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TYRI Starts In-House Production of Circuit Boards in Sweden

05/30/2024 | Cision
TYRI, a world leader in lighting for work machines, is starting in-house production of circuit boards in Sweden. The 1,800 square-meter factory in Kungsbacka will make the company self-sufficient in this area. By doing this, TYRI will achieve increased control, higher quality, and more reliable deliveries.

Real Time with… IPC APEX EXPO 2024: An Introduction to IPC's Validation Services

05/29/2024 | Real Time with...IPC APEX EXPO
Randy Cherry, director of IPC's Validation Services (VS) Program, sits down with Editor Marcy LaRont to discuss the program's global success and expansion, touching on the IPC-1791 Trusted Supplier and Cybersecurity List, the QPL/QML programs, and a newly introduced standard being developed in the automotive space. Randy also shares his upcoming travel plans to Australia and expresses his hope that the VS program will see much global growth in the coming months.

SCHMID Group Takes Next Step Towards Advanced Packaging for Integrated Circuits with Glass Cores

05/29/2024 | GlobeNewswire
SCHMID Group N.V. (Nasdaq: SHMD) announces taking next step towards advanced packaging for integrated circuits with glass cores. Together with partners, the SCHMID Advanced IC Packaging Lab Solution is currently the sole supplier for full TGV lab with all process steps necessary to turn a bare glass substrate into an Advanced Integrated Circuit (IC) Package.

Real Time with… IPC APEX EXPO: A Unique Approach to Design for Manufacturability (DFM)

05/29/2024 | Real Time with...IPC APEX EXPO
Chad Orebaugh from Key Tronic Corporation, an electronics supplier, takes time to outline the company's operations, challenges, and their unique approach to design for manufacturability—DFM. Highlights of this conversation include the importance of industry standards and guidelines, while also emphasizing the need to innovate and manufacture beyond existing norms.

Best Student Poster: Drop Shock Reliability

05/29/2024 | Michelle Te, I-Connect007
Two Auburn University doctoral candidates authored a poster on drop shock performance of solder alloys in BGA assemblies that won Best Student Poster at IPC APEX EXPO 2024. They received a $750 cash prize and a $2,000 scholarship. Palash Vyas is a Ph.D. candidate in the Department of Industrial Engineering with more than three years of research experience in reliability testing of PCBs. His paper was co-authored by Soroosh Alavi, who has bachelor’s and master’s of science degrees in industrial engineering.
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