Fresh PCB Concepts: IPC-6012 Class 3 and High-reliability PCB Manufacturing
Siemens to Acquire Defacto Technologies to Bolster EDA Portfolio
Siemens announced that it has entered into an agreement to acquire Defacto Technologies, a privately held EDA software company active in the...
Siemens to Acquire Precision Innovations to Expand AI-Powered Chip Design Optimization
Siemens announced that it has signed an agreement to acquire Precision Innovations Inc., a privately held electronic design automation software...
Siemens, Cloudberry VC Collaborate to Accelerate European Deep-tech Innovation
Siemens announced a collaboration between Siemens Cre8Ventures and Cloudberry VC to help accelerate commercialization of Europe’s sovereign...
Cadence Launches AuraStack AI Super Agent
The AuraStack AI Super Agent is the world's first agentic AI platform for PCB and advanced packaging...
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
July 23, 2026 | Marcy LaRont, I-Connect007
In this week’s top five must-reads, I chose articles that go from big business questions (to diversify or not), to important technical issues such as DFM errors made in creating HDI designs using ELIC and design for test, to a discussion around some of the power and thermal considerations in advanced packaging, and the fact that they are now, firmly, performance enablers, not after-the-fact elements to be managed in fabrication.
Meet the Author Podcast: Bert Horner on Design for Test
July 23, 2026 | I-Connect007
I-Connect007 is pleased to announce the release of Episode 7 of the “Meet the Author” podcast, featuring Bert Horner, president of TTCI, discussing his new book, The Printed Circuit Assembler's Guide to... Design for Test. In this conversation with Nolan Johnson, Horner explores what he calls the "Butterfly Effect" of Design for Test (DFT): Decisions made early in the design process can significantly influence manufacturing success, product reliability, and long-term profitability.
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Beyond Design: Skip-layer Routing—The Waveguide Structure That Makes 224G Possible
July 9, 2026 | Barry Olney, Beyond Design
As data rates climb from 112G PAM4 toward 224G PAM4 and beyond, electronics designers are discovering that traditional stripline and microstrip geometries are no longer sufficient. The physics simply break. Rise times are now in the...
Designers Notebook: Old vs. New School System-level Packaging—Flip-Chip to Chiplets
July 8, 2026 | Vern Solberg, Designer's Notebook
The electronics industry has experienced a renaissance in semiconductor package technology, driven by the need to maximize electronic product functionality while minimizing the area reserved for component mounting and interconnects....
Elementary, Mr. Watson: Builders of the Dream
July 2, 2026 | John Watson, Elementary, Mr. Watson
In 1849, French writer, journalist, and satirist Jean-Baptiste Alphonse Karr wrote the famous line, “Plus ça change, plus c’est la même chose,” which translates as “The more things change, the more they stay the same.” He...
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