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Signal Integrity & Metallization
Signal integrity and additive manufacturing, particularly metallization, are hot topics in PCB design and fabrication. PCB layouts are carefully engineered to achieve specific electrical and power performance targets.
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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Flexible Circuit Technologies Expands Global Manufacturing Footprint with Thailand Operations
Flexible Circuit Technologies (FCT), a leading global provider of flexible circuit design, advanced interconnect solutions, and electronics...
Altium Education Celebrates First Mayan-on-Chip Cohort in Yucatán
Altium, a global leader in software and solutions for the electronics industry, announced the successful completion of the first Mayan-on-Chip cohort...
Cadence, Samsung Foundry Deepen 2nm and 3D-IC Collaboration for AI Infrastructure Demand
Cadence and Samsung Foundry announced development of a full portfolio of Memory and Interface IP, and expanded certification of Cadence’s agentic...
Valeo, Zuken Join Forces to Redefine Automotive Electronic Design
Valeo, a global leader in mobility technologies, and Zuken, a pioneer in Electronic Design Automation (EDA) software, announce a major strategic...
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
June 12, 2026 | Nolan Johnson, I-Connect007
It’s nearly the summer solstice, and here in the Pacific Northwest, the changing of the seasons will be like walking through a door. This week, while it’s still spring, we’ve been trudging through daytime highs of barely 60°F (15°C) with weather cells bringing rain squalls, thunderstorms, or gale-force winds. Next week, just as we approach the start of Summer, we’ll be sweltering near 100°F (38°C). So, while I wear a jacket at my desk today, in just a few days I’ll be wearing summer gear. I take this as a gentle reminder to always plan for the short term and the long term simultaneously.
Elementary, Mr. Watson: Controlled Impedance—When ‘Connecting the Dots’ Stops Working
June 11, 2026 | John Watson, Elementary, Mr. Watson
Signal integrity follows physics that are consistent, predictable, and fully explainable. But those rules don’t show up in the schematic. Instead, they live in the electromagnetic fields around the traces, in the stackup, and in the relationship between conductors and their return paths. The authors weren’t claiming black magic; they were calling out how it feels until you learn what’s going on. The fact that they said it more than 30 years ago only reinforces how fundamental and enduring these concepts really are.
MORE ARTICLES
Connect the Dots: What Designers Should Know About Non-conductive Via Fill
May 28, 2026 | Matt Stevenson, Connect the Dots
The rapid advance of technology is driving changes in electronics that require increasingly smaller boards capable of handling higher signal speeds and supporting more robust software applications. Manufacturers are increasingly...
Target Condition: The Modern Masters of Signal Integrity and AI-driven Design
May 21, 2026 | Kelly Dack, Target Condition
Signal integrity (SI) in PCB design has moved from a niche engineering concern to the defining factor in whether modern electronics succeed or fail. As data rates push beyond PAM4 (4-level 112G) gigabit territory and SerDes components...
Fresh PCB Concepts: Repair and Risk in Electrical Test Failures in PCB Manufacturing
May 21, 2026 | Team NCAB, Fresh PCB Concepts
Electrical test failures represent one of the most critical decision points in PCB manufacturing because they directly expose defects that affect circuit functionality. Unlike cosmetic anomalies or minor process deviations, these...
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- The Consequences of Additive Metallizing on Etching Steps by Don Ball
- Rewriting Metallization, One Ink at a Time with Melbs LeMieux, Electroninks
- Direct Metallization: A Strategic Enabler for Advanced PCB Manufacturing by Carmichael Gugliotti, MacDermid Alpha
- Common Mode vs. Differential Mode and Signal Integrity by Kristin Moyer
- Controlled Impedance—When Connecting the Dots Stops Working by John Watson
- Mastering Return Path Discontinuities for Robust Signal Integrity by Stephen Chavez