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SCHMID Wins Innovation Award productronica 2025 for InfinityLine L+

11/19/2025 | SCHMID Group
SCHMID Group, is proud to announce that its InfinityLine L+ has been awarded the Innovation Award productronica 2025 in the category Cluster PCB & EMS.

How HDI/UHDI Manufacturing Converge With Interposers and Substrates

11/17/2025 | Marcy LaRont, I-Connect007
For decades, the PCB and the semiconductor package lived in separate universes. PCBs belonged to the world of board shops, panels, and assembly lines; packages belonged to semiconductor fabs and OSATs. Substrates and interposers, meanwhile, were niche system-level package “components” in the middle, largely invisible to the outside world. That separation is dissolving as definitions broaden. The rise of high-density interconnect (HDI) and its next-generation cousin, ultra HDI (UHDI), is pushing PCB manufacturing into territory once reserved for semiconductor packaging.

Zhen Ding Reports Solid Performance for the First Three Quarters of 2025

11/13/2025 | Zhen Ding
Zhen Ding Technology Holding Limited, a global leading PCB manufacturer, announced its consolidated financial results for the third quarter of 2025.

LPKF Delivers Key Strategic Technology to Fraunhofer's Glass Panel Technology Group

10/29/2025 | LPKF
LPKF Laser & Electronics SE is one of the initiators of the Glass Panel Technology Group (GPTG), a consortium encompassing the entire process chain for advanced semiconductor packaging with glass substrates.

MKS’ Atotech Showcases Next-gen PCB and Substrate Manufacturing Solutions at CPCA Plus 2025

10/24/2025 | MKS’ Atotech
MKS Inc., a global provider of enabling technologies that transform our world, announced its participation in CPCA Plus Show 2025, taking place October 28 – 30 at Shenzhen International Convention and Exhibition Center.
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