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The third issue of Advanced Electronics Packaging Digest launches Monday, November 17. This issue continues AEPD’s mission to deliver forward-looking analysis and insider perspectives on the technologies reshaping advanced electronics packaging. Among the highlights is a review of IMPACT 2025, where discussions on component-to-system-level integration took center stage as experts explored the challenges and breakthroughs driving advanced packaging technologies.

Alpha Insights, Performance by Design: Understanding Heat at the Core of Every Design

November 11, 2025 | Team Alpha, Alpha Insights: Performance by Design

Power isn’t just about current. It’s about control. As electronic systems grow smaller and faster, every amp and every layer generates a new source of heat. That heat is more than a byproduct. It’s a measure of efficiency, a benchmark of performance, and often the first indication of failure.




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