Innovative Circuits Appoints New Plant Manager


Reading time ( words)

Innovative Circuits Inc. has announced that John Cestaric has joined the firm to further expand on it fabrication capabilities.  John comes with over 25 years of industry experience, many of which have been spent in a plant/production manager role with some of the largest board fabrication companies in the world.

John joins Innovative as plant manager and will be overseeing plant operations including both engineering and production units.   When asked about taking on this role with Innovative, John said, “I am thrilled to join a company that is a leader in high reliability, quick turn rigid-flex, flex and multilayer boards.  I look forward to working with a team of talented, passionate associates who excel in every level of the organization.”

Innovative President George Schudy said, “Innovative Circuits is very fortunate to bring someone of John’s caliber and experience to our organization, especially during this period of growth we are experiencing.  Adding John to an already strong management team will make Innovative a very attractive source for complicated rigid and rigid flex builds."

About Innovative Circuits

Innovative Circuits is a leading provider of printed circuit boards, rigid flex and flex circuits.  Since 1998 Innovative has maintained a high visibility in defense, aerospace and commercial applications with capabilities that range from the simplest single layer flex circuits to highly technical multi-layer rigid boards. Innovative’s success has been predicated on providing built in customer-centric services to insure quality throughout the fabrication process.  From concept to completion Innovative is an invaluable partner for bare board fabrication. 

Share

Print


Suggested Items

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

03/26/2021 | Andy Shaughnessy, Design007 Magazine
This week, we have a round-up of stories from around the industry, including a Real Time with… IPC APEX EXPO interview with Ventec, an article by Tamara Jovanovic about eliminating “garbage in, garbage out,” a review of an EIPC webinar by Pete Starkey, and news about another trade show going virtual this summer. And last but certainly not least, we bring you our one-minute video salute to all the fantastic people in this industry who we’ve worked with for decades. Enjoy!

Bonding Hybrid Multilayer Constructions at Rogers Corporation

03/10/2021 | Real Time with...IPC
John Ekis, Rogers Corporation's market segment director for aerospace and defense, discusses the SpeedWave family of low-dielectric constant, ultra-low-loss prepreg materials with excellent filling and bonding characteristics for hybrid multilayer constructions. SpeedWave prepreg is also compatible with FR-4 fabrication processes and lead-free PCB assembly processing. SpeedWave is available in multiple spread and open weave glass style and resin content combinations, and is also compatible with FR-4 fabrication processes and lead-free PCB assembly processing.

Focus on Smart Processes, Not Just Smart Factories

03/02/2021 | Nolan Johnson, PCB007
Nolan Johnson talks to Audra Thurston, Todd Brassard, and Meredith LaBeau about how Calumet is focusing on smart processes, and not as much on smart factories. While modern manufacturing equipment and next-gen technologies can be impressive, so much innovation still hinges on human beings. Calumet believes by investing in their workforce and instilling a culture of innovation throughout their company and supply chain, they’ll see faster advancement.



Copyright © 2021 I-Connect007. All rights reserved.