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U.S. Manufacturing Jobs Decline Amid Tariffs and Immigration Crackdown

Manufacturers in the U.S. are cutting jobs even as President Donald Trump pushes policies he says will revitalize the industry. Employers shed 12,000...
Blaize, Technology Control Company Partner to Power Saudi Arabia’s Next-Generation AI Innovation Infrastructure

Blaize Holdings, Inc., a leader in programmable, energy-efficient edge AI computing, and Technology Control Company (TCC), a leading technology...
MegaChips, Acumino Establish Demonstration Environment in Japan

MegaChips Corporation and Acumino Inc. are pleased to announce the completion of Japan's first demonstration environment for experiencing Acumino's...
CoreWeave Posts £1.5 Billion Commitment to Power UK AI Innovation and Growth Through Sustainable Computing

CoreWeave, Inc. the AI Hyperscaler™, announced the next £1.5 billion phase of its investment in AI data centre capacity and operations in the...
Accelerating Embedded Innovation: Orthogone Becomes Texas Instruments Design Partner

Orthogone Technologies Inc., a leader in advanced embedded systems and FPGA development, is proud to announce its official designation as a Texas...
BLT Joins Microchip Partner Program as Design Partner

BLT, a U.S.-owned and operated engineering design services firm announced it has joined the Microchip Design Partner...
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U.S. Manufacturing Jobs Decline Amid Tariffs and Immigration Crackdown
September 17, 2025 | I-Connect007 Editorial Team
Blaize, Technology Control Company Partner to Power Saudi Arabia’s Next-Generation AI Innovation Infrastructure
September 17, 2025 | BUSINESS WIRE
MegaChips, Acumino Establish Demonstration Environment in Japan
September 17, 2025 | BUSINESS WIRE
CoreWeave Posts £1.5 Billion Commitment to Power UK AI Innovation and Growth Through Sustainable Computing
September 17, 2025 | BUSINESS WIRE
Accelerating Embedded Innovation: Orthogone Becomes Texas Instruments Design Partner
September 17, 2025 | PRNewswire
BLT Joins Microchip Partner Program as Design Partner
September 17, 2025 | BUSINESS WIRE
GlobalFoundries Joins World Economic Forum’s Global Lighthouse Network for Manufacturing Excellence
September 17, 2025 | GlobalFoundries
STMicroelectronics to Advance Next-generation Chip Manufacturing Technology with New PLP Pilot Line in Tours, France
September 17, 2025 | STMicroelectronics
Global Notebook Shipments to Grow 2.2% in 2025 as Southeast Asia Production Capacity Expands
September 17, 2025 | TrendForce
Too Important to Ignore: Unpacking Advanced Packaging for AI Semiconductor – Report Summary
September 16, 2025 | Futurum
Advanced Electronics Packaging
Too Important to Ignore: Unpacking Advanced Packaging for AI Semiconductor – Report Summary
September 16, 2025 | Futurum
Global Interposer Market to Surge Nearly Fivefold by 2034
September 15, 2025 | I-Connect007 Editorial Team
Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
September 15, 2025 | Michael Carano, Trouble in Your Tank
Advanced Packaging-to-Board-Level Integration: Needs and Challenges
September 15, 2025 | Devan Iyer and Matt Kelly, Global Electronics Association
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
September 12, 2025 | EV Group
U.S. CHIPS Act Funding Detailed on SIA Website
September 12, 2025 | Nolan Johnson, I-Connect007
SkyWater Completes Acquisition of Fab 25, Expanding U.S. Pure-Play Foundry Capacity for Critical Semiconductor Technologies
September 12, 2025 | SkyWater
Direct Imaging System Market Size to Hit $4.30B by 2032, Driven by Increasing Demand for High-Precision PCB Manufacturing
September 11, 2025 | Globe Newswire
Deca, Silicon Storage Technology Announce Strategic Collaboration to Enable NVM Chiplet Solutions
September 11, 2025 | Microchip Technology Inc.
Edge AI Hardware Market to Surpass $20.4 Billion by 2034
September 11, 2025 | Global Market Insights Inc.
Spotlight on India Featuring:
- Building Electronics Excellence in India with David Bergman
- India: A Rising Exporter Still Dependent on Global Inputs by the Global Electronics Association
- Cyient DLM, A Voice From the Frontlines by Arpita Das
- IPC Certification Growth and Standards Engagement in India by Gauraub Majumdar
- India’s Aerospace and Defense Engineered for Power, Driven by Electronics by Gauraub Majumdar
- IEMI 2026 Bengaluru: Shaping the Next Era of Electronics by Arpita Das
Advancing the Advanced Materials Discussion Featuring:
- Driving Next-generation PCB Performance With Ventec Materials by Pesh Patel
- New Laminate Materials to Meet Today’s Challenges by Chris Hunrath
- Is Glass Finally Coming of Age? by Nolan Johnson
- Low-loss, Low-CTE Materials Driving the Future by Kirk Thompson
- Engineering Breakthroughs in High-frequency Circuit Materials by John Coonrod
- Jiva Leading the Charge Toward Sustainable Innovation with Steve Driver
Signal Integrity Featuring:
- Staying on Top of Signal Integrity Challenges, with Kris Moyer
- Slaying Signal Integrity Villains, by Barry Olney
- Running the Signal Gauntlet, by John Watson
- Understanding Signal Integrity, the Foundation of High-speed Digital Design, by Stephen V. Chavez
- Signal Integrity: A Game of Margins, with Al Neves
- Rethinking the PCB Stackup Recipe, by Kelly Dack
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