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Breaking News: On the Line With… Podcast: UHDI and RF Performance
I-Connect007 is excited to announce the release of a new episode in its latest On the Line with... podcast series, which shines a spotlight on one of...
Technica USA Advocates for PCBAA Membership Among Printed Circuit Assembly Customers

Technica USA is actively encouraging its printed circuit assembly customers to join the Printed Circuit Board Association of America (PCBAA), a...
TTCI and The Training Connection Strengthen Electronics Manufacturing with Test Services and Training at PCB West 2025

The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will...
Alternative Manufacturing, Inc. (AMI) Announces Commitment to Excellence in Industrial, Defense, Aerospace, Renewables, and Robotics Markets

Alternative Manufacturing, Inc. (AMI), a 100% employee-owned contract manufacturer, proudly reaffirms its leadership in the electronics manufacturing...
SMTA 'Members of Distinction' Awards Announced

The SMTA is proud to honor the 2025 “Members of Distinction” award recipients who have shown exceptional dedication to the association and the electronics manufacturing...
TRI Technology Collaboration with ITRI highlighted at SEMICON Taiwan

Test Research, Inc. joined the Ministry of Economic Affairs (MOEA) Pavilion at SEMICON Taiwan 2025, where its collaborative technology with the...
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Curing and Verification in PCB Shadow Areas
September 17, 2025 | Doug Katze, Dymax

Design engineers know a simple truth that often complicates electronics manufacturing: Light doesn’t go around corners. In densely populated PCBs, adhesives and coatings often fail to fully cure in shadowed regions created by tall ICs, connectors, relays, and tight housings.
Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
September 17, 2025 | Nash Bell, Knocking Down the Bone Pile

Electronic component salvaging is the practice of recovering high-value devices from PCBs taken from obsolete or superseded electronic products. These components can be reused in new assemblies, reducing dependence on newly purchased parts that may be costly or subject to long lead times.
MORE ARTICLES
Global Citizenship: Together for a Perfect PCB Solution
September 10, 2025 | Tom Yang, Global Citizenship
If there’s one thing we’ve learned in the past few decades of electronics evolution, it’s that no region has a monopoly on excellence. Whether it’s materials science breakthroughs in Europe, manufacturing efficiencies in...
Smart Automation: Odd-form Assembly—Dedicated Insertion Equipment Matters
September 9, 2025 | Josh Casper, Smart Automation
Large, irregular, or mechanically unique parts, often referred to as odd-form components, have never truly disappeared from electronics manufacturing. While many in the industry have been pursuing miniaturization, faster placement...
Nolan’s Notes: Everyone Has Their Eye on India
September 3, 2025 | Nolan Johnson, Nolan's Notes
In this issue of SMT007 Magazine, we turn our attention to the Indian EMS market. We start with an interview with David Bergman, whose foresight in the early 2000s opened doors for the Global Electronics Association to begin helping...
The Government Circuit: Navigating New Trade Headwinds and New Partnerships
August 25, 2025 | Chris Mitchell, The Government Circuit
As global trade winds continue to howl, the electronics manufacturing industry finds itself at a critical juncture. After months of warnings, the U.S. Government has implemented a broad array of tariff increases, with fresh duties...
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- Building Electronics Excellence in India with David Bergman
- India: A Rising Exporter Still Dependent on Global Inputs by the Global Electronics Association
- Cyient DLM, A Voice From the Frontlines by Arpita Das
- IPC Certification Growth and Standards Engagement in India by Gauraub Majumdar
- India’s Aerospace and Defense Engineered for Power, Driven by Electronics by Gauraub Majumdar
- IEMI 2026 Bengaluru: Shaping the Next Era of Electronics by Arpita Das