Unimicron Germany Rises from the Ashes with New Smart Factory
April 30, 2018 | Pete Starkey, I-Connect007 and Michael Weinhold, EIPCEstimated reading time: 9 minutes
Figure 15: X-ray drilling machines.
Intelligent production planning meant that there was the minimum of work in progress. Where buffering capacity was necessary, the work was transported by the AGVs to an enclosed storage area until the following operation was ready to accept it.
Although some of us could have happily spent several more hours furthering our understanding of the subtleties of the manufacturing set-up, our guide was on strict instructions to be in place for the opening ceremony, so we left the factory at that point to follow him to the front of the building where a sound stage had been set up facing a mass of visitors, with marching brass bands in the background.
On the stage, CEO Gerard van Dierendonck addressed the audience, reviewed the recent history of the Geldern site, and acknowledged the efforts of all involved in bringing the project to realisation, particularly a rather weary-looking Rico Schlüter who had pulled the whole lot together.
Figure 16: Gerard van Dierendonck
Figure 17: Rico Schlüter
Figure 18: Invited guests.
There was a ceremonial cutting of the ribbon, and the bands played the National Anthem.
Figure 19: The ribbon cutting ceremony.
Page 4 of 6
Suggested Items
Connect the Dots: Designing for Reality—The Physical Manufacturing Phases
05/30/2024 | Matt Stevenson -- Column: Connect the DotsDesigning for reality is focused on the art and science of PCB design and production. If you’re trying to make a PCB that stands out for being reliable, easy to manufacture, and meets all design goals, then you’re in the perfect spot. We’re here to break down the PCB manufacturing process while sharing essential tips for smooth design and production.
DuPont Showcases AI Innovations Featuring Advanced Interconnects at 2024 International Electronic Circuits Exhibition
05/13/2024 | DuPontDuPont announced it will showcase its comprehensive range of advanced circuit materials and solutions at the 2024 International Electronic Circuits Exhibition in Shanghai. With a product portfolio that includes fine line, signal integrity, power and thermal management, DuPont will exhibit at Booth #8L06 at the National Exhibition and Convention Center (NECC) from May 13 to 15.
MKS’ Atotech to Participate in ECTC
05/10/2024 | MKS’ AtotechAt this year’s 74th IEEE Electronic Components and Technology Conference (ECTC), MKS’ Atotech will present and demonstrate its latest product and service innovations.
The Chemical Connection: Reducing Etch System Water Usage, Part 2
05/02/2024 | Don Ball -- Column: The Chemical ConnectionIn my last column, I reviewed some relatively simple ways to reduce water usage in existing etch systems: cutting down cooling coil water flow, adding chillers to replace plant water for cooling, lowering flow rate nozzles for rinses, etc. This month, I’ll continue with more ways to control water usage in your etcher. Most of these are not easily retrofittable to existing equipment but should be given serious consideration when new equipment is contemplated. With the right combination of add-ons, it is possible to bring the amount of water used in an etch system to almost zero.
Designer’s Notebook: What Designers Need to Know About Manufacturing, Part 2
04/24/2024 | Vern Solberg -- Column: Designer's NotebookThe printed circuit board (PCB) is the primary base element for providing the interconnect platform for mounting and electrically joining electronic components. When assessing PCB design complexity, first consider the component area and board area ratio. If the surface area for the component interface is restricted, it may justify adopting multilayer or multilayer sequential buildup (SBU) PCB fabrication to enable a more efficient sub-surface circuit interconnect.