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Revolutionizing PCB Prototyping With ML and AM

06/14/2024 | Nick Geddes, Nano Dimension
Historically, PCB prototyping has been a meticulous and time-consuming process, often laden with complexities and high costs. Traditional methods have typically involved intricate design iterations, extensive manual labor, and significant material waste. However, the advent of AM has revolutionized this landscape, offering a rapid, cost-effective alternative that significantly accelerates the development cycle.

Skunk Works Demonstrates AI For Air-To-Air Tactical Intercepts

06/11/2024 | Lockheed Martin
Lockheed Martin Skunk Works partnered with the University of Iowa's Operator Performance Laboratory (OPL) to demonstrate the use of artificial intelligence (AI) in air-to-air intercept scenarios.

Merlin Flex Invests in New Techwin Solder Mask Developer

05/31/2024 | Merlin Flex Ltd
Merlin Flex Continue their investment programme with the installation & commissioning of a new Techwin Solder Mask Developer. This new machine allows faster & more accurate developing in the solder mask process.

Siemens Simplifies Development of AI Accelerators for Advanced System-on-chip Designs with Catapult AI NN

05/24/2024 | Siemens
Siemens Digital Industries Software announced Catapult™ AI NN software for High-Level Synthesis (HLS) of neural network accelerators on Application-Specific Integrated Circuits (ASICs) and System-on-a-chip (SoCs). Catapult AI NN is a complete solution that starts with a neural network description from an AI framework, converts it into C++ and synthesizes it into an RTL accelerator in Verilog or VHDL for implementation in silicon.

Unique Look Behind the Scenes of AT&S Research

05/23/2024 | AT&S
The technology leader AT&S already holds almost 800 patents and is giving an insight into its R&D departments in Leoben at the “Long Night of Research” on May 24. But some things remain top secret: the new research center and Europe’s first substrate plant recently installed a high-tech machine that is unique in the world. It allows the exposure of substrate structures that are 14 times thinner than a human hair.
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