
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