The Printed Circuit Assembler’s Guide to Encapsulating Sustainability for Electronics is a guide to encapsulation resins and their use in ruggedizing electronic devices. Learn about aspects such as their chemistry, application, and relevant test methods in different industries. The book also discusses the growing demand for sustainable solutions in the market and highlights examples of bio-based resins and the demand from emerging technologies.
ISBN: 978-1-959894-07-0 Print Edition ISBN: 978-1-959894-10-0
Beth Turner
Senior Technical Manager at MacDermid Alpha Electronics Solutions
Beth Turner has spent her career working in Research and Development focusing on new product technologies for the Coating, Adhesive, Sealant and Elastomers (CASE) market. Through this experience, Beth has gained a thorough understanding of the chemical formulations, range of application processes, product test methods, and certifications relevant to potting and encapsulants for use in electronics.
Beth is a recognised technical subject matter expert and is a member of the IPC APEX EXPO Technical Program Committee, IPC Potting and Encapsulation Task group, and a speaker for GfKORR Society for Corrosion Protection seminar: “The Application and Utilisation of Protective Coatings for Electronic Assemblies.” Beth is a regular speaker at IPC and SMTA events. Her research interest is safer, sustainable, alternative chemistries and materials for electronics ruggedization in harsh environments, and she regularly collaborates with world-leading universities to pioneer exploratory research in this area. In 2022, Beth was awarded the prestigious “Best Next Gen” technical paper for her research into bio-based encapsulation resins for use in the electronics market.
MacDermid Alpha Electronics Solutions, a prominent division of Element Solutions Inc, holds a distinguished position as a global leader in the field of fully integrated materials, helping to deliver enhanced performance, reliability, and sustainability to electronics manufacturers worldwide.
Their expertise is segmented into three divisions: Circuitry Solutions, Film & Smart Surface Solutions, and Semiconductor & Assembly Solutions (SAS). The SAS division specializes in delivering cutting-edge solutions for semiconductors and assembly processes, driving innovation and reliability in these critical sectors.
With a legacy spanning over a century of innovation, MacDermid Alpha has garnered the trust of manufacturers across more than 50 countries.
Setting MacDermid Alpha Electronics Solutions apart is its unique ability to promptly deliver high-quality solutions and provide technical services that comprehensively cover the entire electronics supply chain. They are actively shaping industries such as automotive, consumer electronics, mobile devices, telecom, data storage, and infrastructure..
For more information, visit macdermidalpha.com
Dr. Helmut Schweigart
Jason Keeping
Chapter Summaries
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Chapter 1
What Are Encapsulation Resins, and Why Do We Use Them?
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Chapter 2
Application Overview
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Chapter 3
Industry Sectors and Relevant Test Methods
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Chapter 4
Sustainability