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This issue examines how collaboration across the electronics ecosystem—from design through fabrication, packaging, AI infrastructure, and flexible circuits—drives innovation and manufacturable products.
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Zuken Launches E3.series 2027 With Expanded Engineering and Manufacturing Capabilities
Zuken announced E3.series 2027, the latest release of its electrical design software for wiring, wire harness, fluid, and control systems...
Synopsys Posts Financial Results for Q3 Fiscal Year 2026
Synopsys, Inc. reported results for its third quarter of fiscal year 2026. Revenue for the third quarter of fiscal year 2026 was $2.477 billion,...
Two Teams Tie for Top Honors in Bright Electronics Manufacturing Challenge 2026 Round 1
The Electronics Manufacturing & Assembly Collaborative (EMAC) announced the Round 1 results of the Bright Electronics Manufacturing Challenge 2026,...
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
September 11, 2026 | Marcy LaRont, I-Connect007
I feel compelled to start off by recognizing that today marks the 25th anniversary of the tragic activities that took place on 9/11/2001. Like so many of us, I will never forget exactly where I was and what I was doing when I heard that United flights 11 and 175 had struck the World Trade Center in NYC. That day, the world was forever changed, and the effects still reverberate. Today, I am taking a moment to remember the lives lost and the heroism and coming together that day brought about.
Who Really Designs the PCB?
September 10, 2026 | Stephen V. Chavez, Siemens EDA and PCEA
“Who designs the PCB?” sounds like a simple question, but it assumes there’s a simple answer. In reality, every discipline involved in product development, from electrical and mechanical engineering to manufacturing and procurement, has a hand in designing the PCB. Today’s products are created through constant collaboration among multiple engineering disciplines, each influencing decisions that affect performance, manufacturability, cost, and reliability. The PCB designer has not simply gained access to better tools, more automation, and/or sophisticated design methodologies.
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Elementary, Mr. Watson: The ‘Baton’ Handoff Makes or Breaks the Design
September 3, 2026 | John Watson, Elementary, Mr. Watson
In my previous column in I-Connect007 Magazine, I shared the example of the U.S. men’s 4x100-meter relay team at the Tokyo 2020 Olympics. Trayvon Bromell, Fred Kerley, Ronnie Baker, and Cravon Gillespie were among the fastest...
Flexible Thinking: Beyond DFM—PCB Design and Manufacturing as a Cooperative Effort
September 1, 2026 | Joe Fjelstad, Flexible Thinking
The concept of co-designing PCBs by incorporating input from all areas of manufacturing has grown significantly over the past several years, bringing a sharper focus on the early contributors to a collaborative electronic system. From...
Elementary, Mr. Watson: Inside the Display Power Loop
August 6, 2026 | John Watson, Elementary, Mr. Watson
In my previous column, I traced the evolution from fixed physical interfaces to dynamic, software-defined displays, and saw how a familiar model of input and output slowly gave way to something far more fluid. That foundation begs the...
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- The Relevance of VeCS as an HDI Process Option by Marcy LaRont
- VeCS HDI Process Technology: Has the Time Come for Broader Adoption? by Joan Tourné
- Life in the Engineering Ecosystem by Kelly Dack
- Designing for a More ‘Intelligent’ and Connected Future with Kristin Moyer
- Who Really Designs the PCB? by Stephen V. Chavez