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China Plus One, Part 3: Inorsen Group, a Vietnam Success Story

In recent years, Western OEMs have continued to push for China Plus One factories and the advancement of China’s Belt and Road Initiative (BRI). At present, there are two main modes for PCB companies to go global: building greenfield factories or through mergers and acquisitions (M&A). Thailand is currently the primary geographic choice to build greenfield factories, whereas, increasingly, mergers and acquisitions in Vietnam and Malaysia provide opportunities for companies to expand markets and acquire resources.

Symposium Review: Qnity, DuPont, and Insulectro Forge Ahead with Advanced Materials

In a dynamic and informative Innovation Symposium hosted live and on Zoom on June 25, 2025, representatives from Qnity (formerly DuPont Electronics), DuPont, and Insulectro discussed the evolving landscape of flexible circuit materials. From strategic corporate changes to cutting-edge polymer films, the session offered deep insight into design challenges, reliability, and next-gen solutions shaping the electronics industry.

EU Defence Electronics Ecosystem Highlighted in Brussels

In this interview, Alison James, senior director of Global Electronics Association—Europe (formerly IPC), discusses the European Defence & Security Summit in Brussels, June 9–13, as well as the first IPC–ASD Europe Defense Electronics Summit, June 10th, which brought together 70 leaders from across the electronics manufacturing supply chain. ASD is the Aerospace, Security and Defence Industries Association of Europe, and co-hosted both the larger and smaller events.

Smarter Machines Use AOI to Transform PCB Inspections

As automated optical inspection (AOI) evolves from traditional end-of-process inspections to proactive, in-line solutions, the integration of AI and machine learning is revolutionizing defect reduction and enhancing yields, marking a pivotal shift in how quality is managed in manufacturing.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

While news outside our industry keeps our attention occupied, the big news inside the industry is the rechristening of IPC as the Global Electronics Association. My must-reads begins with Marcy LaRont’s exclusive and informative interview with Dr. John Mitchell, president and CEO of the Global Electronics Association. For designers, have we finally reached the point in time where autorouters will fulfill their potential?

The Death of the Microsection

I got my start out of college grinding and polishing PCB microsections. My thumbs are a bit arthritic today because of the experience (microsection grinders know what I mean). Back then, via structures were rather large, and getting to the center in six steps of grinding and polishing was easy compared to what my team has been doing recently at the lab.

IPC Rebrands as Global Electronics Association: Interview With Dr. John W. Mitchell

Today, following a major announcement, IPC is embracing the rapid advancement of technology with a bold decision to change its name to the Global Electronics Association. This name more accurately reflects the full breadth of its work and the modern realities of electronics manufacturing. In this exclusive interview, Global Electronics Association President and CEO Dr. John W. Mitchell shares the story behind the rebrand: Why now, what it means for the industry, and how it aligns with the organization’s mission.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

It’s been a busy week in this industry, and we have news and articles from the PCB design, fabrication and assembly communities. Some of this news is out of this world. We may be losing the high ground—the really high ground. Columnist Jesse Vaughan explains how the U.S. seems to be falling behind in space, and how this could affect our ability to defend ourselves in the future. We have an update on the U.S.-China tariff talks, which seem to be moving forward, though sometimes at a snail’s pace.

New IPC VP Joe Schneider Building Stronger Focus on U.S., Canada

IPC has hired Joe Schneider as a vice president to strengthen its regional focus and address the specific needs in the U.S. and Canada. Joe brings a rich background in OEM and contract manufacturing, including with industry giants like Siemens and Abbott Laboratories. In this interview, he shares his vision for the region, which emphasizes workforce development and supply chain challenges.

The Evolution of Picosecond Laser Drilling

Is it hard to imagine a single laser pulse reduced not only from nanoseconds to picoseconds in its pulse duration, but even to femtoseconds? Well, buckle up because it seems we are there. In this interview, Dr. Stefan Rung, technical director of laser machines at Schmoll Maschinen GmbH, traces the technology trajectory of the laser drill from the CO2 laser to cutting-edge picosecond and hybrid laser drilling systems, highlighting the benefits and limitations of each method, and demonstrating how laser innovations are shaping the future of PCB fabrication.

Day 2: More Cutting-edge Insights at the EIPC Summer Conference

The European Institute for the PCB Community (EIPC) summer conference took place this year in Edinburgh, Scotland, June 3-4. This is the third of three articles on the conference. The other two cover Day 1’s sessions and the opening keynote speech. Below is a recap of the second day’s sessions.

Day 1: Cutting Edge Insights at the EIPC Summer Conference

The European Institute for the PCB Community (EIPC) Summer Conference took place this year in Edinburgh, Scotland, June 3-4. This is the second of three articles on the conference. The other two cover the keynote speeches and Day 2 of the technical conference. Below is a recap of the first day’s sessions.

