Ventec’s Glass-Free Revolution: Smarter Material Data for Next-Gen PCB Designs
At Ventec, we’re excited to see our Glass-Free Bondply materials now included in the latest release of Polar Instruments’...
Polar's Speedstack Eases Material Identification and Adds Ventec Glass-Free Materials
Polar’s Speedstack mid-year release adds Ventec Glass-Free materials to online resources, and incorporates improved capability of identifying multi...
CELUS, Variscite and NXP Enable AI-Driven Embedded Design
CELUS, the AI-driven electronics design automation provider, announced a strategic partnership with Variscite, a leading provider in the System on...
Global Electronics Association Brings IPC Builds Standards Development Event to Paris
The global electronics industry will gather in Paris this September to help shape the standards that define how electronics are designed, built,...
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
August 14, 2026 | Marcy LaRont, I-Connect007
Another week has flown by, and it’s time for the must-read articles and news highlights. This week, I’m putting a spotlight on FUJI PCB and FS Quality, through an interview by Dan Beaulieu with President Tianming Liu, and “the rest of the story” from the EIPC Summer Conference technical sessions. I’m also focusing on a new marketing book by Brittany Martin, and there’s rarely a week when we don’t talk about AI, so I also chose Sean Patterson’s most recent practical advice for PCB fabricators. Though the U.S. has placed a “stay” on CMMC Level 2 certification, it’s still coming for you and your business. If you work in the Mil/Aero space in the U.S., check out what Omega EMS has done to accelerate its compliance. Their wisdom may be worth your time.
A Practical Approach to Material Selection for High Power PCBs
August 13, 2026 | Drew Delaney, Isola Group
With AI server architectures demanding high-power converter solutions to improve power efficiency and affordability, PCB design can challenge engineers who treat material selection as a single-variable problem. Pick a laminate for thermal conductivity, and you may experience a CTE mismatch that cracks vias after 50 thermal cycles. Optimize for dielectric loss, and you might sacrifice the isolation margin your certification depends on. High-power boards require consideration of multiple variables, including electrical, thermal, mechanical, reliability, and manufacturability, which cannot be optimized alone.
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Elementary, Mr. Watson: Inside the Display Power Loop
August 6, 2026 | John Watson, Elementary, Mr. Watson
In my previous column, I traced the evolution from fixed physical interfaces to dynamic, software-defined displays, and saw how a familiar model of input and output slowly gave way to something far more fluid. That foundation begs the...
Powering the Future: Performance Is Won in Assembly
August 5, 2026 | Brian Buyea, Powering the Future
There’s a moment in every design cycle when the conversation shifts from the elements of a substrate—material selection, thermal conductivity, circuit density, layout, and performance on paper—to how it performs in assembly. No...
Connect the Dots: Total Value Manufacturing Solutions
July 30, 2026 | Matt Stevenson, Connect the Dots
In my last column, I discussed total value management, an approach to the quality-versus-cost balancing act that integrates components of total quality management (TQM) and Lean manufacturing. Like those other methodologies, total...
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