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The system will be installed on-premises at C-DAC’s Bengaluru center and is scheduled to be deployed in the second half of...
What’s Next for Global Electronics: A 2026 Outlook from East Asia
This is the latest entry in our ongoing blog series, where Global Electronics Association experts explore the forces shaping the future of the global...
Diamond Quanta Launches Adamantine Thermal, Advancing Packaging Roadmap Post-CES 2026
Diamond Quanta announced Adamantine Thermal™, an engineered-diamond thermal platform designed for integration into advanced packaging workflows and...
Pre-Registration Opens for Chiplet Summit, the Premier Chiplet Event
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SEMI Responds to U.S. Tariffs on Advanced Semiconductors and Critical Minerals
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Symposium Review: A Glimpse Into the Future of IC Substrates and Beyond
January 27, 2026 | Edy Yu, Editor-in-Chief, ECIO
The Hong Kong Printed Circuit Association (HKPCA) and the Korea Printed Circuit Association (KPCA), with strong support from SEMI, presented “The Future of IC Substrates and Beyond Symposium 2025” at the Sands Expo and Convention Centre in Singapore in . The event brought together elite professionals, technical experts, and corporate leaders from across the global IC substrate industry chain to explore cutting-edge trends and innovative solutions shaping the future of the sector.
Designers Notebook: Heterogeneous Interposer Design Challenge, Part 1
January 19, 2026 | Vern Solberg, Designer's Notebook
The development of monolithic (system-on-chip) ICs revolutionized the electronics industry, enabling the creation of heterogeneous products by integrating multiple active elements within the same silicon base, which includes a central processing unit (CPU), memory functions, sensors, and communication tasks.
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Rigetti Announces Order for a 108-Qubit Quantum Computer from India’s C-DAC
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