14th Electronic Circuits World Convention
June 20, 2017 | Happy HoldenEstimated reading time: 10 minutes
Figure 9: KT action sequences. (Source: Happy Holden.)
Figure 10: Selecting the right statistical tool. (Source: the NIST Engineering Statistics Handbook.)
Figure 11: Automation strategy and methodology. (Source: Happy Holden.)
Figure 12: PCB fab automation software interactions. (Source: Happy Holden.)
“FPC Market and Related Technology Trend,” Hirofumi Matsumoto, Nippon Mektron
Nippon Mektron is considered to be the largest printed circuit fabricator in 2015, with ZenDing Technology a close rival. This invited talk highlighted the flex circuit segment of the PCB market:
- FPC market trends: The FPC market has grown by an average of 6.5% to $15.4B in 2015. It is expected to slow to 1.5% over the next seven years to $17.7B in 2022. Of that amount, $4.98B will be FPC assembly.
- FPC primary market and future markets: The mix has changed. In 2000, the applications were: mobile phone—22%, mobile camera—11%, hard discs—24%, digital audio—17%, packaging—13%, LCDS—5%, vehicle—4%, and optical—2%. In 2014, the distribution was: cellular phones—51%, LCD for phones—9%, camera for phones—4%, HDD—10%, automotive—9% computers—6%, cameras—6%, wearables—1% and other—4%
- Smartphone market and related FPC technologies (Figure 13): 17 different kinds of FPCs go into the smartphone and shipments exceeded 1.5 billion sets in 2016, growing to 1.84 billion by 2020 (Figure 14).
- Future FPC markets: The smartphone will continue to grow for medical, emergency, and other social network needs. Other growing markets will be automotive, virtual reality, drones, and IoT/M2M
- Wearable, 5G and IoT markets: These growing markets will demand new materials better suited to their performance and environment. Washable materials, ultra-high-speed films like LCP (30-300 GHz), and disposable film or harsh environment films.
Figure 13: Smartphone growth (updated 2016). (Source: Matsumoto.)
Figure 14: Smartphone flexible display trend. (Source: Matsumoto.)
Page 4 of 6
Suggested Items
Looking Into Space: EIPC Summer Conference, Part 2
06/17/2024 | Pete Starkey, I-Connect007“Innovative Development of PCB Technology and Design” was the theme of the second session of the 2024 EIPC Summer Conference, June 4-5, at the European Space Centre, Noordwijk, The Netherlands.
TopLine Introduces Braided Columns as Drop-in Replacement for BGA Solder Balls
06/17/2024 | TopLineThe Pulse: Overconstraining: Short, Slim, and Smooth
06/06/2024 | Martyn Gaudion -- Column: The PulseEngineering is both an art and a science. The design engineer’s task is (almost) always to bring product to market that meets specifications at the best and most economical price suited to the appropriate end use requirements. From a PCB perspective, designers are faced with a bewildering and almost overwhelming choice of materials at their disposal.
Connect the Dots: Designing for Reality—The Physical Manufacturing Phases
05/30/2024 | Matt Stevenson -- Column: Connect the DotsDesigning for reality is focused on the art and science of PCB design and production. If you’re trying to make a PCB that stands out for being reliable, easy to manufacture, and meets all design goals, then you’re in the perfect spot. We’re here to break down the PCB manufacturing process while sharing essential tips for smooth design and production.
DuPont Showcases AI Innovations Featuring Advanced Interconnects at 2024 International Electronic Circuits Exhibition
05/13/2024 | DuPontDuPont announced it will showcase its comprehensive range of advanced circuit materials and solutions at the 2024 International Electronic Circuits Exhibition in Shanghai. With a product portfolio that includes fine line, signal integrity, power and thermal management, DuPont will exhibit at Booth #8L06 at the National Exhibition and Convention Center (NECC) from May 13 to 15.