Elementary Mr. Watson: Chasing Checkmarks, Not Signal Integrity
Target Condition: Rethinking the PCB Stackup Recipe
Connect the Dots: Evolution of PCB Manufacturing—Lamination
ICD Releases 2015 Version of the ICD Stackup and PDN Planner
July 1, 2015 | In-Circuit Design Pty LtdEstimated reading time: 1 minute
In-Circuit Design Pty Ltd (ICD), Australia, developer of the ICD Stackup and PDN Planner software, has released the 2015 version of their popular software.
Impedance plots have been incorporated into this new release. “The impedance plots are simulated by multiple passes of the field solver (in the background) to create heads-up graphs of how to adjust the particular variables to achieve the target impedance.” said Barry Olney, CEO.
Further, with the addition of Panasonic Megtron 7 E-glass and Low Dk-glass (34MHz) the dielectric materials library has been increased to an impressive 16,700 ready-to-use materials up to 100GHz. There are also over 5,250 capacitors, derived from SPICE models, in the PDN library.
The IPC-2581B format, bi-directional interface has now been thoroughly tested by the IPC-2581 Consortium. “This new feature gives the ICD Stackup Planner the ability to import/export Cadence Allegro 16.6 and OrCAD 16.6 stackups and to import Altium Designer and Zuken CR-8000 & CR-5000 stackups” said Olney.
Existing support customers are advised to contact ICD to obtain download instructions for both the new software and the 2015 license server. Owners of a previous version may upgrade at an affordable price.
About In-Circuit Design Pty Ltd
In-Circuit Design Pty Ltd, based in Australia, developed the ICD Stackup and PDN Planner software, is a PCB Design Service Bureau and specialist in board level simulation. For further information or to download a free evaluation of the software, please go to www.icd.com.au
All trademarks are trademarks of their respective owner.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Mouser Electronics Celebrates Its 2025 Best-in-Class Award Winners
10/01/2025 | BUSINESS WIREMouser Electronics, Inc., the New Product Introduction (NPI) leader™ empowering innovation, is pleased to announce the 2025 recipients of the Mouser Best-in-Class Awards.
Elementary Mr. Watson: Chasing Checkmarks, Not Signal Integrity
10/01/2025 | John Watson -- Column: Elementary, Mr. WatsonFor the September 2025 issue of Design007 Magazine on signal integrity, I explored how the PCB is similar to a military obstacle course: walls that sap energy like impedance mismatches, barbed wire that cuts like crosstalk, and mud pits that drag a signal down like attenuation. The takeaway was clear that a PCB is not a flat drawing; it's an electromagnetic ecosystem filled with hazards that test every signal that dares to cross it. The real danger lies not in the obstacles themselves, but in the fact that many designers never see them.
Target Condition: Rethinking the PCB Stackup Recipe
10/01/2025 | Kelly Dack -- Column: Target ConditionMarie Antoinette is attributed with saying, “Let them eat cake,” but historians now agree she likely never said it. It was probably revolutionary propaganda to paint her as out of touch with the starving masses. Yet, the phrase still lingers, and oddly enough, it applies to the world of PCB design.
Connect the Dots: Evolution of PCB Manufacturing—Lamination
10/02/2025 | Matt Stevenson -- Column: Connect the DotsWhen I wrote The Printed Circuit Designer's Guide to...™ Designing for Reality, it was not a one-and-done effort. Technology is advancing rapidly. Designing for the reality of PCB manufacturing will continue to evolve. That’s why I encourage designers to stay on top of the tools and processes used during production, to ensure their designs capitalize on the capabilities of their manufacturing partner.
Siemens, ASE Collaborate on Workflows for ASE’s VIPack Advanced Packaging Platform
09/25/2025 | SiemensSiemens Digital Industries Software announced that it is collaborating with Advanced Semiconductor Engineering, Inc. (ASE), the leading global provider of semiconductor manufacturing services in assembly and test, to develop 3Dblox-based workflows for the ASE VIPack™ platform using Siemens’ Innovator3D IC™ solution, which is fully certified for the 3Dblox standard..