Defense Speak Interpreted: The Impact of Venture Capital-backed Defense Contractor Firms
American Made Advocacy: Don’t Build Our AI Economy on Foreign-sourced Components 
The Right Approach: The End of an Era—DoD Proposes MIL-PRF-31032 Cancellation
Volatus Aerospace to Acquire AISPECO
Volatus Aerospace Inc., a Canadian-headquartered global aerospace and defence company, today announced that it has entered into an agreement to acquire 100% of AISPECO Uab shares, a Vilnius, Lithuania-based developer and...
The Future of Warfare Is Driving Billions Into Next-Generation Soldier Systems
The modern battlefield is changing fast, and soldiers need equipment that can keep pace. Military forces around the world are investing in advanced...
Kratos Breaks Ground on New AN/SPY-1 Radar and Helios Hypersonics Testing Facilities in Indiana
Kratos Defense & Security Solutions, Inc., a technology company in defense, national security, and global markets, today celebrated a joint...
Sypris Receives Follow-On Award for Mission-Critical U.S. Navy Program Share
Sypris Electronics, LLC, a subsidiary of Sypris Solutions, Inc., announced that it has received a follow-on award to manufacture and test electronic...
ENPASA Deploys Inmarsat NexusWave for Digital Operations and Crew Communications
Buenos Aires-based shipowner Empresa Naviera Petrolera Atlántica SA (ENPASA) has deployed NexusWave – the fully managed, bonded multi-network...
Global Sourcing Spotlight: Beyond China Plus One—Building a Truly Global Supply Network
October 14, 2026 | Bob Duke, Global Sourcing Spotlight
China Plus One has been the go-to strategy for companies looking to diversify their supply chains without giving up the advantages of manufacturing in China. Keep China in the mix, add capacity in Vietnam, Thailand, India, Malaysia, Mexico, or another country, and reduce the risk of relying too heavily on one manufacturing region. But adding another country does not necessarily create a diversified supply chain.
From Substrates to Systems: A Preview of the October Advanced Electronics Packaging Digest
October 14, 2026 | I-Connect007
The October issue of Advanced Electronics Packaging Digest examines the technologies, investments, and strategic decisions shaping the future of advanced electronics manufacturing. From the evolution of semiconductor scaling and the integration challenges of high-frequency systems to the expansion of semiconductor capabilities in the United States and India, this issue explores how materials, packaging architectures, and manufacturing infrastructure are becoming interconnected.
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