-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueLevel Up Your Design Skills
This month, our contributors discuss the PCB design classes available at IPC APEX EXPO 2024. As they explain, these courses cover everything from the basics of design through avoiding over-constraining high-speed boards, and so much more!
Opportunities and Challenges
In this issue, our expert contributors discuss the many opportunities and challenges in the PCB design community, and what can be done to grow the numbers of PCB designers—and design instructors.
Embedded Design Techniques
Our expert contributors provide the knowledge this month that designers need to be aware of to make intelligent, educated decisions about embedded design. Many design and manufacturing hurdles can trip up designers who are new to this technology.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - design007 Magazine
IPC's PCB Design for Manufacturability
December 28, 2023 | IPCEstimated reading time: 1 minute
Taught by an industry expert with more than 40 years of experience in the field, this 3-week online program, which starts Feb 20, 2024 | 12:00pm and runs through , is designed to provide the knowledge and skills necessary to reduce or eliminate design, documentation, and capability issues that often arise when completed PCB designs are sent to the fabricator for production.
Course Content
- DfM Course Introduction, Fabricator Capability and Materials
- Panelization, Stackups and Surface Finishes
- Conductive Features, Holes/Vias and Other Mechanical Features
- Masks and Inks, Impedance and Signal Loss, and Electrical Test
- FPC, Documentation and Specifications
- Participants receive the following helpful documents developed by Korf Consultancy LLC.
PCB Fabrication Design Rules
This editable document is designed to help PCB designers avoid many of the issues identified during the fabricator’s initial DFM review. It provides an extensive list of sample design rule parameters that designers can use to ensure that their designs are compatible with fabricator capabilities before the fabricator’s initial review. These globally representative design parameters are based on the most recent PCB design requirements.
Rigid PCB Fabrication Acceptance Specification
This editable document provides recommended qualification and performance specifications for all IPC-6012 requirements defined as AABUS (As Agreed Between User and Subscriber). Designers can use this document to inform fabricators of their company’s specific manufacturing, documentation, and quality requirements, inclusive of those that do not appear in IPC Standards.
Suggested Items
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Siemens Delivers New Solido IP Validation Suite
05/07/2024 | SiemensSiemens Digital Industries Software introduced Solido™ IP Validation Suite software, a comprehensive, automated signoff solution for quality assurance across all design intellectual property (IP) types, including standard cells, memories and IP blocks.
Altair Acquires Research in Flight, Forging a New Path for Aerodynamic Analysis
05/07/2024 | AltairAltair a global leader in computational intelligence, announced it has acquired Research in Flight, maker of FlightStream®, which provides computational fluid dynamics (CFD) software with a large footprint in the aerospace and defense sector and a growing presence in marine, energy, turbomachinery, and automotive applications.
Happy’s Tech Talk #28: The Power Mesh Architecture for PCBs
05/07/2024 | Happy Holden -- Column: Happy’s Tech TalkA significant decrease in HDI substrate production cost can be achieved by reducing the number of substrate layers from conventional through-hole multilayers and microvia multilayers of eight, 10, 12 (and more), down to four. Besides reducing direct processing steps, yield will increase as defect producing operations are eliminated.
Hirose Launches Solution Partner Network to Address Changing Design Challenges
05/06/2024 | HiroseHirose, a leader in the design and manufacturing of innovative connector solutions, has established a Solution Partner Network that enables OEMs to quickly explore product design, specialty IP, and component fulfillment options that best suit their needs.