Takeaways from the Keynotes at the Edinburgh EIPC Summer Conference

It was seasonably wet and windy in Edinburgh, Scotland, June 3-4, where delegates from 17 countries convened for the 2025 EIPC Summer Conference to enjoy a superlative program of 18 technical presentations over two days, plus an excursion to a whisky distillery. EIPC President Alun Morgan welcomed everyone to the Delta Hotel, reminding us that in its previous iteration, it was the Royal Scot, traditionally the annual venue of the Institute of Circuit Technology Northern Symposium.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Today is Friday the 13th, and in much of Western folklore, this is a day when bad luck is lurking. But while Friday the 13th may top Western superstition charts, the global calendar is sprinkled with its own unlucky legends. In Spain and Greece, the bad juju lands on Tuesday the 13th—a day linked to Mars, the god of war, and naturally, chaos. In Italy, it’s Friday the 17th that is feared, thanks to the Roman numeral XVII, which can be rearranged to spell VIXI—Latin for “I have lived” (a poetic way of saying you’re dead).

IPC Hall of Fame Spotlight Series: Highlighting Bob Neves

Many IPC members who have contributed significantly to IPC and our industry have been awarded the IPC Raymond E. Pritchard Hall of Fame (HOF) Award. This Hall of Fame spotlight features industry veteran Bob Neves, who joined IPC in 1986 and was inducted into the IPC Hall of Fame in 2007.

Preventing Surface Prep Defects and Ensuring Reliability

In printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Maybe you’ve noticed that I’ve been taking to social media lately to about my five must-reads of the week. It’s just another way we’re sharing our curated content with you. I pay special attention to what’s happening in our industry, and I can help you know what’s most important to read about each week. Follow me (and I-Connect007) on LinkedIn to see these and other updates.

Efficiency Unleashed: Breaking Down Lean and Six Sigma

As a child in the late 1970s, I lived near Fremont, California, the home of the GM automotive manufacturing plant. At the time, GM had a terrible reputation for producing poor quality cars that were dwindling in popularity. I toured the GM plant while in elementary school. Each child received a pair of safety glasses before our group was escorted around the plant with our teacher. I remember seeing the car pieces on the line, and workers using blow torches to assemble the car together.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

I don’t have a scorecard, but I do have a weekly wrap-up of must-reads that I think deserve another “bite of the apple,” so to speak. IPC’s Rich Cappetto shares his perspective on everything from tariffs to the CHIPS Act. Columnist Josh Casper discusses the use of AI in 3D AOI systems and the immediate benefits that AI can bring about. Columnist Anaya Vardya explains how technologies like AI can improve our customer service, as well as our manufacturing processes.

Insights Into a Differentiating Trade/Investment Global Strategy for Electronics

To better understand the U.S. administration’s actions on global trade policies earlier this spring, Barry Matties and Nolan Johnson met with Richard Cappetto, IPC’s senior director of North American government relations, who highlighted both the challenges and opportunities available to U.S. companies in the recent trade activity. This could include increased domestic manufacturing and supply chain diversification.

U.S. Holiday: Memorial Day

Memorial Day is a U.S. federal holiday dedicated to remembering and grieving for military personnel who died serving in the U.S. Armed Forces. Held on the last Monday of May, it also marks the unofficial start of summer.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

In the electronics manufacturing industry, the global PCB market is estimated to reach $86.5 billion by 2029, a 5.9% annual growth, per IPC’s Global Market Forecast, and the global new cycle is still being dominated by U.S. news. This week, we are talking about the status of the CHIPS Act and what the new tax and incentives bill does and does not include. We also take a minute for some marketing wisdom to shed light in a challenging and noisy market environment.

OKI Launches 124-Layer Circuit Board Technology

During PCB East, OKI Circuit Technology unveiled its latest innovation: a 124-layer printed circuit board. In this interview, “Dennie” Kazuo Kawahara, president of OKI Data Americas, and Eiichi Aki, sales and marketing specialist at OKI Circuit Technology, shared their insights into this feat. With plans for mass production starting in October, this board is designed for high-bandwidth memory applications, accommodating the demanding requirements of AI chips.

Key Insights on Photoresist for Defect Reduction

In PCB manufacturing, understanding the intricacies of the photoresist process is crucial for achieving high-quality results. Industry experts Josh Krick, a technical service engineer at IEC, and Tim Blair, a PCB imaging specialist at Tim Blair LLC, share their knowledge on the essential stages of photoresist application, highlight critical advancements in materials, and discuss common defects encountered during production. They share best practices and innovative solutions to enhance the manufacturing process, reduce defects, and ensure efficiency and reliability in high-tech applications.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

My picks for the week include—as a complement to the trade agreement news—SEMI's public support of a bill including new tax credit eligibility for semiconductor manufacturers. This provision feels quite similar to the current PCB investment bill that's been introduced to the current Congress; here’s hoping Congress takes a more holistic approach to electronics manufacturing. 
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