Showa Denko, AIST, NEDO and ADMAT Prove AI Speeds up Development of Flexible Transparent Film
April 13, 2020 | ACN NewswireEstimated reading time: 2 minutes

Showa Denko, National Institute of Advanced Industrial Science and Technology, New Energy and Industrial Technology Development Organization and Research Association of High-Throughput Design and Development for Advanced Functional Materials (ADMAT) have cooperatively proved that introduction of artificial intelligence (AI) into the process to develop flexible transparent film can reduce the numbers of times of experiment to produce film that satisfies required properties to one-twenty-fifth (1/25) or less of those conventional development methods require.
This development work has been subcontracted by NEDO's "Ultra High-Throughput Design and Prototyping Technology for Ultra Advanced Materials Development Project" (Ultra-Ultra PJ) to the consortium. By fully utilizing AI and multiscale simulation, Ultra-Ultra PJ aims to reduce substantially the numbers of times of experiment and development period required for the development of flexible transparent film from those conventional ways of material development require.
Researchers of SDK, AIST and ADMAT have been conducting AI-based searches for polymers that satisfy properties required for designing of flexible transparent film, which is essential for development of mobile devices. As the first step of this research, skilled researchers produced 27 types of films. Then researchers incorporated chemical information including molecular structures and mole ratios into explanatory variables with a special method named Extended Connectivity Circular Fingerprints (ECFP4), and chose converted transmissivity, braking stress and stretch as objective variables. These three objective variables have trade-off relations and are incompatible among them. Then, researchers made the AI learn actual values of these variables.
Following these steps, researchers prepared data including comprehensively dispersed explanatory variables, made the AI learn concept of the deviation value and estimate several combinations of materials for films that would maximize the three objective variables with the same ratio. Then researchers manufactured three types of films based on the recommendation AI made. Concurrently, as a comparative experiment, the skilled researchers who prepared the 27 sample films at the first step also made 25 types of films based on their own knowledge and experience. Next, we compared properties of the three types of films based on combination of materials recommended by the AI and 25 types of films prepared by the skilled researchers who made the 27 types of films in the first step of the research.
As a result, physical properties of all of the three types of films made from combinations of raw materials recommended by the AI showed superiority over those of the 25 types of films made by the skilled researchers. We obtained films with physical properties superior to those developed by skilled researchers through one-twenty-fifth times of experiments or less compared to the development process conducted by the skilled researchers. Thus, we proved that we can substantially shorten the period of development of flexible transparent films by utilizing AI, and that it is possible for us to develop films with physical properties superior to those of films made by researches based on their knowledge and experience.
Hereafter, we will improve this technology further, and develop a system in which the AI can suggest ratios of combinations of raw materials that can produce target products with even better physical properties while satisfying required characteristics. Today, we also announced the detail of this development work on the Website reporting results of the Ultra High-Throughput Design and Prototyping Technology for Ultra Advanced Materials Development Project (Ultra-Ultra PJ).
Suggested Items
Copper Price Surge Raises Alarms for Electronics
07/15/2025 | Global Electronics Association Advocacy and Government Relations TeamThe copper market is experiencing major turbulence in the wake of U.S. President Donald Trump’s announcement of a 50% tariff on imported copper effective Aug. 1. Recent news reports, including from the New York Times, sent U.S. copper futures soaring to record highs, climbing nearly 13% in a single day as manufacturers braced for supply shocks and surging costs.
Symposium Review: Qnity, DuPont, and Insulectro Forge Ahead with Advanced Materials
07/02/2025 | Barb Hockaday, I-Connect007In a dynamic and informative Innovation Symposium hosted live and on Zoom on June 25, 2025, representatives from Qnity (formerly DuPont Electronics), DuPont, and Insulectro discussed the evolving landscape of flexible circuit materials. From strategic corporate changes to cutting-edge polymer films, the session offered deep insight into design challenges, reliability, and next-gen solutions shaping the electronics industry.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Gorilla Circuits Elevates PCB Precision with Schmoll’s Optiflex II Alignment System
06/23/2025 | Schmoll MaschinenGorilla Circuits, a leading PCB manufacturer based in Silicon Valley, has enhanced its production capabilities with the addition of Schmoll Maschinen’s Optiflex II Post-Etch Punch system—bringing a new level of precision to multilayer board fabrication.
Day 1: Cutting Edge Insights at the EIPC Summer Conference
06/17/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) Summer Conference took place this year in Edinburgh, Scotland, June 3-4. This is the second of three articles on the conference. The other two cover the keynote speeches and Day 2 of the technical conference. Below is a recap of the first day’s sessions.