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Berg Insight Expects Rapid Adoption of Autonomous Vehicle Technology in the Next 10 Years
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STMicroelectronics Introduces Advanced Human Presence Detection Solution to Enhance Laptop and PC User Experience
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Global Dry Film Photoresist Market Set for Robust Growth with Expanding Semiconductor Ecosystem
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NXP Completes Acquisition of TTTech Auto to Accelerate the Transformation to Software-Defined Vehicles
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Analog Devices Launches ADVentures, a New Corporate Venture Capital Fund
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New GENESIS Project to Advance Sustainable Semiconductor Manufacturing in Europe
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Berg Insight Expects 60 Million Two-wheelers to Have an Active OEM Embedded Telematics System by 2029
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Crusoe Announces Strategic European Expansion with First Data Center in Norway, Partnering with Polar
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Indra Signs Agreement with AXISCADES to Boost Production of Cutting-Edge Systems in India
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Nordic Semiconductor Accelerates Edge AI Leadership with Acquisition of Neuton.AI
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NHanced Semiconductors VP Charles Woychik to Deliver Keynote at SMTA’s Symposium on Counterfeit Parts & Materials
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Alpha and Omega Semiconductor Introduces 25V MOSFET in DFN3.3x3.3 Source-Down Packaging
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Keysight, NTT, and NTT Innovative Devices Achieve 280 Gbps World Record Data Rate with Sub-Terahertz for 6G
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Agileo Automation Announces Future Expansion of A²ECF-SEMI Automation Framework with SEMI EDA Standards
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Nordson Electronics Solutions Develops Panel-level Packaging Solution for Powertech Technology
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Robust Gaming Demand Drives OLED Monitor Panel Shipments to Rise 69% YoY in 2025
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MRSI Systems, LLC Files Patent Infringement Lawsuit Against Suzhou LieQi in China
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President Trump Secures $200B Investment from Micron Technology for Memory Chip Manufacturing in the United States
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Robust AI Demand Drives 6% QoQ Growth in Revenue for Top 10 Global IC Design Companies in 1Q25
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Cadence Advances Design and Engineering for Europe’s Manufacturers on NVIDIA Industrial AI Cloud
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China Subsidy Program Drives 1Q25 Smartphone Production to 289 Million Units
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Nordson Appoints Chase Collier as a Regional Sales Manager for the EDI Product Line
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Microtech Announces the First U.S. Atrial Microsensor Implantations as Part of its FIH Study
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VIAVI, Hanyang University Sign Memorandum of Understanding to Advance 6G Research
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VeriSilicon’s AI-ISP Custom Chip Solution Enables Mass Production of Customer’s Smartphones
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Tariff Effects and China Subsidies Soften 1Q25 Downturn; Foundry Revenue Decline Narrows to 5.4%
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Project GENESIS Minimizes Ecological Footprint in Europe’s Semiconductor Industry
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GigaDevice Anchors Global Headquarters in Singapore to Power Synergy and Impact
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New Companion Guide to ‘DFM Essentials’ Delivers Deeper, Practical PCB Design Insights
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Cadence Extends Support for Automotive Solutions on Arm Zena Compute Subsystems
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Growing Demand for Mid-Size Displays Opens New Opportunities for FMM-Free OLED Technologies
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GlobalFoundries Announces $16B U.S. Investment to Reshore Essential Chip Manufacturing and Accelerate AI Growth
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Siemens Announces PAVE360 Support for New Arm Zena Compute Subsystems
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New Era Electronics Establishes U.S. Presence with New Salt Lake City Operation
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IIT Kharagpur, A*STAR Singapore Forge Strategic Partnership to Advance Semiconductor Innovation in Asia
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DRAM Revenue Drops 5.5% in the First Quarter of 2025; SK hynix Overtakes Samsung for Top Spot
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Elma Electronic Bolsters Quality Management Company-wide with Added AS9100:D and ISO9001:2015 Certifications
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Meyer Burger Shuts Down Solar Module Production, Lays Off 282 Employees in the U.S.
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Arrow Electronics Earns Dual Honors as Dell Technologies Partner of the Year
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Indium to Feature Precision Gold-Based Die-Attach Preforms at IMS 2025
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Huawei Single SitePower Solution Creates Four Synergies to Accelerate Site Intelligence
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AI Demand Fuels Enterprise SSD Growth; 3Q25 NAND Flash Prices Likely to Rise Further
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ClassOne Technology, IBM Research Jointly Developing Non-NMP Solvent Processing for Semiconductor Manufacturing
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Hitachi Energy, Statnett to Deliver Norway’s First Eco-Efficient Transmission Grid Connection Solution
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TI Teams with NVIDIA to Bring Efficient Power Distribution to AI Infrastructure
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AI Demand Fuels Enterprise SSD Growth; 3Q25 NAND Flash Prices Likely to Rise Further
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Qualcomm, Xiaomi Expand Collaboration with Multi-Year Agreement
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HBM4 Raises the Bar on Manufacturing Complexity, Premium Expected to Exceed 30%
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TRUMPF Electronics Announces the Opening of a Technical Center in Southeast Asia
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STMicroelectronics Announces Expanded "Lab-in-Fab" Collaboration in Singapore to Advance Piezoelectric MEMS Technology
05/22/2025 | STMicroelectronics
GlobalFoundries Partners with A*STAR to Accelerate Advanced Packaging Innovation
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Foxconn, Thales Group Announce Strategic Partnership in Semiconductor and Space
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ICEYE, Safran Announce Strategic Partnership on Persistent Surveillance Capabilities
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Deca Announces Agreement with IBM to Bring High-Density Fan-Out Interposer Production to North America
05/20/2025 | Deca Technologies
Keysight Quantum Control System Embedded within Fujitsu and RIKEN’s World-Leading 256-Qubit Quantum Computer
05/16/2025 | BUSINESS WIRE
ITEN, A*STAR IME Announce Breakthrough in Solid-State Battery Integration for Advanced Packaging
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