José Servin Receives IPC Dieter Bergman Fellowship Award

Reading time ( words)

The Dieter Bergman IPC Fellowship Award is given to individuals who have fostered a collaborative spirit, made significant contributions to standards development, and have consistently demonstrated a commitment to global standardization efforts and the electronics industry. Each recipient will be eligible to bestow the Dieter Bergman Memorial Scholarship upon the university or college of his/her choice.

José Servin has worked as an IPC member for more than 14 years in the development of the Electronics Assembly Norms. As a member of the IPC A-610 and J STD-001 working groups, he became chairman of IPC A-610G and J STD-001G Automotive Addendums that complements the norms for automotive industry since 2018. He holds MSc and Ph.D. degrees in soldering materials from the Autonomous University of the State of Morelos. Now, he is a Level 3 Senior Process Engineer at Vitesco, Cuautla, Mexico. He has worked in electronics assemblies for more than 16 years in SMT, BE, and electronics component manufacturing.

Patty Goldman: José, congratulations on receiving the Dieter Bergman Fellowship Award. It’s quite an achievement. What was it like to get that phone call from John Mitchell?

José Servin: It was a surprise. I didn’t expect it. I thought he wanted to talk maybe about the committees, or any additional support, something like that. I never thought that it was about the award. It was a very great surprise, and it’s very nice.

Goldman: Dieter Bergman was a tireless worker and apparently, you are also.

Servin: Certainly, I like to work. Also, I like doing what I do in IPC.

Goldman: Please, tell us about your involvement at IPC.

Servin: My history with IPC started in 2008 or 2009. I don’t really remember the first time that I visited IPC committees. I got the invitation from Constantino Gonzalez who was the chairman for IPC-A-610 at that time. I knew him because he was giving a training course in our company. He mentioned his IPC involvement. For me, it was quite interesting, so I told my boss that it would be a great opportunity to participate in IPC meetings.

I have to be sincere. In the beginning, I was a little shy because my first language is not English. I know the IPC committees are very strong especially when there is a lot of discussion, and everything is going fast. In the beginning, I was quiet. I sat in the back of the room trying to catch everything, making my notes. And, of course, I did try to give some contribution, such as writing emails or sending the proposals. For me, it was a great experience.

Little by little, I started my involvement in IPC. I began to know people there, and to expand my network, I would say. I met people from NASA and the military, for example. I never thought I would meet people from NASA, the Army, and from several universities in the U.S. Also, we talked about the similar issues, similar topics, something that we have in production, something that we have in the company.

This allowed me to grow from both a professional and personal point of view. I have met and right now have very good friends on the committees, so it’s very, very satisfying. I had the chance to make some contributions, for example, to include something specifically for the automotive industry in IPC. This discussion was maybe a couple of years ago, and finally, IPC had agreed to participate in this addendum. To me, it was also a nice surprise that I was appointed as chairman. It was very hard work at that time. Right now, we have a very good spec as a result. Many people are happy around the world because we included missing criteria, new components, and so on.

To read this entire interview, which appeared in the Real Time with... IPC APEX EXPO 2022 Show & Tell Magazine, click here.


Suggested Items

The First India Pavilion

12/19/2022 | Gaurab Majumdar, IPC
For the first time, IPC APEX EXPO will host an “India Pavilion,” showcasing 16 Indian companies promoting India’s electronics manufacturing capabilities. The initiative was undertaken by the Ministry of Commerce & Industry, Government of India, and implemented by the Indian government agency, Electronics and Computer Software Export Promotion Council (ESC) India.

Working on the Hill to Build a Future

11/08/2022 | Nolan Johnson, I-Connect007
The message can’t be emphasized enough: Producing IC substrates overseas weakens America’s position and national security. In this frank discussion with Will Marsh, president of PCBAA, he talks about his efforts to educate government policymakers on the dire need to consider the entire microelectronics ecosystem. There’s power in numbers, Will says, and he sees the association’s efforts making a difference.

Advanced Packaging Gets an Additive Upgrade

11/08/2022 | Art Wall, NextFlex
The recent approval of the CHIPS Act has reignited the U.S. semiconductor industry and shone a spotlight on the intricacies involved in chip manufacturing. As new technological innovations—such as 5G, IoT, AI, automotive and high-performance computing—come to market, they’re pushing chip manufacturing and integration capabilities. They demand more performance which leads to added complexity in an already extremely complicated process. All this requires a fundamental shift in the way that semiconductors are manufactured and integrated.

Copyright © 2023 I-Connect007 | IPC Publishing Group Inc. All rights reserved.