Atotech to Participate at JPCA Show 2022
June 6, 2022 | AtotechEstimated reading time: Less than a minute
Atotech Japan is excited to welcome you at JPCA Show 2022, Tokyo Big Sight, from June 15 to 17. You can find our team at booth # 6B06, where we will introduce a series of new products and process solutions to the market.
Here is a short list of our show highlights:
Flexible PCBs
- ViaKing® – A new direct metallization process based on graphite
- InPro® FlexFill – A new economical via filling solution for high-end flex PCBs
- V-Plate® – New vertical continuous plating equipment for copper plating
- Stanna-Flex® – New immersion tin finish for high-end flex PCBs
IC-Substrates
- Printoganth® MV TP2 – New electroless Cu process for fine line and high-frequency ICs
- InPro® SAP5 – New BMV filling in VCL systems for ICs at high current density
- InPro® CPF2 – A new electrolytic process for copper pillar plating on C4 side
- NovaBond® EX-S2 – A new ultra-low roughness bonding enhancement for IC substrates
- Uniplate® NGU – High-end PCB equipment for mSAP and amSAP applications
Event: JPCA Show 2022
Date: June 15-17, 2022
Venue: Tokyo Big Sight East Exhibition Halls
Booth: #6B-06
Suggested Items
DuPont Showcases AI Innovations Featuring Advanced Interconnects at 2024 International Electronic Circuits Exhibition
05/13/2024 | DuPontDuPont announced it will showcase its comprehensive range of advanced circuit materials and solutions at the 2024 International Electronic Circuits Exhibition in Shanghai. With a product portfolio that includes fine line, signal integrity, power and thermal management, DuPont will exhibit at Booth #8L06 at the National Exhibition and Convention Center (NECC) from May 13 to 15.
MKS’ Atotech to Participate in ECTC
05/10/2024 | MKS’ AtotechAt this year’s 74th IEEE Electronic Components and Technology Conference (ECTC), MKS’ Atotech will present and demonstrate its latest product and service innovations.
The Chemical Connection: Reducing Etch System Water Usage, Part 2
05/02/2024 | Don Ball -- Column: The Chemical ConnectionIn my last column, I reviewed some relatively simple ways to reduce water usage in existing etch systems: cutting down cooling coil water flow, adding chillers to replace plant water for cooling, lowering flow rate nozzles for rinses, etc. This month, I’ll continue with more ways to control water usage in your etcher. Most of these are not easily retrofittable to existing equipment but should be given serious consideration when new equipment is contemplated. With the right combination of add-ons, it is possible to bring the amount of water used in an etch system to almost zero.
Designer’s Notebook: What Designers Need to Know About Manufacturing, Part 2
04/24/2024 | Vern Solberg -- Column: Designer's NotebookThe printed circuit board (PCB) is the primary base element for providing the interconnect platform for mounting and electrically joining electronic components. When assessing PCB design complexity, first consider the component area and board area ratio. If the surface area for the component interface is restricted, it may justify adopting multilayer or multilayer sequential buildup (SBU) PCB fabrication to enable a more efficient sub-surface circuit interconnect.
Insulectro’s 'Storekeepers' Extend Their Welcome to Technology Village at IPC APEX EXPO
04/03/2024 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, welcomes attendees to its TECHNOLOGY VILLAGE during this year’s IPC APEX EXPO at the Anaheim Convention Center, April 9-11, 2024.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in