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This free seminar will discuss the new features included in Keysight’s EEsof EDA simulation tools and how the software helps engineers focused on high-speed digital electronics solve their toughest design challenges. The seminar will look at all stages of the pre-layout, post-layout and measurement design flow.
Tools featured in the seminar include: ADS, ADS Controlled Impedance Line Designer (CILD), SI S-parameter analysis tools, and the ADS PCIe and USB test benches used with Keysight real-time oscilloscope certified test compliance software.
Attendees also will see a preview of the new power integrity PI Pro simulator with IR drop and decoupling capacitor optimization, available in upcoming release of ADS 2015.09. Registration is required to attend.
July 14 and July 16
Agilent Technologies, 5301 Stevens Creek Boulevard, Santa Clara, CA, the Aristotle Room.
To register, click here. For additional information, visit www.keysight.com/find/eesof.
Greg Ziraldo, Advanced Assembly
When considering the long-term reliability of a PCB, you must take into account any vias on your board. While an invaluable and essential part of board design, vias introduce weaknesses and affect solderability. This article will discuss vias, the potential concerns that are introduced into your board through their implementation, and how to minimize those concerns to acceptable levels.
Andy Shaughnessy, Design007 Magazine
In a recent survey, we asked the following question: What are your biggest problems related to flex design? Here are a few of the answers, edited slightly for clarity.
I-Connect007 Editorial Team
As a field applications engineer at TTM Technologies, which has fabrication and manufacturing locations around the world, Julie Ellis sees a wide variety of customer design requirements. In this interview with the I-Connect007 Editorial Team, Julie explains how PCB designers can influence the development of the PCB. She shares a variety of tips and tricks that designers can implement early in the design process to help optimize fabrication and assembly later on and keep small issues from becoming big problems downstream.