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TTM Building the Infrastructure Around the Chip

September 17, 2026 | Nolan Johnson, I-Connect007

TTM Technologies’ new UHDI facility in Syracuse, New York, provides a starting point for a broader conversation with President and CEO Edwin Roks about the future of advanced electronics manufacturing. Roks discusses his optimism for the growing demand for finer-feature PCBs, the move toward semiconductor-level dimensions, and the role of substrates, UHDI, and heterogeneous packaging in building the next generation of electronic systems.

Edge4Vets: Changing Lives Through Opportunity

September 15, 2026 | Dan Beaulieu

Companies throughout the PCB, EMS, semiconductor, microelectronics, aerospace, defense, and medical electronics sectors need dependable people who can think clearly, learn quickly, solve problems, work safely, and perform as part of a team. Meanwhile, thousands of exceptionally capable military veterans are returning to civilian life with those very qualities. The challenge is bringing these two groups together, and helping each understand the other. That is the mission of Edge4Vets, founded by Tom Murphy, director of the Human Resiliency Institute at Fordham University’s Gabelli School of Business.




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