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Designers Notebook: Implementing Strategic Planning Principles for PCB Design

September 3, 2026 | Vern Solberg, Designer's Notebook

Developing multiple-processor system-level products involves a broad range of engineering disciplines (commonly referred to as co-design), often led by a designated program manager who divides the development program into technical disciplines. The primary member of this team is the electrical engineer (EE), who prepares the overall schematic diagram of the product. This effort includes simulation and modeling, developing a BOM, and defining all active components and any specialized passive elements (often stipulating preferred or prequalified sources).

Elementary, Mr. Watson: The ‘Baton’ Handoff Makes or Breaks the Design

September 3, 2026 | John Watson, Elementary, Mr. Watson

In my previous column in I-Connect007 Magazine, I shared the example of the U.S. men’s 4x100-meter relay team at the Tokyo 2020 Olympics. Trayvon Bromell, Fred Kerley, Ronnie Baker, and Cravon Gillespie were among the fastest sprinters in the world. Reaching the final seemed almost certain. Instead, they finished sixth in their qualifying heat and missed advancing by only two-hundredths of a second. The problem was not speed, experience, or talent. It occurred during the baton exchange. Their failure demonstrated that being exceptional at an individual role does not guarantee collective success. A race can be lost not during the individual legs, but during the brief moments when responsibility changes hands.




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Elementary, Mr. Watson: Inside the Display Power Loop

August 6, 2026 | John Watson, Elementary, Mr. Watson

In my previous column, I traced the evolution from fixed physical interfaces to dynamic, software-defined displays, and saw how a familiar model of input and output slowly gave way to something far more fluid. That foundation begs the...

Powering the Future: Performance Is Won in Assembly

August 5, 2026 | Brian Buyea, Powering the Future

There’s a moment in every design cycle when the conversation shifts from the elements of a substrate—material selection, thermal conductivity, circuit density, layout, and performance on paper—to how it performs in assembly. No...

Connect the Dots: Total Value Manufacturing Solutions

July 30, 2026 | Matt Stevenson, Connect the Dots

In my last column, I discussed total value management, an approach to the quality-versus-cost balancing act that integrates components of total quality management (TQM) and Lean manufacturing. Like those other methodologies, total...

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