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The first advanced electronics packaging conference was well received this year with an engaged audience. Matt Kelly, CTO of the Global Electronics Association says the expanded focus on component and system-level integration fosters unprecedented collaboration across the industry. Also new this year is the Design Pavilion and Technology Theater, bringing commercial value to technical discussions and highlighting the critical role of timely standards development in rapidly evolving sectors like AI and automotive.

The rapid growth of AI computing, from training clusters to inference at scale, is reshaping demand across the entire electronics supply chain. Advances in technology requirements, such as higher bandwidth, lower latency, and greater compute density, are driving the development of advanced packaging technologies and transforming the PCB industry across design, manufacturing, testing, and even architecture.

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