Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

IMAPS & IPC to Host Onshoring Workshop

04/16/2024 | IPC
The International Microelectronics Assembly and Packaging Society (IMAPS) and IPC will host an Onshoring Workshop to discuss ongoing progress and forward-looking strategies to drive the Onshoring Advanced Packaging and Assembly, April 29 – May 1, 2024, in Arlington, Virginia.

Emerging Engineers Get Formal Introduction to IPC APEX EXPO 2024

04/12/2024 | Hannah Grace
While IPC APEX EXPO didn’t officially cut the ribbon until Tuesday, several events were already taking place over the previous weekend. Anticipation was running high among professionals eager to explore the latest innovations. Among the highlights of the first day was the Emerging Engineer Reception, which shined a spotlight on the program designed for students and young professionals. This gathering provided a platform for guests to network and mingle, which fostered connections between seasoned industry experts and bright, enthusiastic newcomers.

IPC APEX EXPO 2024 Day 2: A Focus on Workforce Development

04/11/2024 | I-Connect007 Editorial Team
Solving workforce development issues seemed to be a common theme among many conversations during the second day of IPC APEX EXPO 2024 in Anaheim, California. In his keynote address, “The Future of the Human Workforce: Maximizing Potential in an Automated World,” IPC President and CEO Dr. John W. Mitchell discussed the rapidly evolving workforce climate.

IPC Publishes Comprehensive Strategy to Address Electronics Industry’s Global Workforce Challenge

04/10/2024 | IPC
One of the most difficult and urgent challenges facing the electronics industry is a chronic shortage of adequately skilled workers. Today, IPC unveiled an expansion of its strategy to address the workforce challenges of the U.S. electronics manufacturing industry and called on its more than 3,000 member companies to join in the effort.

Quectel Introduces Versatile BG95-S5 NTN Satellite Communication Module

04/09/2024 | BUSINESS WIRE
Embedded World - Quectel Wireless Solutions, a global IoT solutions provider, today announces the launch of the Quectel BG95-S5 3GPP non-terrestrial network (NTN) satellite communication module. The module supports 3GPP Release 17 IoT-NTN in the S and L band frequencies for satellite communications. In addition, the multi-mode BG95-S5 supports LTE Cat M1, Cat NB2, eGPRS and integrated GNSS.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in