American Made Advocacy: Smart Policies Can Ensure AI Data Centers Are Secure
Beyond the Board: Early Engagement Means Faster Prototyping for Defense Programs
Defense Speak Interpreted: The Autonomous Plane Battle—Skyborg Vs. Loyal Wingman
IPC Signs White House Pledge to the American Worker
November 5, 2018 | IPCEstimated reading time: 1 minute
On October 31, IPC announced that it has signed the President’s Pledge to the American Worker and made a commitment to create at least 1 million new training and workforce development opportunities in the electronics industry over the next five years. IPC‘s announcement coincided with an event at the White House with President Trump, White House Senior Adviser Ivanka Trump, Director of the National Economic Council Larry Kudlow, and other Administration officials.
IPC President and CEO John Mitchell and representatives from four IPC member companies — Calumet Electronics, Green Circuits, Summit Interconnect, and Zentech — were invited to participate in the event. In brief remarks, Ivanka Trump recognized IPC and praised our commitment to skilled workforce opportunities.
Calumet Electronics, which is one of the largest employers in the Upper Peninsula of Michigan and is celebrating its 50th anniversary this year, was featured in a local TV news report following the event.
Get Involved and Help Grow the Workforce of Tomorrow
To achieve the goal of creating 1 million new training and career opportunities over the next five years, IPC is calling on IPC member companies to join our “IPC Workforce Champions” campaign. IPC Workforce Champions commit to work with IPC on three of our five education, training and workforce development programs, including participating in the IPC Job Task Analysis Committee; developing “Earn and Learn” programs; partnering with IPC on STEM programming in secondary and post-secondary schools; supporting scholarships through the IPC Education Foundation; and adopting the IPC certification framework in their companies.
Some of the IPC members that have already joined the IPC Workforce Champions and are leading the way to address the skills gap include:
• ALTEX
• Green Circuits
• Eagle Circuits
• Optimum Design
• STI Electronics
• Summit Interconnect
• TTM Technologies
• VirTex MTI
To learn more about IPC Workforce Champions and/or to sign up, please click here.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Henger Microelectronics Expands Global Footprint with Major Equipment Shipment to Southeast Asia
10/31/2025 |Henger Microelectronics has reached a major milestone in its global expansion strategy with the successful shipment of advanced plasma etching and cleaning systems, along with automation equipment, to multiple countries and regions across Southeast Asia. This achievement marks a significant step forward in the company’s international growth and reinforces its position as a leading force in the global plasma equipment industry.
TTCI Brings Hands-On Test Engineering and IPC Training Expertise to PCB Carolina 2025
10/31/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB Carolina on Wednesday, November 12, 2025, at the McKimmon Center at NC State University in Raleigh, North Carolina. Attendees can visit Table 4 to say hello to Bert Horner and Bill Graver, and learn more about their test engineering services and technical training programs.
Cephia Secures $4M Seed Funding to Revolutionize Multimodal Sensing with Metasurface Technology
10/31/2025 | PRNewswireCephia, a startup building products using advanced AI computational imaging technologies and silicon sensors made from advanced metamaterials, formally launched with several pilot customers and $4 million in seed venture capital funding.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
NEDME 2025 Draws Strong Northwest Crowd, Builds on Tradition of Regional Collaboration
10/31/2025 | NEDMEThe NW Electronics Design & Manufacturing Expo (NEDME) 2025 once again brought together the Pacific Northwest community for a full day of learning, networking, and industry connections.