Optomec Receives $2 Million Order for 6 Production 3D Electronics Printers
January 14, 2022 | OptomecEstimated reading time: 1 minute
Optomec Inc. announced that one of its existing production customers recently purchased another six (6) Aerosol Jet 3D Electronics Printers, bringing its total count to 20 systems. The $2+ million in orders is part of a production ramp plan that will grow to more than 30 systems over the next 12 months.
These latest orders include the customer’s first installations of Optomec’s new HD2 printer for 3D Additive Electronics, a platform tailored for inline production in advanced semiconductor packaging and PCB assembly operations. Additionally, under the contract, Optomec will deliver Production Recipes for both conductive and insulating materials.
The customer is a leading global manufacturer of aerospace and defense electronic systems and other advanced technology products, with more than $25 Billion in annual sales. They have been using Optomec’s patented Aerosol Jet 3D Printed Electronics solution for more than 5 years.
“Optomec is fortunate that many of its customers are at the vanguard in adopting Additive Manufacturing in real-world production applications.” said David Ramahi, Optomec CEO. “This particular user is truly a standout in leading the charge when it comes to implementation of 3D Additive Electronics, having shipped 100,000s of products manufactured using Optomec’s Aerosol Jet solution for advanced semiconductor packaging.”
Optomec’s patented Aerosol Jet 3D Electronics Printers are an Additive Electronics solution uniquely capable of directly printing high resolution conductive circuitry, with feature sizes as small as 10 microns. The process is further differentiated by its ability to print onto non-planar substrates and fully 3-dimensional end-parts. Production applications include direct printing of 3D Antenna, 3D Sensors, Medical Electronics, Semiconductor Packaging and Display Assembly.
A primary high-value use case in Semiconductor Packaging is the printing of 3D Interconnects to connect chips to other chips, traditional circuit boards and even directly integrated into end-products, such as wearables. In this case, the process replaces legacy wire-bonding due to its advantages in terms of smaller space claim, lower loss (especially in high frequency and mmWave) and greater mechanical reliability.
Semiconductor Packaging examples showing Printed 3D Interconnects for 3D stacked die (l), mmWave (c), and flex circuit (r).
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/03/2024 | Nolan Johnson, I-Connect007This week’s most important news is strategic—and telling. When one puts together the IPC industry reports, we simply have to include the recent conversation with Shawn DuBravac and Tom Kastner. On the design side, check out the latest “On The Line With…” podcast featuring Brad Griffin from Cadence Design Systems, discussing SI and PI in the realm of intelligent system design.
IMI Welcomes New CEO
05/03/2024 | IMIIntegrated Micro-Electronics, Inc. (IMI),The IMI Board of Directors announced, in a disclosure dated April 25, 2024, the appointment of Louis Sylvester Hughes, Chief Executive Officer (CEO).
Electronics Industry Sentiment Rose in April, Hitting New High
05/02/2024 | IPCApril 2024 marked the third consecutive month of sentiment growth among electronics manufacturers. When asked if they expected labor costs for hourly workers to rise over the next month, manufacturers in the United States, Mexico, and Europe predicted a five percent increase, while manufacturers in Asia predicted a slightly lower four percent increase.
iNEMI Names Grace O'Malley CTO
05/02/2024 | iNEMIThe Board of Directors of the International Electronics Manufacturing Initiative (iNEMI) has named Grace O'Malley Chief Technical Officer (CTO).
ZESTRON Academy Launches 2024 Advanced Packaging & Power Electronics Webinar Series
05/01/2024 | ZESTRONZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, proudly announces the launch of its highly anticipated webinar series on Advanced Packaging & Power Electronics, a webinar series on the latest innovations, cleaning, and corrosion challenges.