NCAB Acquires Board Shark PCB in the USA
NCAB has acquired 100 percent of the shares of Board Shark LLC, based in Florida, USA. In 2025, the company generated net sales of approximately USD 17million with an EBITA margin exceeding that of...
From Prototype to Production: New Guideline Helps Industry Design, Integrate and Scale Reliable E-Textile Systems
The Global Electronics Association announces "Fundamentals and Best Practices for E-Textile System Development," a new next-generation guideline that...
Techno System Announces ECO & ECO BOX Platform
Techno System is proud to introduce the new ECO and ECO BOX platform, a revolutionary loading, unloading and buffering solution that brings together the experience, feedback and operational requirements gathered from PCB...
TTM Technologies, Inc. to Acquire Privately-Held, European-Based Swiss Technology Group AG and ILFA GmbH
TTM Technologies announced the intent to acquire, subject to regulatory approvals, two well established companies in Europe: privately-held Swiss...
Click Here for More News
Send your news item to: news@iconnect007.com
Click here for press release tips
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
June 26, 2026 | Marcy LaRont, I-Connect007
Amid AI, automation, advanced manufacturing, and an increasingly uncertain global business climate, our industry is moving at an electric pace. My must-reads for this week explore some of the ideas and technologies that help us keep up with so much change. Tom Kastner reminds us why staying focused may be one of the most valuable business skills, especially when navigating mergers and acquisitions. From Lithuania, robotics expert Aurelijus Beleckis makes a compelling case that automation is no longer just about ROI; it may be the key to long-term survival...
Fresh PCB Concepts: Engineering Copper Coin and Copper Pedestal Technology With IPC Design Interpretation
June 25, 2026 | Team NCAB, Fresh PCB Concepts
Copper coin and copper pedestal technologies have become increasingly important in modern PCB design as thermal demands rise in power electronics, automotive systems, RF applications, aerospace electronics, and high-density computing environments. As component power density increases and board sizes shrink, traditional thermal management techniques often become insufficient to maintain acceptable operating temperatures and long-term reliability.
MORE ARTICLES
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
- Every Layer Interconnect — The Promise, the Pain, and the Practical Limits by Anaya Vardya
- Base Material Properties and Microvia Reliability by Ed Kelley
- Building Better HDI Boards: Driving Quality Through Lamination with Ralph Jacobo
- One Design, Many Minds: From Concurrent to Co-design with Kristin Moyer
- Elementary, Mr. Watson: Builders of the Dream by John Watson
- The PCB Designer's Blind Spot: No Feedback, No Progress by Stephan Schmidt