MacDermid Enthone to Co-Exhibit with Alpha Assembly Solutions at NEPCON Japan 2018
December 18, 2017 | MacDermid Enthone Electronics SolutionsEstimated reading time: 1 minute
MacDermid Enthone Electronics Solutions will exhibit its latest range of chemical solutions, alongside its sister company Alpha Assembly Solutions, at the 2018 NEPCON Japan show. NEPCON is Asia’s Largest Exhibition for Electronics Design, R&D and Manufacturing Technology to be held in Tokyo, January 17-19, 2018.
At the show, MacDermid Enthone Electronics Solutions will showcase its chemical processes for printed circuit boards and IC substrates, including PackagePrep solderable finish for QFN sidewalls, PackageBond leadframe adhesion promoter, MacuSpec electrolytic coppers, Systek through hole fill and Affinity ENIG final finish. In addition, MacDermid Enthone’s Advanced Electronics Solutions business will display offerings for the semiconductor manufacturing sector. Products include ViaForm, the industry’s most trusted Copper Damascene, and a complete offering of wafer level packaging products from the MICROFAB line.
MacDermid Enthone Electronics Solutions, Advanced Electronics Solutions, Alpha Assembly Solutions and Alpha Advanced Materials are in the unique position to combine their technology, innovation and service capabilities, resulting in a new industry leader in all materials for Advanced Packaging.
For more information on our latest product technologies, visit us at Booth East 5-4.
About MacDermid Enthone Electronics Solutions
MacDermid Enthone Electronics Solutions, a MacDermid Performance Solutions business, researches, formulates and delivers specialty chemistries used in the world’s leading electronics. Our products and technical support provide solutions for the most complicated, micro scale circuitry challenges. From wireless devices to automotive and military electronics – in everything you see, and in many things you don’t – MacDermid Enthone is there. Visit us at: macdermidenthone.com/electronics.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/03/2024 | Nolan Johnson, I-Connect007This week’s most important news is strategic—and telling. When one puts together the IPC industry reports, we simply have to include the recent conversation with Shawn DuBravac and Tom Kastner. On the design side, check out the latest “On The Line With…” podcast featuring Brad Griffin from Cadence Design Systems, discussing SI and PI in the realm of intelligent system design.
IMI Welcomes New CEO
05/03/2024 | IMIIntegrated Micro-Electronics, Inc. (IMI),The IMI Board of Directors announced, in a disclosure dated April 25, 2024, the appointment of Louis Sylvester Hughes, Chief Executive Officer (CEO).
Electronics Industry Sentiment Rose in April, Hitting New High
05/02/2024 | IPCApril 2024 marked the third consecutive month of sentiment growth among electronics manufacturers. When asked if they expected labor costs for hourly workers to rise over the next month, manufacturers in the United States, Mexico, and Europe predicted a five percent increase, while manufacturers in Asia predicted a slightly lower four percent increase.
iNEMI Names Grace O'Malley CTO
05/02/2024 | iNEMIThe Board of Directors of the International Electronics Manufacturing Initiative (iNEMI) has named Grace O'Malley Chief Technical Officer (CTO).
ZESTRON Academy Launches 2024 Advanced Packaging & Power Electronics Webinar Series
05/01/2024 | ZESTRONZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, proudly announces the launch of its highly anticipated webinar series on Advanced Packaging & Power Electronics, a webinar series on the latest innovations, cleaning, and corrosion challenges.