Defense Speak Interpreted: Is DARPA Still Around After CHIPS?
Beyond the Board: Orbital High Ground—Why Space Superiority Is Slipping Away
PCBAA Wins Summit Silver Award from the American Society of Association Executives
PCBAA was one of 38 associations that earned Silver Awards for outstanding contributions for an entry titled: Chips Don’t Float: More Printed...
TT Electronics Secures Multi-Million-Pound Defense Contract with Ultra PCS
TT Electronics, a leading provider of global manufacturing solutions and engineered technologies, announced that it has been awarded a significant...
HANZA Accelerates the LYNX Program Through Acquisition of Defense Manufacturer
HANZA AB has signed an agreement to acquire the contract manufacturing division of Milectria, a group of companies focused on the defense...
Hyliion Awarded U.S. Navy Contract to Advance Multi-Unit KARNO Power Module
Hyliion Holdings Corp., a leading provider of innovative KARNOTM Power Modules, announced it has been awarded a Phase II Small Business Innovation...
Epirus Receives $43.5 Million Contract from U.S. Army for IFPC-HPM Generation II Systems
Epirus announced a $43,551,060 contract from the U.S. Army's Rapid Capabilities and Critical Technologies Office...
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The Government Circuit: Three Inescapable Conclusions About Global Trade Policies
July 17, 2025 | Chris Mitchell, The Government Circuit
Amid a series of recent moves by U.S. President Donald Trump to escalate trade policy pressure on key U.S. partners, including Europe, Canada, Mexico, Japan, and Malaysia, the Global Electronics Association’s recent report on global trade flows in the electronics industry is overflowing with relevant insights. The main message is that electronics supply chains are more globally integrated than any other industry, surpassing even the automotive sector in cross-border complexity.
Knocking Down the Bone Pile: Addressing End-of-life Component Solderability Issues, Part 4
July 16, 2025 | Nash Bell, Knocking Down the Bone Pile
In 1983, the Department of Defense identified that over 40% of military electronic system failures in the field were electrical, with approximately 50% attributed to poor solder connections. Investigations revealed that plated finishes, typically nickel or tin, were porous and non-intermetallic.
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