Connect the Dots: What PCB Designers Should Know About Materials
Designers Notebook: Implementing Strategic Planning Principles for PCB Design
I-Connect007 Launches New Qnity Podcast Series, ‘Engineering What’s Next’
I-Connect007 is pleased to announce the launch of On the Line With… Qnity: Engineering What’s Next, a new six-part podcast series exploring the...
Zuken Launches E3.series 2027 With Expanded Engineering and Manufacturing Capabilities
Zuken announced E3.series 2027, the latest release of its electrical design software for wiring, wire harness, fluid, and control systems...
Synopsys Posts Financial Results for Q3 Fiscal Year 2026
Synopsys, Inc. reported results for its third quarter of fiscal year 2026. Revenue for the third quarter of fiscal year 2026 was $2.477 billion,...
Two Teams Tie for Top Honors in Bright Electronics Manufacturing Challenge 2026 Round 1
The Electronics Manufacturing & Assembly Collaborative (EMAC) announced the Round 1 results of the Bright Electronics Manufacturing Challenge 2026,...
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
September 18, 2026 | Nolan Johnson, I-Connect007
The middle months of 2026 have been defined by, shall we say, “projects” throughout the industry, and as we approach the end of the third quarter, many of those projects are coming to light. That’s the theme I’m getting from this week’s news, and I tried to capture it with my selections. My must-reads include a market update on the leading fabless semiconductor houses, a call to action from SEMI directed at the policymakers in the European Union, a rollup of workforce and educational programs announced just this week, a role change at Indium, and the relaunch of the Global Electronics Association Sustainability teams’ DMA Toolkit.
Below the Surface: What Engineers Find Challenging About High Frequency Signal Integrity
September 17, 2026 | Chandra Gupta, Below the Surface
How do materials affect RF signal performance? It’s a fair question, and most will assume they already understand the answer. But this misunderstanding is exactly why so many high frequency designs underperform, require rework, or worse, fail in the field. Below the surface, where signal integrity is either preserved or destroyed, the truth is that at high frequencies, material selection matters, and that’s where most engineers get it wrong.
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Elementary, Mr. Watson: The ‘Baton’ Handoff Makes or Breaks the Design
September 3, 2026 | John Watson, Elementary, Mr. Watson
In my previous column in I-Connect007 Magazine, I shared the example of the U.S. men’s 4x100-meter relay team at the Tokyo 2020 Olympics. Trayvon Bromell, Fred Kerley, Ronnie Baker, and Cravon Gillespie were among the fastest...
Flexible Thinking: Beyond DFM—PCB Design and Manufacturing as a Cooperative Effort
September 1, 2026 | Joe Fjelstad, Flexible Thinking
The concept of co-designing PCBs by incorporating input from all areas of manufacturing has grown significantly over the past several years, bringing a sharper focus on the early contributors to a collaborative electronic system. From...
Elementary, Mr. Watson: Inside the Display Power Loop
August 6, 2026 | John Watson, Elementary, Mr. Watson
In my previous column, I traced the evolution from fixed physical interfaces to dynamic, software-defined displays, and saw how a familiar model of input and output slowly gave way to something far more fluid. That foundation begs the...
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