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Looking Into Space: EIPC Summer Conference, Part 2

06/17/2024 | Pete Starkey, I-Connect007
“Innovative Development of PCB Technology and Design” was the theme of the second session of the 2024 EIPC Summer Conference, June 4-5, at the European Space Centre, Noordwijk, The Netherlands.

TopLine Introduces Braided Columns as Drop-in Replacement for BGA Solder Balls

06/17/2024 | TopLine

The Pulse: Overconstraining: Short, Slim, and Smooth

06/06/2024 | Martyn Gaudion -- Column: The Pulse
Engineering is both an art and a science. The design engineer’s task is (almost) always to bring product to market that meets specifications at the best and most economical price suited to the appropriate end use requirements. From a PCB perspective, designers are faced with a bewildering and almost overwhelming choice of materials at their disposal.

Connect the Dots: Designing for Reality—The Physical Manufacturing Phases

05/30/2024 | Matt Stevenson -- Column: Connect the Dots
Designing for reality is focused on the art and science of PCB design and production. If you’re trying to make a PCB that stands out for being reliable, easy to manufacture, and meets all design goals, then you’re in the perfect spot. We’re here to break down the PCB manufacturing process while sharing essential tips for smooth design and production.

DuPont Showcases AI Innovations Featuring Advanced Interconnects at 2024 International Electronic Circuits Exhibition

05/13/2024 | DuPont
DuPont announced it will showcase its comprehensive range of advanced circuit materials and solutions at the 2024 International Electronic Circuits Exhibition in Shanghai. With a product portfolio that includes fine line, signal integrity, power and thermal management, DuPont will exhibit at Booth #8L06 at the National Exhibition and Convention Center (NECC) from May 13 to 15.
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