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Current IssueTechnology Roadmaps
In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
Wet Process Control
In this issue, we examine wet processes and how to obtain a better degree of control that allows usable data to guide our decisions and produce consistently higher-quality products.
Don’t Just Survive, Thrive
If we are to be relevant and prosper during these next critical decades in electronics, we must do more than survive. As an industry, we can and must thrive. In this issue, our contributors explore these concepts meant to help you take your business to the next level.
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The Plating Forum
Column from: George Milad
George Milad has 30+ years of experience in PWB manufacturing and is the national accounts manager for technology at Uyemura International Corporation. He holds a master’s degree in physical organic chemistry from the American University in Washington, D.C., 1979, is the author of the chapters on plating and surface finishing in _Printed Circuits Handbook: Seventh Edition_, and has a series of publications on electrolytic plating and metallic surface finishes. George is the recipient of the 2009 IPC President’s Award, chairs the IPC Plating Committee, and is a permanent member of the IPC Technical Activities Executive Committee.