This guide from MKS introduces the Optimize the InterconnectSM (OTI) approach, a unified methodology for forming reliable microvias in HDI PCBs and package substrates. By synchronizing surface treatment, laser drilling, and plating chemistry, OTI enhances via reliability, performance, and manufacturing efficiency. Key microvia quality metrics include dimensional precision, wall cleanliness, adhesion strength, and stress tolerance.
The OTI process integrates steps like oxide treatment, CO₂ laser drilling, desmear, electroless copper seeding, electrolytic plating, and optional via filling. Real-world applications show improved conductivity, thermal dissipation, and laser productivity through innovations like square vias and oxide-enhanced laser absorption.
Technical insights on energy transfer and laser-material interaction underscore OTI’s precision. Benefits include improved performance, reliability, design flexibility, and reduced processing time.
The OTI process integrates steps like oxide treatment, CO₂ laser drilling, desmear, electroless copper seeding, electrolytic plating, and optional via filling. Real-world applications show improved conductivity, thermal dissipation, and laser productivity through innovations like square vias and oxide-enhanced laser absorption.
Technical insights on energy transfer and laser-material interaction underscore OTI’s precision. Benefits include improved performance, reliability, design flexibility, and reduced processing time.
