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I-Connect007 Editor’s Choice: Five Must-Reads for the Week

June 19, 2026 | Michelle Te, I-Connect007

Why do so many students who begin college intending to pursue STEM careers ultimately change direction? According to research highlighted by Malcolm Gladwell, the answer often has less to do with ability than perseverance. That spirit of continuous learning is reflected in my must-reads for the week, from major industry investments and policy developments to conferences, publications, and tools designed to help engineers improve their craft. Be sure to read the June issues of I-Connect007 Magazine and the Advanced Electronics Packaging Digest, which both published this week. They serve as a reminder that innovation depends not only on technology, but also on the people willing to keep learning and growing throughout their careers.

The PCB Designer's Blind Spot: No Feedback, No Progress

June 18, 2026 | Stephan Schmidt, Pentalogix

In PCB design, time and effort are everything. You've spent weeks perfecting your schematic, routing traces, and ensuring signal integrity. Finally, you generate those Gerber files and send them off to your preferred PCB fabricator. It's a moment of relief: The design is out of your hands, and production can begin. But what happens next? For many PCB designers, the answer is surprisingly unclear. Fabricators often make manufacturability adjustments without providing detailed feedback, leaving designers unaware of recurring issues.




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Beyond Design: How Signals Survive the Hostile PCB Environment

June 3, 2026 | Barry Olney, Beyond Design

Modern digital signals exhibit behavior more characteristic of RF waveforms than the slow logic transitions of the past. With fast rise times, a PCB is no longer a collection of copper traces, but a distributed electromagnetic system....

Connect the Dots: What Designers Should Know About Non-conductive Via Fill

May 28, 2026 | Matt Stevenson, Connect the Dots

The rapid advance of technology is driving changes in electronics that require increasingly smaller boards capable of handling higher signal speeds and supporting more robust software applications. Manufacturers are increasingly...

Signal integrity (SI) in PCB design has moved from a niche engineering concern to the defining factor in whether modern electronics succeed or fail. As data rates push beyond PAM4 (4-level 112G) gigabit territory and SerDes components...

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