The Shaughnessy Report: Zee Plane! Zee Plane!
Target Condition: Distribution of Power—Denounce the Ounce
Fresh PCB Concepts: Resilience and Renewal in Domestic PCB Manufacturing
Mentor Webinar May 26: Customizing DDR4 Designs for Cost and Performance
May 21, 2020 | Mentor, a Siemens businessEstimated reading time: Less than a minute
Designers often rely on guidelines provided by controller vendors to drive PCB layout, but following those rules isn’t always possible. DDR layout guidelines can also drive up a board’s manufacturing costs, because they tend to be conservative. Dedicated SI experts have long used pre-layout simulation to develop their own layout rules that optimize design margin and cost for their particular applications, but SI experts are a scarce resource in most organizations.
This webinar will discuss the different design variables that can affect DDR design margin, and show how board and system designers can use HyperLynx pre-layout simulation to develop layout rules that will optimize design margins and minimize cost.
What Attendees Will Learn
- Designing a stackup to meet impedance requirements
- Balancing inter-trace spacing against impedance and crosstalk
- Balancing drive strength and inter-trace spacing against crosstalk
- Using simulation to derive board-level layout rules
- Predicting design operating margins before layout
- Optimizing drive strength and receiver ODT settings
Date/Time
Tuesday, May 26, 2020
2 PM US/Eastern
2 PM Europe/London
10 AM Asia/Singapore
To register, click here.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Advanced Electronics Packaging Digest: Third Issue Arrives November 17
11/12/2025 | I-Connect007The third issue of Advanced Electronics Packaging Digest launches Monday, November 17. This issue continues AEPD’s mission to deliver forward-looking analysis and insider perspectives on the technologies reshaping advanced electronics packaging. Among the highlights is a review of IMPACT 2025, where discussions on component-to-system-level integration took center stage as experts explored the challenges and breakthroughs driving advanced packaging technologies.
Electronic Design Automation (EDA) Market Size to Reach $811.1 Million by 2030
11/12/2025 | PRNewswireThe Global Electronic Design Automation (EDA) Market was estimated to be worth USD 541 Million in 2023 and is forecast to a readjusted size of USD 811.1 Million by 2030 with a CAGR of 6.4% during the forecast period 2024-2030.
The Technical Backbone of an EMS Company: A CEO’s Perspective
11/12/2025 | Jay Rupani, Precision PCBAs the CEO of an EMS company, I often say that our business runs on precision, innovation, and trust. Behind every finished product—whether it’s a medical device, an automotive control module, or a consumer gadget—lies a sophisticated technical ecosystem that makes it all possible. From design support and process engineering to automation, data analytics, and supply chain integration, the technical side of EMS is where our value truly shines.
ASE Unveils IDE 2.0 – AI-Enhanced Platform Accelerates Package Design Accuracy and Innovation
11/12/2025 | ASE GroupAdvanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd., announced the launch of IDE 2.0, a major upgrade to its Integrated Design Ecosystem™ (IDE) platform.
Alpha Insights, Performance by Design: Understanding Heat at the Core of Every Design
11/11/2025 | Team Alpha -- Column: Alpha Insights: Performance by DesignPower isn’t just about current. It’s about control. As electronic systems grow smaller and faster, every amp and every layer generates a new source of heat. That heat is more than a byproduct. It’s a measure of efficiency, a benchmark of performance, and often the first indication of failure.