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Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications

04/30/2024 | Indium Corporation
Indium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.

TSMC Certifies Ansys Multiphysics Platforms, Enabling Next-Gen AI and HPC Chips

04/30/2024 | PRNewswire
Ansys announced the certification of its power integrity platforms for TSMC's N2 technology full production release. Both Ansys RedHawk-SC and Ansys Totem are certified for power integrity signoff on the N2 process, delivering significant speed and power advantages for high performance computing, mobile chips, and 3D-IC designs.

TSMC Celebrates 30th North America Technology Symposium

04/29/2024 | TSMC
TSMC unveiled its newest semiconductor process, advanced packaging, and 3D IC technologies for powering the next generation of AI innovations with silicon leadership at the Company’s 2024 North America Technology Symposium.

Guerrilla RF Completes Strategic Acquisition of GaN Device Portfolio from Gallium Semiconductor

04/29/2024 | BUSINESS WIRE
Guerrilla RF, Inc. has finalized the acquisition of Gallium Semiconductor's entire portfolio of GaN power amplifiers and front-end modules. Effective April 26th, 2024, GUER acquired all previously released components as well as new cores under development at Gallium Semiconductor.

ROHM Group Company SiCrystal and STMicroelectronics Expand Silicon Carbide Wafer Supply Agreement

04/23/2024 | ROHM
ROHM and STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, announced today the expansion of the existing multi-year, long-term 150mm silicon carbide (SiC) substrate wafers supply agreement with SiCrystal, a ROHM group company.
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