Beyond the Board: The Future of Innovation—Why the Electronics Industry Needs You
American Made Advocacy: New Congress, New Opportunities
Cycuity Collaborates with SiFive and BAE Systems to Demonstrate Advanced Microelectronics Design Supply Chain Security
Cycuity, a leader in hardware security solutions, has collaborated with SiFive and BAE Systems to deliver increased, evidence-based security...
DuPont Interconnect Materials Enabling Advancements in Aerospace & Defense, Next-Gen Automotive, and AI
DuPont Interconnect Solutions (ICS)—a leading material solutions and systems design partner within DuPont Electronics & Industrial that addresses...
Lockheed Martin's AN/TPQ-53 Radar Strengthens U.S. Northern Command's Mission with Cutting-Edge Open Architecture Software
Lockheed Martin has successfully integrated its AN/TPQ-53 multi-mission radar (MMR) with the Joint Task Force – Southern Border (JTF-SB) command...
Northrop Grumman’s NG InSight to Demonstrate Secure Communications Integration for US Air Force Connectivity
Northrop Grumman Corporation was awarded a follow-on contract to help the U.S. Air Force connect airborne platforms with faster, secure...
European Defence Industry Faces Critical Need for Electronics Made in Europe, According to New Report by IPC
Europe is becoming more reliant on electronics manufactured outside of Europe, potentially leading to vulnerabilities that impact regional security,...
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Defense Speak Interpreted: It’s Time for a ‘Defense-Speak’ Update
March 18, 2025 | Dennis Fritz, Defense Speak Interpreted
I’m Denny Fritz, the author of 30 “Defense Speak Interpreted” columns from 2018 to 2022. My original concept for this monthly op-ed was to explain the unique acronym language used by the U.S. Defense Department: CMMC, DIUx, C4ISR, JEDI, etc. When I started consulting for NSWV Crane almost 20 years ago, I would find myself sitting in meetings, perplexed at what I heard. Half the conversations were using acronyms that were foreign to me.
IMAPS and DPC: 21 Years of Elevating Technical Knowledge
March 13, 2025 | Marcy LaRont, I-Connect007
The IMAPS 21st Device Packaging Conference (DPC) may have taken place at a conference center located down an idyllic desert road showcasing the best of what native Arizona has to offer, but the topics at this conference were anything but laid-back. This important platform for professionals in microelectronics and advanced packaging set the stage for a technology in high demand. Brian Schieman, IMAPS executive director, says the show was organized to demonstrate their commitment to addressing current technological trends and with significant energy directed toward fostering connections within the supply chain.
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