Fresh PCB Concepts: Repair and Risk in Electrical Test Failures in PCB Manufacturing
Cadence, Samsung Foundry Deepen 2nm and 3D-IC Collaboration for AI Infrastructure Demand
Cadence and Samsung Foundry announced development of a full portfolio of Memory and Interface IP, and expanded certification of Cadence’s agentic...
Valeo, Zuken Join Forces to Redefine Automotive Electronic Design
Valeo, a global leader in mobility technologies, and Zuken, a pioneer in Electronic Design Automation (EDA) software, announce a major strategic...
Synopsys Posts Financial Results for Q2 Fiscal Year 2026
Synopsys, Inc. reported results for its second quarter of fiscal year 2026. Revenue for the second quarter of fiscal year 2026 was $2.276 billion,...
Itera Exits Stealth with $12M to Bring Real-Time Prototyping to Electronics
Deep tech startup Itera emerged from stealth with a prototype of the world’s first fluid circuit board, enabling engineers to test and modify...
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
May 29, 2026 | Michelle Te, I-Connect007
This week’s picks all seem to circle around one bigger reality: The electronics industry is rebuilding itself in real time. Whether it’s investing in workforce development, reshaping manufacturing processes, modernizing how we communicate with readers, or strengthening domestic advocacy, there’s a noticeable shift from simply reacting to challenges toward actively building long-term infrastructure.
Connect the Dots: What Designers Should Know About Non-conductive Via Fill
May 28, 2026 | Matt Stevenson, Connect the Dots
The rapid advance of technology is driving changes in electronics that require increasingly smaller boards capable of handling higher signal speeds and supporting more robust software applications. Manufacturers are increasingly called upon to produce ultra high density interconnect (UHDI) PCBs, so it’s important to tune our production capabilities and customer service models to this trend. Non-conductive via fill (NCVF) offers a cost-effective, reliable manufacturing method that accommodates the densely packed, fine-pitch ball grid array (BGA) components present in UHDI designs.
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Target Condition: The Modern Masters of Signal Integrity and AI-driven Design
May 21, 2026 | Kelly Dack, Target Condition
Signal integrity (SI) in PCB design has moved from a niche engineering concern to the defining factor in whether modern electronics succeed or fail. As data rates push beyond PAM4 (4-level 112G) gigabit territory and SerDes components...
Connect the Dots: Designing for the Future of Manufacturing Reality—Surface Finish
May 7, 2026 | Matt Stevenson, Connect the Dots
When designing the complex boards that many electronic devices require to operate, designers should consider manufacturability at every step. This is my last article focused on designing for the always-evolving manufacturing reality....
The Pulse: Caught in the Crosshatch—A Cautionary Tale of Detective Work
April 29, 2026 | Martyn Gaudion, The Pulse
A chance meeting at a family wedding the other week led to a conversation about numbers, an introduction to a book entitled Humble Pi, and how numeric misinterpretation can lead to all kinds of unexpected outcomes, some just costly,...
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