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Flexible Thinking: Musings on High Density Interconnections

10/30/2024 | Joe Fjelstad -- Column: Flexible Thinking
People have been using high density interconnection (HDI) technology since the early 1980s, although it was not called HDI until the late 1990s. In the 1970s, ’80s, and early ’90s, engineers used HDI methods to develop hybrid circuits, which were later referred to as multichip modules (MCMs). These were arguably the first instantiation of heterogeneous interconnection technology, which has been the industry buzzword for almost a decade. These devices are a way of integrating multiple chips—both integrated circuits and discrete devices (resistors, capacitors, and inductors)—into a single package, typically using ceramic substrates with layers of insulation and metallic inks (often gold) and firing them at high temperatures.

L3Harris, Palantir Announce Strategic Partnership

10/24/2024 | BUSINESS WIRE
L3Harris Technologies and Palantir Technologies Inc. announced a strategic partnership to propel advanced technology development and accelerate L3Harris’ digital transformation.

Unlock Unmatched Performance for Matched Impedance Devices with StratEdge at IEEE BCICTS 2024

10/22/2024 | StratEdge
StratEdge Corporation, an industry leader in high-frequency and high-power semiconductor packaging, is excited to announce its participation in the IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS).

High Density Packaging User Group Announces Dynamic Electronics Membership

10/14/2024 | High Density Packaging User Group
High Density Packaging User Group (HDP) is pleased to announce that Dynamic Electronics Co., Ltd. (Dynamic) has become a member.

Nordson EFD Wins a 2024 Edge Award for the PICO® Nexμs Jetting System

10/08/2024 | Nordson EFD
Nordson EFD, a Nordson company (NASDAQ: NDSN), announced its new-to-market PICO Nexμs jetting system has been recognized by Machine Design magazine with a 2024 Edge Award in the Automation & IIOT category.
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