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Indium Corporation to Feature New Semiconductor Products for HIA and SiP at IMAPS Device Packaging Conference
February 29, 2024 | Indium CorporationEstimated reading time: 1 minute
As an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 20th International Conference and Exhibition on Device Packaging hosted by IMAPS, March 18‒21, in Fountain Hills, AZ.
Indium Corporation’s proven SiPaste® series is specifically designed for fine feature printing with fine powders ranging from Type 5 to Type 8. They help Avoid the Void®, reduce slumping, and demonstrate consistent superior printing performance. Indium Corporation’s SiPaste® C312HF is a new formulation offering the same excellent printing performance and material stability over time, with the benefit of having an easily cleanable chemistry with semi-aqueous or saponifier technology.
Indium Corporation’s newest jetting solder paste, PicoShot® NC-6M, is a no-clean, halogen-free material specifically formulated to be compatible with Mycronic jetting systems. Chemically compatible with award-winning Indium12.8HF solder paste, PicoShot NC-6M is optimized for small dot jetting and long-term jetting with Type 6 solder paste. PicoShot NC-6M offers the smallest dot jetting volume among similar jetting pastes, at 1.6 nL/dot. In addition to exceptional jetting performance, its unique oxidation barrier promotes complete powder coalescence during reflow to eliminate graping and similar reflow issues.
To learn more about Indium Corporation’s innovative solutions for HIA and SiP, visit our experts at booth #56 at IMAPS Device Packaging Conference.
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03/06/2024 | Green CircuitsGreen Circuits, a full-service Electronics Manufacturing Services (EMS) partner to leading OEMs, pleased to announce the expansion of its capabilities with the acquisition of the iCoat-5 JetSelect Ultra High Precision Conformal Coating Machine from Anda Technologies.
Indium Corporation Announces New Jetting Solder Paste
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SHENMAO Introduces PF606-P269J Lead-Free Paste Specially Designed for Jet Dispensing
08/11/2022 | SHENMAO America, Inc.SHENMAO America, Inc. offers PF606-P269J Lead-Free Jetting Solder Paste specially designed for the jetting process. It offers excellent workability and solderability for automatic high-speed jetting production with superior accuracy and precision.
Heraeus, perfecdos, Infotech Optimize Jetting Process of Sintering Pastes
02/25/2021 | HeraeusThe three technology companies Heraeus, perfecdos and Infotech automation have jointly developed a solution that offers their customers ideally matched components and materials for jetting sintering pastes.
Indium Corporation’s Proven Jetting Paste Recommended by NSW Automation
12/03/2020 | Indium CorporationIndium Corporation’s newest jetting and microdispensing solder paste, Indium12.8HF, has been officially recommended by NSW Automation for use with their newest microfluid dispenser, SD1.