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The Printed Circuit Designer's Guide to... ™
DFM Essentials

by: Anaya Vardya, CEO
American Standard Circuits
ASC Sunstone Circuits

One of the biggest challenges facing printed circuit board designers is not understanding the cost drivers in the PCB manufacturing process, particularly the manufacturing of advanced technology PCBs. Design for Manufacturing (DFM) is defined as the practice of designing printed circuit boards that meet not only the capabilities of the customer’s assembly manufacturing process but also the capabilities of the board fabrication process to provide the highest reliability at the lowest possible cost. The guidelines offered in this book are based on both ASC recommendations and IPC standards with the understanding that some may require adjustment based on the material set, fabricator processes, and other design constraints.


ISBN: 978-1-959894-14-8
ISBN: 978-1-959894-17-9 Print-on-demand

Anaya Vardya has over 40 years in the electronics manufacturing business and is currently the president and CEO of American Standard Circuits LLC. Anaya was previously COO of Canadian-based Coretec Inc. and senior VP of operations at Merix (both now part of TTM). He was also the corporate development manager at Continental Circuits, and before that, he held a variety of management and non-management positions in IBM Endicott and IBM Austin. Anaya holds a master’s degree in chemical engineering from the University of Cincinnati and a bachelor of technology from the Indian Institute of Technology.

About American Standard Circuits

In the world of DFM, American Standard Circuits and Sunstone Circuits come together as a unified PCB manufacturing powerhouse with over 50 years of combined experience. Together, they offer a comprehensive range of solutions and excel in producing ultra HDI, rigid, metal-backed, RF/microwave, flex, and rigid-flex PCBs for various industries, ranging from industrial to aerospace/defense.

This strategic alliance represents their dedication to delivering exceptional products and simplifying the PCB procurement process. By merging their strengths, they have set a groundbreaking standard in PCB manufacturing, providing engineers with the ultimate PCB solution for everything from design and prototypes to large-scale production, all based on the principles of Design for Manufacturability.

The company’s impressive certifications and advanced technology expertise reflect its commitment to excellence. They prioritize unparalleled customer support, ensuring that clients' needs are always met with precision and care.

This book has been technically reviewed by the following experts:

Kris Moyer Instructor, IPC

Kristopher Moyer is a distinguished PCB design expert with over 30 years of experience, boasting a portfolio of over 1000 PCB designs. With an educational background that includes an AS in electrical engineering from ITT Technical Institute and a BS in computer engineering from California State [...]

Dana Korf Principal Consultant, Korf Consultancy LLC

Currently the principal consultant at Korf Consultancy LLC, Dana Korf works with companies to improve PCB fabricator front-end engineering processes. Dana is AME standards manager at Nano Dimension. He also works with OEMs and ODMs to create design rules and technology roadmaps, assist with supplier [...]

Chapter Summaries

  • Chapter 1

    Materials

    This chapter details high-frequency materials, copper foil types, metal core PCBs, and the benefits of embedded capacitance and resistor materials in multilayer PCBs.

  • Chapter 2

    Panelization

    Panelization outlines placing PCBs on manufacturing panels, highlighting features like coupons, borders, and scoring to maximize material utilization and reduce costs, and detailing preferred panel sizes and modifications.

  • Chapter 3

    Controlled Impedance

    Here, the author discusses controlled impedance PCB design, covering trace structures, impedance factors, modeling software, multiple impedance considerations, guidelines to minimize costs, and testing requirements.

  • Chapter 4

    Material Construction Stackups

    PCB stackup construction, guidelines for designing multilayer boards, balanced structure requirements, signal layer recommendations, and outer and internal layer guidelines are covered.

  • Chapter 5

    Via Structures

    The author explains the roles of through-holes and microvias in PCB design, detailing their types, uses, design considerations, and formation methods, such as mechanical and laser drilling.

  • Chapter 6

    Plating Methods

    Electroless and electroplating methods for PCBs, including pattern and panel plating, design compensation, surface-to-hole plating ratio, edge plating, and breakaway tabs for PCB arrays are explained here.

