ICD Releases 2015 Version of the ICD Stackup and PDN Planner
July 1, 2015 | In-Circuit Design Pty LtdEstimated reading time: 1 minute

In-Circuit Design Pty Ltd (ICD), Australia, developer of the ICD Stackup and PDN Planner software, has released the 2015 version of their popular software.
Impedance plots have been incorporated into this new release. “The impedance plots are simulated by multiple passes of the field solver (in the background) to create heads-up graphs of how to adjust the particular variables to achieve the target impedance.” said Barry Olney, CEO.
Further, with the addition of Panasonic Megtron 7 E-glass and Low Dk-glass (34MHz) the dielectric materials library has been increased to an impressive 16,700 ready-to-use materials up to 100GHz. There are also over 5,250 capacitors, derived from SPICE models, in the PDN library.
The IPC-2581B format, bi-directional interface has now been thoroughly tested by the IPC-2581 Consortium. “This new feature gives the ICD Stackup Planner the ability to import/export Cadence Allegro 16.6 and OrCAD 16.6 stackups and to import Altium Designer and Zuken CR-8000 & CR-5000 stackups” said Olney.
Existing support customers are advised to contact ICD to obtain download instructions for both the new software and the 2015 license server. Owners of a previous version may upgrade at an affordable price.
About In-Circuit Design Pty Ltd
In-Circuit Design Pty Ltd, based in Australia, developed the ICD Stackup and PDN Planner software, is a PCB Design Service Bureau and specialist in board level simulation. For further information or to download a free evaluation of the software, please go to www.icd.com.au
All trademarks are trademarks of their respective owner.
Suggested Items
Indium to Feature Materials Solutions for Semiconductor Packaging and Assembly at ECTC
05/22/2025 | Indium CorporationIndium Corporation®, an industry leader in innovative materials solutions for semiconductor packaging and assembly, will feature its lineup of high-reliability products at the Electronics Component and Technology Conference (ECTC), taking place May 27-30 in Dallas, Texas.
HBM4 Raises the Bar on Manufacturing Complexity, Premium Expected to Exceed 30%
05/22/2025 | TrendForceTrendForce's latest findings reveal that demand for AI servers continues to accelerate the development of HBM technologies, with the three major suppliers actively advancing their HBM4 product roadmaps.
Siemens Democratizes AI-driven PCB Design for Small and Medium Electronics Teams
05/21/2025 | SiemensSiemens Digital Industries Software announced today that it is making its AI-enhanced electronic systems design technology more accessible to small and mid-sized businesses (SMB) with PADS™ Pro Essentials software and Xpedition™ Standard software.
Zuken Launches CR-8000 2025 with AI-Enhanced Support for High-Speed, High-Density PCB Design
05/21/2025 | ZukenZuken, a global leader in electronic design automation (EDA) solutions, has announced the release of the 2025 updates to its flagship PCB design applications, CR-8000 Design Gateway and Design Force.
Global PCB Connections: Rigid-flex and Flexible PCBs—The Backbone of Modern Electronics
05/20/2025 | Jerome Larez -- Column: Global PCB ConnectionsIn the past decade, flex and rigid-flex PCB technology has become the fastest-growing market segment. As an increasing number of PCB companies develop the capabilities to fabricate this technology, PCB designers are becoming comfortable incorporating these designs into their products.