I-Connect007 Editor’s Choice: Five Must-Reads for the Week

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Where did the year go? I can’t believe we’re planning our January and February issues now. It was 84 degrees most of last week in Atlanta, and now it’s 31. I guess I should take my Hawaiian shirts out of rotation!

This week we have quite a variety of articles for you. It’s officially show time and the industry is back in business in a major way. We have some news coming out of last week’s advanced packaging event in Washington, D.C., and an article about navigating SMTA International, which opens on Halloween this year in Minneapolis. 

We have a great column on avoiding EMI with good routing strategies, and an article on electrically conductive inks. To top it off, I-Connect007 has published a new book, written by Matt Stevenson of Sunstone Circuits, that posits a new “design for”: Designing for Reality. If you’re a designer, isn’t designing for reality what it’s all about? 

See you next time.

Sunstone and I-007eBooks Launch Book on Designing for Reality 
Published October 20

There are probably a dozen “design fors” floating around now, with DFM being ubiquitous at this point. But this new I-Connect007 book cuts right to the chase with a new acronym: The Printed Circuit Designer’s Guide to… Designing for Reality. Sunstone’s Matt Stevenson takes designers through the reality of the PCB fab process. Matt basically says, “Here’s what works, and here’s what doesn’t. Let’s go.” Check it out.  

IPC Symposium: U.S. Must Address Critical Gaps in Advanced Packaging Needs 
Published October 12

As fictional NASCAR driver Ricky Bobby so eloquently put it, “If you ain’t first, you’re last.” When it comes to advanced substrate packaging, North America is definitely not in first place. As Jan Vardaman explains, last week’s IPC Advanced Packaging Symposium in Washington, D.C., represented a call to action. Speakers from across the electronics industry and various branches of the U.S. government addressed this gap in the supply chain which threatens our ability to develop the most cutting-edge fighter planes and weaponry. We’ll keep a watch on this situation.

Time to Go ‘Exploring’ at SMTA International 
Published October 19

If you’re getting ready for SMTA International, don’t miss this. Editor Michelle Te has a handy-dandy article that covers how to use the SMTAI 2022 Passport. Ambassador Exhibitors on the show floor will discuss their companies’ technology and stamp your passport, and the most active Explorers and most popular Ambassadors can win various prizes. Grab your pith helmet and start exploring.

Market and Tech Convergence: Electrically Conductive Inks 
Published October 17

In this article, Stan Farnsworth of NovaCentrix discusses the development of electrically conductive inks. Now in use in everything from smartphones and medical devices to cars and space suits, these inks can be configured by the OEM and applied in a variety of ways. Stan explains what all this means to designers and fabricators on the cutting edge.

Beyond Design: Routing Strategies to Minimize Radiation 
Published October 19

If you’re a designer or design engineer wrestling with EMI issues, this Barry Olney column is just for you. Barry explains how good routing practices can save up to 10 dB of substrate radiation. He addresses things like fanout, mark-to-space ratios, and flight time for microstrip vs. stripline. In case this topic isn’t your strongest suit, Barry summarizes your best way forward. Don’t miss it.






Suggested Items

Integra: Redefining Die Prep in the U.S.

01/25/2023 | Matt Bergeron, Integra
Integra is one of the largest and most experienced semiconductor die prep, assembly, test, and qualification facilities in the United States, with locations in both Wichita, Kansas, and Silicon Valley. At the recent IPC Advanced Packaging Symposium, Integra was invited to present information about how we meet our customers’ specific needs.

IPC APEX EXPO 2023: Face-to-Face Not Mask-to-Mask

01/25/2023 | Pete Starkey, I-Connect007
It was a bright, sunny California day as IPC APEX EXPO officially opened its doors on Tuesday, Jan. 24 at the San Diego Convention Center. The Technical Conference began on the same day, while the program of standards meetings and professional development courses had been in progress since Saturday, Jan. 21. During the hustle and bustle of the show build-up over the weekend, it was clear to see that so many exhibitors had the confidence to bring so much major equipment and to invest in such spectacular booths to display it.

The Nuts and Bolts of Advanced Packaging

01/24/2023 | I-Connect007 Editorial Team
The I-Connect007 Editorial Team asked IPC Chief Technologist Matt Kelly: Will you help us understand what advanced packaging means? This informative conversation touched on topics for both assembly and board fabrication. To that end, we will present this conversation in two parts. In this issue of SMT007 Magazine, Matt helps define not only what advanced packaging is, but the approach EMS companies must take when looking ahead. Think it’s about just adding some new equipment and software? Think again. There are logistics, onboarding, and so much more.

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