Defense Speak Interpreted: The New Railgun Is Big News, But Can It Work?
American Made Advocacy: How Congress Can Restore the U.S. Printed Circuit Board Industry
The Government Circuit: USMCA Review—A Crucial Opportunity to Fortify North American Electronics
Amca Acquires Electrocube to Expand Into Power Electronics
Amca, an El Segundo-based aerospace and defense company, has acquired Electrocube of Pomona, California from two of its founding...
Kitron Raises Outlook on Defense Super Cycle as Q4 Delivers Record Results
Kitron reported record quarterly revenue and operating profit, driven by accelerating demand in the defense/aerospace market sector. An all-time high...
Lockheed Martin, Fujitsu Formalize Industrial Collaboration for Japan Defense
Lockheed Martin and Fujitsu Limited, a Japanese multinational leader in information technology solutions, finalized the first purchase order for a...
Deep Space Energy Raises €930K Pre-Seed to Power Moon and Satellites
Latvian startup Deep Space Energy has closed its pre-seed round by raising €350K, led by Outlast Fund and Linas Sargautis, an angel investor and a...
GuRu, Uniquest, Arion Advance sUAS for Korean Defense
GuRu Wireless, Inc., a leader in advanced wireless power solutions for national security and defense applications, announced a strategic...
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
February 13, 2026 | Michelle Te, I-Connect007
This week, I’ve taken some extra time to better learn some video and photo editing software programs we use at I-Connect007. You’ll want to check out my LinkedIn video to see how I brought my avatar to life for this week’s must-reads! The items I’m highlighting this week are also about learning something new, from Pete Starkey’s thorough three-day review of the EIPC Winter Conference in Aix-en-Provence, France, to what’s on the horizon for advanced electronics packaging. I also share details about the new Design Village at APEX EXPO 2026, preview a new column from Remtec’s Chandra Gupta, and discuss why marketing isn’t a one-and-done deal.
I-Connect007 Announces Newest Columnist Chandra Gupta of Remtec
February 12, 2026 | I-Connect007 Editorial Team
I-Connect007 is excited to announce its latest columnist, Chandra Gupta, whose new column, Below the Surface, will explore what truly determines performance in advanced electronic packaging, long before a product ever reaches assembly or test. Gupta is a seasoned practitioner who cuts through industry buzzwords to explain how substrate physics, materials, and manufacturing realities actually govern performance in high-reliability electronics.
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