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Old School vs. New School
The rules are changing. Explore the technologies, design strategies, and manufacturing innovations challenging conventional wisdom while revealing which fundamentals remain critical to success.
Signal Integrity & Metallization
Signal integrity and additive manufacturing, particularly metallization, are hot topics in PCB design and fabrication. PCB layouts are carefully engineered to achieve specific electrical and power performance targets.
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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Murata, Synopsys Team Up on Ansys Simulation Models
Murata Manufacturing Co., Ltd. announces a new collaboration with Synopsys, Inc., enabling users of Synopsys' simulation tools to navigate directly...
Flexible Circuit Technologies Expands Global Manufacturing Footprint with Thailand Operations
Flexible Circuit Technologies (FCT), a leading global provider of flexible circuit design, advanced interconnect solutions, and electronics...
Altium Education Celebrates First Mayan-on-Chip Cohort in Yucatán
Altium, a global leader in software and solutions for the electronics industry, announced the successful completion of the first Mayan-on-Chip cohort...
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
June 19, 2026 | Michelle Te, I-Connect007
Why do so many students who begin college intending to pursue STEM careers ultimately change direction? According to research highlighted by Malcolm Gladwell, the answer often has less to do with ability than perseverance. That spirit of continuous learning is reflected in my must-reads for the week, from major industry investments and policy developments to conferences, publications, and tools designed to help engineers improve their craft. Be sure to read the June issues of I-Connect007 Magazine and the Advanced Electronics Packaging Digest, which both published this week. They serve as a reminder that innovation depends not only on technology, but also on the people willing to keep learning and growing throughout their careers.
The PCB Designer's Blind Spot: No Feedback, No Progress
June 18, 2026 | Stephan Schmidt, Pentalogix
In PCB design, time and effort are everything. You've spent weeks perfecting your schematic, routing traces, and ensuring signal integrity. Finally, you generate those Gerber files and send them off to your preferred PCB fabricator. It's a moment of relief: The design is out of your hands, and production can begin. But what happens next? For many PCB designers, the answer is surprisingly unclear. Fabricators often make manufacturability adjustments without providing detailed feedback, leaving designers unaware of recurring issues.
MORE ARTICLES
Beyond Design: How Signals Survive the Hostile PCB Environment
June 3, 2026 | Barry Olney, Beyond Design
Modern digital signals exhibit behavior more characteristic of RF waveforms than the slow logic transitions of the past. With fast rise times, a PCB is no longer a collection of copper traces, but a distributed electromagnetic system....
Connect the Dots: What Designers Should Know About Non-conductive Via Fill
May 28, 2026 | Matt Stevenson, Connect the Dots
The rapid advance of technology is driving changes in electronics that require increasingly smaller boards capable of handling higher signal speeds and supporting more robust software applications. Manufacturers are increasingly...
Target Condition: The Modern Masters of Signal Integrity and AI-driven Design
May 21, 2026 | Kelly Dack, Target Condition
Signal integrity (SI) in PCB design has moved from a niche engineering concern to the defining factor in whether modern electronics succeed or fail. As data rates push beyond PAM4 (4-level 112G) gigabit territory and SerDes components...
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- Every Layer Interconnect — The Promise, the Pain, and the Practical Limits by Anaya Vardya
- Base Material Properties and Microvia Reliability by Ed Kelley
- Building Better HDI Boards: Driving Quality Through Lamination with Ralph Jacobo
- One Design, Many Minds: From Concurrent to Co-design with Kristin Moyer
- Elementary, Mr. Watson: Builders of the Dream by John Watson
- The PCB Designer's Blind Spot: No Feedback, No Progress by Stephan Schmidt