American Made Advocacy: American PCBs in Big Demand and Short Supply
Defense Speak Interpreted: Will Defense Become a Totally New Supplier for Drone Electronics?
The Right Approach: The End of an Era—DoD Proposes MIL-PRF-31032 Cancellation
Remtec to Participate in EMS Industry Fly-In: Where Policy Meets the Production Line in Washington, D.C.
President and CEO of Remtec, Brian Buyea Will Join The Industry Leaders in Advocating for a Stronger, More Resilient U.S. Electronics Manufacturing...
Sparton Rebrands as Twenty-Six Defense Maritime to Advance U.S. Maritime Defense
Sparton DeLeon Springs, LLC (Sparton), and Logos Technologies are now operating as Twenty-Six Defense Maritime. The new name reflects the company’s...
Eutelsat Orders 229 Additional OneWeb Satellites from Airbus
During the International Space Summit, in Paris, and in the presence of Philippe Baptiste, Minister of Higher Education, Research and Space for...
BAE Systems Launches Shadow EW Compact Electronic Warfare Solutions
BAE Systems has launched its Shadow EW™ family of compact electronic warfare (EW) solutions designed for a diverse and growing range of small...
BAE Systems Receives $16M to Qualify RH45® for Space Missions
BAE Systems has received $16 million in Defense Production Act Title III funding via the Department of War's (DOW) Warfighting Investments,...
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
September 18, 2026 | Nolan Johnson, I-Connect007
The middle months of 2026 have been defined by, shall we say, “projects” throughout the industry, and as we approach the end of the third quarter, many of those projects are coming to light. That’s the theme I’m getting from this week’s news, and I tried to capture it with my selections. My must-reads include a market update on the leading fabless semiconductor houses, a call to action from SEMI directed at the policymakers in the European Union, a rollup of workforce and educational programs announced just this week, a role change at Indium, and the relaunch of the Global Electronics Association Sustainability teams’ DMA Toolkit.
TTM Building the Infrastructure Around the Chip
September 17, 2026 | Nolan Johnson, I-Connect007
TTM Technologies’ new UHDI facility in Syracuse, New York, provides a starting point for a broader conversation with President and CEO Edwin Roks about the future of advanced electronics manufacturing. Roks discusses his optimism for the growing demand for finer-feature PCBs, the move toward semiconductor-level dimensions, and the role of substrates, UHDI, and heterogeneous packaging in building the next generation of electronic systems.
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