Defense Speak Interpreted: Understanding What the Department of Defense Is, and Isn’t
American Made Advocacy: Rebuilding America’s Military Stockpiles Begins With Microelectronics
The Right Approach: The End of an Era—DoD Proposes MIL-PRF-31032 Cancellation
RBB Earns AS9100 Certification, Expands Aerospace and Defense Credentials
RBB, a trusted leader in electronics manufacturing since 1973, has achieved AS9100 certification, meeting the stringent quality, traceability, and...
Kymeta Joins Red Cat Initiative for Maritime Connectivity
Red Cat Holdings, Inc. , a U.S.-based provider of advanced all-domain drone and robotic solutions for defense and national security, announced that...
Team Lockheed Martin Elevates Cross-Domain, Multi-Mission NGC2 Prototype Across the Indo-Pacific at Balikatan
During the Balikatan 2026 exercise, the Team Lockheed Martin NGC2 prototype successfully demonstrated the integration of sensors, fires systems and...
U.S. Army Selects Teledyne FLIR Defense Rogue 1 Loitering Munition System for LASSO Program
Teledyne FLIR Defense, part of Teledyne Technologies Incorporated, announced that its Rogue™ 1 loitering munition system has been selected by the...
RTX Expands Florida Facility to Boost Next-Gen Air Traffic Radar Production
The global airspace is congested and complex – and it’s putting a lot of pressure on radar systems designed for a previous era of...
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
May 15, 2026 | Nolan Johnson, I-Connect007
When you work in the news business, even in trade media, you can never really get that far away from it. We never want to miss something important. Chances are, even the books we take on our “vacations” end up having to do with the business. For example, my colleague Michelle Te recommended “Creativity, Inc., by Ed Catmull, a business skills study wrapped up in stories about Pixar, which I brought with me on a trip through the stunning U.S. Mountain West. Now, I’m back, and here are my recommendations for the week.
I-Connect007 Announces Upcoming Issue of Advanced Electronics Packaging Digest
May 13, 2026 | I-Connect007
The next issue of Advanced Electronics Packaging Digest examines the materials, architectures, and integration strategies shaping the next phase of electronics innovation, from reinforcement materials under thermal and frequency pressure to heterogeneous integration and advanced packaging as a system-level scaling factor.
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