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RTW IPC APEX EXPO 2019: Uyemura Discusses Heavy Gold Deposition
February 13, 2019 | Real Time with...IPCEstimated reading time: Less than a minute
Richard DePoto, business development manager at Uyemura, brings Pete Starkey up to speed on the success of the heavy gold deposition process they discussed last year. Learn how it has been seamlessly integrated into standard ENEPIG lines to give a choice of finishes, and how advances in electroless palladium have enabled the elimination of electroless nickel for high-speed signal integrity.
To watch the interview, click here.
Suggested Items
Trouble in Your Tank: Supporting IC Substrates and Advanced Packaging, Part 5
03/19/2024 | Michael Carano -- Column: Trouble in Your TankDirect metallization systems based on conductive graphite or carbon dispersion are quickly gaining acceptance worldwide. Indeed, the environmental and productivity gains one can achieve with these processes are outstanding. In today’s highly competitive and litigious environment, direct metallization reduces costs associated with compliance, waste treatment, and legal issues related to chemical exposure. What makes these processes leaders in the direct metallization space?
All Flex Solutions Invests in New Flexible Circuit Facility
02/05/2024 | All Flex SolutionsAll Flex Solutions has started the equipment build-out of a completely new flexible circuit manufacturing facility in Minneapolis. The building was purchased in 2020, and was completely renovated to accommodate the company’s plans for a brand new state-of-the-art flexible circuit fabrication plant.
Trouble in Your Tank: Processes to Support IC Substrates and Advanced Packaging, Part 4
09/28/2023 | Michael Carano -- Column: Trouble in Your TankIn a previous column, the critical process of desmear and its necessity to ensure a clean copper surface connection was presented. Now, my discussion will focus on obtaining a void-free and tightly adherent copper plating deposit on these surfaces. After the desmear process, the task is to insure a continuous, conductive, and void-free deposit on the via walls and capture pad. Today, there are several processes that can be utilized to render vias conductive.
MKS’ Atotech to Participate in IPCA Expo 2023
09/14/2023 | MKS’ AtotechMKS’ Atotech, a leading surface finishing brand of MKS Instruments, will participate in the upcoming IPCA Expo at Bangalore International Exhibition Centre (BIEC) and showcase its latest PCB manufacturing solutions from September 13 – 15.
American Standard Circuits Now Offers ENEPIG Surface Finish
09/18/2023 | American Standard CircuitsIllinois-based PCB fabricator, American Standard Circuits, is now offering in-house ENEPIG surface finish. ENEPIG is the solution to multiple surface finish requirements within one multi metal plating operation.