  • Chapter 7

    Solder Mask and Legend

    This chapter outlines PCB solder mask applications, including clearance requirements and via capping. It covers solder mask colors, legend marking with inkjet printers, and design constraints for legibility.

  • Chapter 8

    Final Finishes and Design Guidelines

    Various PCB final finishes, their applications, pros, cons, and design guidelines are explained. Key finishes include ENIG, ENEPIG, ENIPIG, ImmAg, ImmSn, HASL, and OSP, each with unique attributes.

  • Chapter 9

    Data Package Guidelines

    Here, the reader will learn preferred and common data formats, requirements for drawing/data packages and array drawings, preferred artwork and drill data formats, and frequent critical and non-critical data issues in PCB fabrication.

  • Chapter 10

    Cost Driver Summary

    This chapter outlines cost drivers in PCB fabrication, highlighting factors like material costs, process complexities, density, and advanced technologies that impact overall cost.

Print-on-demand paperbacks are available for this title. Click below to order from our distributor.

What Our Readers Are Saying

The Companion Guide to DFM Essentials

Tips for Designing for Manufacturing is a comprehensive reference for PCB designers aiming to optimize their designs for manufacturability. It covers essential topics including preferred manufacturing data formats (like ODB++), fabrication notes, material specifications, layer stackups, controlled impedance, solder mask and surface finishes, and special requirements such as via fills and back-drilling. This guidebook also outlines common CAM issues and emphasizes early collaboration with fabricators to avoid costly design errors. Authored by American Standard Circuits and ASC Sunstone Circuits, readers will find this book reflects decades of expertise in delivering high- performance, reliable printed circuit boards.
Inside, readers will find:
  • Best practices for data formats like ODB++
  • Tips on fab notes, material selection, and stackups
  • Controlled impedance, via fills, back-drilling, and more
  • Common CAM issues and how to prevent them
  • Why early collaboration with fabricators matters






    • Contact the Author

    For technical support click here

    Kris Moyer Kristopher Moyer is a distinguished PCB design expert with over 30 years of experience, boasting a portfolio of over 1000 PCB designs. With an educational background that includes an AS in electrical engineering from ITT Technical Institute and a BS in computer engineering from California State University, Sacramento (CSUS), Kris has solidified his expertise in the field. Notably, he continues to serve as part-time faculty at CSUS, where he shares his knowledge with the next generation of engineers and is an IPC-certified master printed circuit board designer. Kris’s remarkable career is highlighted by his leadership roles within the IPC design community, including co-chairing key committees focused on land pattern and high-frequency design guides. His work extends to significant projects in military and space applications, demonstrating his capability to lead complex design endeavors, including a notable 24-layer board project. Kris's technical proficiency encompasses a deep understanding of FPGA development, mastery of design and simulation tools, and a strong foundation in environmental testing for PCBs. Beyond that, he is recognized for his contributions to PCB design standards and practices through his active involvement in numerous IPC committees and his role as an instructor and subject matter expert with IPC.

    Dana Korf Currently the principal consultant at Korf Consultancy LLC, Dana Korf works with companies to improve PCB fabricator front-end engineering processes. Dana is AME standards manager at Nano Dimension. He also works with OEMs and ODMs to create design rules and technology roadmaps, assist with supplier selection/qualification, and reduce DFM cycles. Dana previously worked in China for over seven years at Multek in Zhuhai as senior director of manufacturing engineering and NPI and at Huawei Technologies in Shenzhen as director of PCB technology where he was responsible for PCB technology ranging from mobile phones to RF antennas, base stations, and high-speed digital servers and switches; before that, he worked for Samina-SCI, HADCO, and Zycon as director of product engineering. He has been awarded the IPC President’s Award, chaired many high-speed IPC committees, and was a co-chair for the iNEMI Data Convergence project, which has become IPC-2581. Dana graduated from Washington State University with a BSEE, and he enjoys following college and professional football and golf.